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Dive into the research topics where Andrew P. Edwards is active.

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Featured researches published by Andrew P. Edwards.


IEEE Electron Device Letters | 2014

1.5-kV and 2.2-m \(\Omega \) -cm \(^{2}\) Vertical GaN Transistors on Bulk-GaN Substrates

Hui Nie; Quentin Diduck; Brian Alvarez; Andrew P. Edwards; Brendan M. Kayes; Ming Zhang; Gangfeng Ye; Thomas R. Prunty; Dave Bour; Isik C. Kizilyalli

In this letter, vertical GaN transistors fabricated on bulk GaN substrates are discussed. A threshold voltage of 0.5 V and saturation current >2.3 A are demonstrated. The measured devices show breakdown voltages of 1.5 kV and specific ON-resistance of 2.2 mΩ-cm 2 , which translates to a figure-of-merit of V BR 2 /R ON ~1 × 10 9 V 2 Ω -1 · cm -2 .


IEEE Transactions on Electron Devices | 2015

Vertical Power p-n Diodes Based on Bulk GaN

Isik C. Kizilyalli; Andrew P. Edwards; Ozgur Aktas; Thomas R. Prunty; David P. Bour

There is a great interest in wide-bandgap semiconductor devices and most recently in monolithic GaN structures for power electronics applications. In this paper, vertical p-n diodes fabricated on pseudobulk low defect density (104-106 cm-2) GaN substrates are discussed. Homoepitaxial low-pressure metal organic chemical vapor deposition growth of GaN on its native substrate and being able to control and balance the n-type Si doping with background C impurity has allowed the realization of vertical device architectures with drift layer thicknesses of 6 to 40 μm and net carrier electron concentrations of 4 × 1015 to 2.5 × 1016 cm-3. This parameter range is suitable for applications requiring breakdown voltages (BVs) of 600 V-4 kV with a proper edge termination strategy. Measured devices demonstrate near power device figure of merit, that is, differential specific on-resistance (Rsp) of 2 mΩcm2 for a BV of 2.6 kV and 2.95 mΩcm2 for a 3.7-kV device, respectively. The improvement in the substrate quality over the last few years has resulted in the fabrication of diodes with areas as large as 16 mm2, with BVs exceeding 700 V and pulsed (100 μs) currents of 400 A. The structures fabricated are utilized to study in detail the temperature dependency of I-V characteristics, impact ionization and avalanche characteristics, and extract (estimate) modeling parameters such as electron mobility in the GaN c-direction (vertical) and hole minority carrier lifetimes. Some insight into device reliability is also provided.


IEEE Transactions on Electron Devices | 2013

High Voltage Vertical GaN p-n Diodes With Avalanche Capability

Isik C. Kizilyalli; Andrew P. Edwards; Hui Nie; Don Disney; Dave Bour

In this paper, vertical p-n diodes fabricated on pseudobulk gallium nitride (GaN) substrates are discussed. The measured devices demonstrate breakdown voltages of 2600 V with a differential specific on-resistance of 2 mΩ cm2. This performance places these structures beyond the SiC theoretical limit on the power device figure of merit chart. Contrary to common belief, GaN devices do possess avalanche capability. The temperature coefficient of the breakdown voltage is positive, showing that the breakdown is indeed because of impact ionization and avalanche. This is an important property of the device for operation in inductive switching environments. Critical electric field and mobility parameters for epitaxial GaN layers grown on bulk GaN are extracted from electrical measurements. The reverse recovery time of the vertical GaN p-n diode is not discernible because it is limited by capacitance rather than minority carrier storage, and because of this its switching performance exceeds the highest speed silicon diode.


IEEE Electron Device Letters | 2014

3.7 kV Vertical GaN PN Diodes

Isik C. Kizilyalli; Andrew P. Edwards; Hui Nie; Dave Bour; Thomas R. Prunty; Don Disney

There is a great interest in wide band-gap semiconductor devices for power electronics application. In this letter, vertical GaN p-n diodes fabricated on bulk GaN substrates are discussed. The device layers are grown by MOCVD on low defect density (104 cm-2) bulk GaN substrates. The measured devices show breakdown voltages of 3.7 kV with an area differential specific on-resistance (Rsp) of 2.95 mΩ-cm2.


IEEE Electron Device Letters | 2014

400-A (Pulsed) Vertical GaN p-n Diode With Breakdown Voltage of 700 V

Isik C. Kizilyalli; Andrew P. Edwards; Hui Nie; Phong Bui-Quang; Donald R. Disney; Dave Bour

There is a great interest in monolithic GaN semiconductor devices with high current capability for power electronics. In this letter, large area vertical GaN p-n diodes fabricated on bulk GaN substrates are discussed. Diodes with areas as large as 16 mm2 with breakdown voltages exceeding 700 V and pulsed (100 μs) currents approaching 400 A are reported. This is made possible for the first time in part due to the recent availability of improved quality bulk GaN substrates.


Archive | 2011

METHOD OF FABRICATING A GAN P-I-N DIODE USING IMPLANTATION

Isik C. Kizilyalli; Hui Nie; Andrew P. Edwards; Richard J. Brown; Donald R. Disney


Archive | 2015

Method and system for a GaN vertical JFET utilizing a regrown channel

Isik C. Kizilyalli; Hui Nie; Andrew P. Edwards; Linda T. Romano; David P. Bour; Richard J. Brown; Thomas R. Prunty


Archive | 2013

Monolithically integrated vertical jfet and schottky diode

Isik C. Kizilyalli; Hui Nie; Andrew P. Edwards; Linda T. Romano; David P. Bour; Richard J. Brown; Thomas R. Prunty


Archive | 2014

Method and system for fabricating floating guard rings in GaN materials

Donald R. Disney; Andrew P. Edwards; Hui Nie; Richard J. Brown; Isik C. Kizilyalli; David P. Bour; Linda T. Romano; Thomas R. Prunty


Archive | 2011

METHOD AND SYSTEM FOR FORMATION OF P-N JUNCTIONS IN GALLIUM NITRIDE BASED ELECTRONICS

David P. Bour; Thomas R. Prunty; Linda T. Romano; Andrew P. Edwards; Isik C. Kizilyalli; Hui Nie; Richard J. Brown; Mahdan Raj

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Brendan M. Kayes

California Institute of Technology

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Chul H. Park

International Rectifier

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Isik C. Kizilyalli

University of Illinois at Urbana–Champaign

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Quinn Martin

International Rectifier

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