Roland Irsigler

Method of producing semiconductor chips with a chip edge guard, in particular for wafer level packaging chips

Method for placing material onto a target board by means of a transfer board

Semiconductor device and method for fabricating the semiconductor device

Electronic component comprising external surface contacts and a method for producing the same

Method for connecting an integrated circuit to a substrate and corresponding arrangement

Method for producing a multichip module and multichip module

Semiconductor and method for producing a semiconductor

Intermediate connection for flip chip in packages

Method for producing an integrated circuit with a rewiring device and corresponding integrated circuit

Production of an electronic component used in chip technology comprises forming a first planar chip arrangement, forming a further planar chip arrangement, optionally applying interconnecting elements and forming electronic components