Aya Hino

Effects of thermal annealing on variations of electron traps in the channel region of amorphous In-Ga-Zn-O thin film transistor

Photoinduced transient spectroscopy (PITS) was applied to study the effects of thermal annealing in the thin-film transistor (TFT) fabrication process on the variations of the electron traps in the channel region of amorphous In-Ga-Zn-O (a-IGZO). A dominant peak with a maximum of around 130 K was observed in the PITS spectra, but the detailed features were varied depending on the annealing conditions. The six particular temperatures corresponding to the trap states were extracted at about 100, 140, 150, 210, 320, and 390 K from the differential PITS spectra, showing good correlation with the trap states observed in ZnO. The results of thermal desorption spectrometry suggested that the variation of electron traps in the a-IGZO thin films has its origin in the decomposition of O and Zn during the annealing process. The annealing after the etch-stop layer deposition was also examined. The peak at about 150 K extracted from the differential PITS spectra before and after the annealing was markedly decreased. The activation energy of the corresponding trap states was estimated to be around 0.3 eV, which was close to those known as the E3 center in ZnO. Secondary ion mass spectroscopy analysis suggested that the reduction of trap density was mainly due to a decrease in the number of defects which involve hydrogen atoms in their configuration. Considering these results, the variations in the electron traps in the a-IGZO thin films during the TFT fabrication process should be attributed to the introduction of Zn, O, and/or H-related defects into tetrahedra consisting of Zn-O bonds.

Physical Properties of Amorphous In–Ga–Zn–O Films Deposited at Different Sputtering Pressures

The physical properties of amorphous In–Ga–Zn–O (a-IGZO) films deposited by DC sputtering under various sputtering pressures were investigated. The sputtering pressure was found to influence various physical properties. Lower sputtering pressures resulted in film densification and decreased both surface roughness and hydrogen concentration. In addition, transistor performance characteristics such as saturation mobility and sub-threshold swing improved as the sputtering pressure decreased. These results yield insight into the correlation between thin film transistor (TFT) performance and deposition conditions.

Effect of H and OH desorption and diffusion on electronic structure in amorphous In-Ga-Zn-O metal-oxide-semiconductor diodes with various gate insulators

Metal-oxide-semiconductor (MOS) diodes with various gate insulators (G/Is) were characterized by capacitance–voltage characteristics and isothermal capacitance transient spectroscopy (ICTS) to evaluate the effect of H and OH desorption and diffusion on the electronic structures in amorphous In–Ga–Zn–O (a-IGZO) thin films. The density and the distribution of the space charge were found to be varied depending on the nature of the G/I. In the case of thermally grown SiO2 (thermal SiO2) G/Is, a high space-charge region was observed near the a-IGZO and G/I interface. After thermal annealing, the space-charge density in the deeper region of the film decreased, whereas remained unchanged near the interface region. The ICTS spectra obtained from the MOS diodes with the thermal SiO2 G/Is consisted of two broad peaks at around 5 × 10−4 and 3 × 10−2 s before annealing, while one broad peak was observed at around 1 × 10−4 s at the interface and at around 1 × 10−3 s in the bulk after annealing. Further, the trap densi...

Electron traps in amorphous In–Ga–Zn–O thin films studied by isothermal capacitance transient spectroscopy

Electron traps in amorphous In–Ga–Zn–O (a-IGZO) thin films were studied using isothermal capacitance transient spectroscopy (ICTS). Broad peaks that shifted toward a longer elapsed time with an increase in the filling pulse width were detected from the ICTS spectra for metal-oxide-semiconductor diodes consisting of a Mo/SiO2/a-IGZO structure. The time constant of the peak position at 180 K was found to be from ∼1 m to ∼100 ms, corresponding to a range of energy level from ∼170 to ∼230 meV below the conduction band edge. The total trap density around the peak was estimated to be ∼1 × 1016 cm−3·eV−1. Further, according to the biasing voltage dependence of the ICTS signal, the density of the trap states increases by about three orders of magnitude near the interface between the a-IGZO and the gate dielectric layers. The electron transport in electronic devices using an a-IGZO could be influenced by the trap states detected in the present study.

Photoelectron emission yield experiments on evolution of sub-gap states in amorphous In-Ga-Zn-O thin films with post deposition hydrogen treatment

Total photoyield emission spectroscopy (TPYS) was applied to study the evolution of sub-gap states in hydrogen-treated amorphous In-Ga-Zn-O (a-IGZO) thin films. The a-IGZO thin films were subjected to hydrogen radicals and subsequently annealed in ultra-high vacuum (UHV) conditions. A clear onset of the electron emission was observed at around 4.3 eV from the hydrogen-treated a-IGZO thin films. After successive UHV annealing at 300 °C, the onset in the TPYS spectra was shifted to 4.15 eV, and the photoelectron emission from the sub-gap states was decreased as the annealing temperature was increased. In conjunction with the results of thermal desorption spectrometer, it was deduced that the hydrogen atoms incorporated in the a-IGZO thin films induced metastable sub-gap states at around 4.3 eV from vacuum level just after the hydrogenation. It was also suggested that the defect configuration was changed due to the higher temperature UHV annealing, and that the hydrogen atoms desorbed with the involvement of Zn atoms. These experiments produced direct evidence to show the formation of sub-gap states as a result of hydrogen incorporation into the a-IGZO thin films.

Facilitation of the four-mask process by the double-layered Ti/Si barrier metal for oxide semiconductor TFTs

The double-layered Ti/Si barrier metal is demonstrated for the source/drain Cu interconnections in oxide semiconductor thin-film transistors (TFTs). The transmission electromicroscopy and ion mass spectroscopy analyses revealed that the double-layered barrier structure suppresses the interfacial reaction and the interdiffusion at the interface after thermal annealing at 350°C. The underlying Si layer was found to be very useful for the etch stopper during wet etching for the Cu/Ti layers. The oxide TFTs with a double-layered Ti/Si barrier metal possess excellent TFT characteristics. It is concluded that the present barrier structure facilitates the back-channel-etch-type TFT process in the mass production line, where the four- or five-mask process is used.

Correlation of trap states with negative bias thermal illumination stress stabilities in amorphous In–Ga–Zn–O thin-film transistors studied by photoinduced transient spectroscopy

Negative bias thermal illumination stress (NBTIS) stabilities in amorphous In–Ga–Zn–O (a-IGZO) thin-film transistors (TFTs) were studied by photoinduced transient spectroscopy (PITS). The degradation of TFT performance correlated with trap states in the channel region of a-IGZO TFTs with an etch stop layer (ESL). A prominent peak at approximately 100 K was observed in a-IGZO formed under a partial pressure (p/p) of 4% O2. With increasing O2 p/p, an apparent shoulder of around 230 K appeared in PITS spectra. A higher flow rate of SiH4/N2O for the ESL deposition induced trap states associated with the 230 K peak. The peak at approximately 100 K could originate from the depletion of Zn by preannealing, while the peak at approximately 230 K should be attributed to the oxygen-deficient and/or Zn-rich defects due to the formation of OH in a-IGZO. The trap states in a-IGZO TFTs gave rise to degradation in terms of NBTIS. The threshold voltage shift (ΔV th) was 2.5 V, but it increased with the O2 p/p as well as the flow rate of SiH4/N2O for ESL deposition. The time dependence of ΔV th suggested that hydrogen from the ESL and/or in the a-IGZO thin films was incorporated and modified the trap states in the channel region of the a-IGZO TFTs.

Study of adhesion and chemical bonds in the reaction layer formed at Cu-Mn interconnection/SiO2 interface

In this study, adhesion of the Cu/Cu-Mn stacked interconnections to glass (SiO2) substrates was evaluated and the results were correlated with a detailed analysis of the reaction layer between the Cu-Mn and the chemical vapour deposited SiO2. When the Mn concentrations were varied, an abrupt change in the adhesion properties was observed; the practical adhesion properties were obtained in the Cu/Cu-Mn interconnections with Mn concentrations at 8% and higher. To clarify the chemical nature and the microstructure of the reaction layer at the interface between the Cu-x Mn (x = 4, 10 at. %) and the SiO2 layers was analysed using angle-resolved x-ray photoelectron spectroscopy and transmission electron microscope-electron energy loss spectroscopy. These observations indicated that the cross-sectional structure along the reaction layer of the Cu–10 at. % Mn sample can be divided into two regions: in the high Mn region, the Mn-Si complex oxide and the SiO2 mixture phase are preferable due to a decrease in the ox...

Characterization of interface of Al-Ni/a-Si for thin film transistor using high-resolution Rutherford backscattering spectrometry.

High-resolution Rutherford backscattering spectrometry (HRBS) in combination with grazing angle argon sputtering was carried out to characterize the interface of aluminum-nickel (Al-Ni) alloy and amorphous-silicon films in a thin film transistor (TFT) for liquid crystal display (LCD). After thinning the top Al-Ni layer by a 1-keV Ar sputtering, the sensitivity of the interface oxygen was improved to be twice higher than that before sputtering. The results revealed that the oxygen at the interface relates to the contact characteristics.

Evaluation of stress stabilities in amorphous In–Ga–Zn–O thin-film transistors: Effect of passivation with Si-based resin

Fabrication process conditions of a passivation (PV) layer correlated with stress stabilities of amorphous In–Ga–Zn–O (a-IGZO) thin-film transistors (TFTs). In etch-stop layer (ESL)-TFTs, by inserting a Si-based resin between SiN x and SiO x PV layers, the peak intensity in the photoinduced transient spectroscopy (PITS) spectrum was notably reduced. This suggested the suppression of hydrogen incorporation into a-IGZO, which led to the improvement of stability under negative bias thermal illumination stress (NBTIS). In contrast, the hydrogen-related defects in the a-IGZO were easily formed by the back-channel etch (BCE) process. Furthermore, it was found that, under NBTIS, the transfer curves of the BCE-TFTs shifted in parallel owing to the positive fixed charge located in the back channel of the a-IGZO TFTs. The hump-shaped shift increased with stress time. This is because hydrogen atoms located at the back-channel surfaces of the a-IGZO and/or PV layers were incorporated into the channel region of the BCE-TFTs and induced the hydrogen-related defects.