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Barbara Vasquez

Infineon Technologies

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Publication

Featured researches published by Barbara Vasquez.

Archive | 2001

Transfer wafer level packaging

Harry Hedler; Thorsten Meyer; Barbara Vasquez

Archive | 2002

Fuse programmable I/O organization

Gerd Frankowsky; Barbara Vasquez

Archive | 2002

Method for producing an electronic component having a plurality of chips that are stacked one above the other and contact-connected to one another

Gerd Frankowsky; Harry Hedler; Roland Irsigler; Thorsten Meyer; Barbara Vasquez

Archive | 2002

Method for connection of circuit units

Gerd Frankowsky; Harry Hedler; Roland Irsigler; Thorsten Meyer; Barbara Vasquez

Archive | 2003

Method of producing semiconductor chips with a chip edge guard, in particular for wafer level packaging chips

Harry Hedler; Roland Irsigler; Barbara Vasquez

Archive | 2004

Electronic component having at least one semiconductor chip and flip-chip contacts, and method for producing the same

Barbara Vasquez

Archive | 2003

Semiconductor circuit module and method for fabricating semiconductor circuit modules

Gerd Frankowsky; Harry Hedler; Barbara Vasquez

Archive | 2002

Process for producing a semiconductor chip

Harry Hedler; Roland Irsigler; Barbara Vasquez

Archive | 2003

Method of producing a semiconductor component having a compliant buffer layer

Harry Hedler; Thorsten Meyer; Barbara Vasquez

Archive | 2001

Electronic component used as a storage component comprises a semiconductor chip having an intermediate connecting structure on its active surface

Harry Hedler; Thorsten Meyer; Barbara Vasquez

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Harry Hedler

Qimonda

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Thorsten Meyer

Infineon Technologies

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Roland Irsigler

Qimonda

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Gerd Frankowsky

Infineon Technologies

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Axel Brintzinger

Infineon Technologies

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Stefan Ruckmich

Infineon Technologies

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Jochen Mueller

Infineon Technologies

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Volker Strutz

Infineon Technologies

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