Arnold Halperin

Latent open testing of electronic packaging

Alternating and direct electric currents are applied through the metal interconnections in electronic packaging to detect potential electrical opens, such as line narrowings, notches, nicks, cracks, weak connections, and interface contaminations. Due to the nonlinear relationship between the voltage across and current through the metal conductor, distorted signals are generated by the defect region as well as the good conductor. The signal generated from a latent open defect can be detected by comparing the defect signal phase with the reference phase produced by the good conductor. Application of this technique to electronic packaging development and manufacturing can improve product reliability and reduce cost by early detection of latent open defects.<<ETX>>

A measuring system for analyzing AC dynamic domain wall motions in bubble materials

A measuring system is described which is capable of rapidly analyzing dynamic ac domain wall displacements monitored by Faraday photometric signals from bubble materials placed in a polarizing microscope. An audio modulated rf drive field used in conjunction with signal processing electronics produces a signal proportional to the derivative dx/dh_{p} of the displacement amplitude with respect to the peak drive field. This signal is the basis of plots produced automatically of dx/dh_{p} versus frequency (10 kHz - 32 MHz), dx/dh_{p} versus h p , and x versus h p . Data obtained on an epitaxial garnet film of Eu 0.7 Y 2.3 Fe 3.85 Ga 1.15 O 12 are presented showing domain wall resonances and nonlinearities between wall velocity and drive field.

Latent open defect detection using phase-sensitive nonlinearity detection technique

Alternating and direct electric currents are applied through the metal interconnections in electronic packaging to detect potential electrical opens, such as line narrowings, notches, nicks, cracks, weak connections, and interface contaminations. Due to the nonlinear relationship between the voltage across and current through the metal conductor, distortion signals are generated by the defect region as well as the good conductor. The signal generated from a latent open defect can be detected by comparing the defect signal phase with the reference phase produced by the good conductor. Application of this technique to electronic packaging development and manufacturing can improve product reliability and reduce cost by early detection of latent open defects. >