David Roy Motschman | Researchain

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Archive | 1989

Apparatus for cooling electronics components

William Dale Corfits; Maurice Francis Holahan; Susan Jean Martino; David Roy Motschman; James Robert Thorpe

Archive | 2010

Enhanced thermal management of 3-D stacked die packaging

Gerald Keith Bartley; David Roy Motschman; Kamal K. Sikka; Jamil A. Wakil; Xiaojin Wei; Jiantao Zheng

Archive | 2008

Cooling Plate Assembly with Fixed and Articulated Interfaces, and Method for Producing Same

Matthew Allen Butterbaugh; Maurice Francis Holahan; Terry L. Lyon; David Roy Motschman

Archive | 2001

Enhanced optical transceiver arrangement

Benson Chan; Paul Fortier; Francois Guindon; Glen Walden Johnson; Joseph Kuczynski; Gerald Daniel Malagrino; James R. Moon; David Roy Motschman; John H. Sherman

Archive | 2012

HORIZONTALLY AND VERTICALLY ALIGNED GRAPHITE NANOFIBERS THERMAL INTERFACE MATERIAL FOR USE IN CHIP STACKS

Gerald Keith Bartley; Charles Luther Johnson; John E. Kelly; Joseph Kuczynski; David Roy Motschman; Arvind K. Sinha; Kevin A. Splittstoesser; Timothy J. Tofil

Archive | 2010

Memory module connector having memory module cooling structures

David Roy Motschman; Mark E. Steinke; Aparna Vallury

Archive | 2013

HORIZONTALLY ALIGNED GRAPHITE NANOFIBERS IN ETCHED SILICON WAFER TROUGHS FOR ENHANCED THERMAL PERFORMANCE

Gerald Keith Bartley; Charles Luther Johnson; John E. Kelly; Joseph Kuczynski; David Roy Motschman; Arvind K. Sinha; Kevin A. Splittstoesser; Timothy A. Tofil

Archive | 2011