Barbara Vasquez

Transfer wafer level packaging

Fuse programmable I/O organization

Method for producing an electronic component having a plurality of chips that are stacked one above the other and contact-connected to one another

Method for connection of circuit units

Method of producing semiconductor chips with a chip edge guard, in particular for wafer level packaging chips

Electronic component having at least one semiconductor chip and flip-chip contacts, and method for producing the same

Semiconductor circuit module and method for fabricating semiconductor circuit modules

Process for producing a semiconductor chip

Method of producing a semiconductor component having a compliant buffer layer

Electronic component used as a storage component comprises a semiconductor chip having an intermediate connecting structure on its active surface