Aparna Vallury
IBM
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Featured researches published by Aparna Vallury.
ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels | 2015
Aparna Vallury; Mark E. Steinke; Vinod Kamath; Lynn Parnell
High performance datacenters that are being built and operated to ensure optimized compute density for high performance computing (HPC) workloads are constrained by the requirement to provide adequate cooling for the servers. Traditional methods of cooling dense high power servers using air cooling imposes a large cooling and power burden on datacenters. Airflow optimization of the datacenter is a constraint subject to a high energy penalty when dense power hungry racks each capable of consuming 30 to 40 kW are populated in a dense datacenter environment. The work documented using a simulation model (TileFlow) in this paper demonstrates the challenges associated with a standard air cooled approach in a HPC datacenter. Alternate cooling approaches to traditional air cooling are simulated as a comparison to traditional air cooling. These include models using a heat exchanger assisted rack cooling solution with conventional chilled water and, a direct to node cooling model simulated for the racks.These three distinct data center models are simulated at varying workloads and the resulting data is presented for typical and maximal inlet temperatures to the racks. For each cooling solution an estimate of the energy spend for the servers is determined based on the estimated PUEs of the cooling solutions chosen.Copyright
ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems | 2013
Jason A. Matteson; Aparna Vallury; Billy W. Medlin
Today’s server designs continue to package more electronics consuming higher levels of power in smaller and smaller spaces which increases the demand on the cooling subsystem within a server. These trends continue to drive the total cooling power and airflow demands up, resulting in increased acoustics. Due to the imposed high cooling requirements, data centers are frequently limited by the amount of flow that the raised floor environments are capable of providing. Server cooling demands are outpacing the data center airflow capabilities, resulting in energy inefficient scenarios as well as increasingly high acoustics levels.Given these concerns, there is a dire need for new thermal management techniques. This paper describes a new technique that offers more advanced yet simplified user controls, which provide the end user the ability to minimize acoustic signature and cooling energy spent, while maximizing the server performance.Copyright
Archive | 2010
Madhusudan K. Iyengar; Vinod Kamath; Howard Victor Mahaney; Mark E. Steinke; Aparna Vallury
Archive | 2010
Ganesh Balakrishnan; Bejoy J. Kochuparambil; Matthew L. Nickerson; Aparna Vallury
Archive | 2009
Vinod Kamath; Jason A. Matteson; Aparna Vallury
Archive | 2010
David Roy Motschman; Mark E. Steinke; Aparna Vallury
Archive | 2017
Jason A. Matteson; Mark E. Steinke; Aparna Vallury
Archive | 2010
Ganesh Balakrishnan; Bejoy J. Kochuparambil; Matthew L. Nickerson; Aparna Vallury
Archive | 2017
Shareef F. Alshinnawi; Gary D. Cudak; Jeffrey S. Holland; Bejoy J. Kochuparambil; Aparna Vallury
Archive | 2017
Jeffrey S. Holland; Shareef F. Alshinnawi; Bejoy J. Kochuparambil; Aparna Vallury