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Dive into the research topics where Charles J. Hendricks is active.

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Featured researches published by Charles J. Hendricks.


Ibm Journal of Research and Development | 2005

High-speed electrical testing of multichip ceramic modules

Dennis G. Manzer; John P. Karidis; Kathleen M. Wiley; Dominic C. Bruen; Christopher W. Cline; Charles J. Hendricks; Robert N. Wiggin; Yuet-Ying Yu

This paper reports on the successful application of very-high-performance robotics in the electrical testing of multichip modules using only two probes, breaking with the old traditional array of probes as the primary test method. Complete production line tools include two high-speed Hummingbird® probing robots and precise x-y tables to carry them and a fast, accurate opens-shorts test. To ensure fast probe placement without damaging the part under test requires real-time control hardware and software to operate with extreme precision, flexibility, and programmability to accommodate any part. Finally, because a module can have nearly 100,000 points to be probed, computing an optimal path for the two probes to take for full testing of a part can greatly reduce test time.


Archive | 1984

Single wafer plasma etch reactor

Lee Chen; Charles J. Hendricks; Gangadhara S. Mathad; Stanley John Poloncic


Archive | 1985

Plasma etching reactor with reduced plasma potential

Brian Henry Desilets; Thomas Anthony Gunther; Charles J. Hendricks; John Howard Keller


Archive | 1980

Modified RIE chamber for uniform silicon etching

Charles J. Hendricks; William W. Hicks; John Howard Keller


Archive | 1985

Apparatus for plasma etching

Lee Chen; Charles J. Hendricks; Gangadhara S. Mathad; Stanley John Poloncic


Archive | 1999

Seed metal delete process for thin film repair solutions using direct UV laser

Peter A. Franklin; Charles J. Hendricks; Richard P. Surprenant; Stephen J. Tirch; Thomas A. Wassick; James Wood


Archive | 1996

System for testing circuit board integrity

Thomas Morrison; Siegfried Geyer; Charles J. Hendricks; Klaus Probst


Archive | 2005

Electronic package repair process

Jon A. Casey; James G. Balz; Michael Berger; Jerome D. Cohen; Charles J. Hendricks; Richard F. Indyk; Mark J. LaPlante; David C. Long; Lori A. Maiorino; Arthur G. Merryman; Glenn A. Pomerantz; Robert A. Rita; Krystyna W. Semkow; Patrick E. Spencer; Brian R. Sundlof; Richard P. Surprenant; Donald R. Wall; Thomas A. Wassick; Kathleen M. Wiley


Archive | 1998

Interposer for maintaining temporary contact between a substrate and a test bed

Paul F. Bodenweber; Ralph R. Comulada; Mukta S. Farooq; Charles J. Hendricks; Philo Burton Hodge; Vincent P. Peterson; Terence W. Spoor; Kathleen M. Wiley; Yuet-Ying Yu


Archive | 2001

Interconnect package cluster probe short removal apparatus and method

Roger M. Eddy; Charles J. Hendricks; Thomas Morrison; Robert N. Wiggin; Brian J. Wojszynski

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