Barry E. Cole
Honeywell
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Featured researches published by Barry E. Cole.
Technologies for Synthetic Environments: Hardware-in-the-Loop Testing II | 1997
Barry E. Cole; Robert E. Higashi; Jeff A. Ridley; James O. Holmen; Earl Thomas Benser; Robert G. Stockbridge; Robert Lee Murrer; Lawrence E. Jones; Eddie Burroughs
An addressable mosaic array of resistively heated microbridges offers the potential to project accurate dynamic infrared (IR) imagery. The main purpose of this imagery is to be used in the evaluation of IR instruments from seekers to FLIRs. With the growing development of lower cost uncooled IR imagers, scene projectors also offer the potential for dynamic testing of these new instruments. In past years we have described developments in a variety of IR projectors systems designed for different purposes. In this paper we will describe recent developments in these technologies aimed at improving or understanding temporal and radiative performance.
Proceedings of SPIE | 1993
Barry E. Cole; Chien-Jih Han; Robert E. Higashi; Thomas R. Werner; B. Sawyer; Burt W. Ludington; Roy W. Hendrick; Thomas E. Old
Honeywell Inc. and Mission Research Corporation (MRC) are jointly developing micro resistive heater array displays for projecting dynamic background scenes and targets in the short-wavelength infrared (SWIR) to long-wavelength infrared (LWIR) wavebands. There are two joint government contracts supporting this work: the Nuclear Optical Dynamic Display (NODDS) program under DNA contract DNA001-92-C-0041, which is developing a 512 X 512 array of 50- by 50-micrometers display pixels, and the Cryovacuum Resistor Infrared Scene Projector (CRISP) program for the USAF Wright Laboratory at Eglin AFB, which is developing a 512 X 512 array of 87.5- by 87.5-micrometers pixels. The requirements on the two programs are somewhat different due to their different missions. While the NODDS program is developing an array that can be used to create dynamic nuclear clutter scenes, the CRISP arrays are being designed for simulating multiple independently moving targets; and while the frame rate on the NODDS arrays requires an array capable of 1-kHz frame rates, the CRISP arrays will be operated at 30 Hz.
Proceedings of SPIE | 1998
Barry E. Cole; Robert E. Higashi; Jeff A. Ridley; James O. Holmen; Robert G. Stockbridge; Robert Lee Murrer; Eddie Burroughs
Resistive emitter arrays are formed via the fabrication of microemitters on Si CMOS electronics. These IR emitter arrays using microstructures have been developed at Honeywell to project scenes for a wide range of applications. A new array which has been fabricated has a size of 544 X 672 pixels. Other arrays producing very high apparent temperatures in excess of 700 K have also been fabricated. Arrays have been fabricated for projecting low background scenes achieved through cryogenic operation. All arrays are designed to project IR radiation over the full MWIR and LWIR spectral bands. Individual arrays and their emission properties will be described. Array properties at different substrate temperatures will be described. Advances in packaging of these different array types will also be discussed.
Technologies for Synthetic Environments: Hardware-in-the-Loop Testing V | 2000
Barry E. Cole; B. Higashi; Jeff A. Ridley; James O. Holmen; K. Newstrom; Christopher J. Zins; K. Nguyen; Steven R. Weeres; Burgess R. Johnson; Robert G. Stockbridge; Robert Lee Murrer; Eric M. Olson; Thomas P. Bergin; James R. Kircher; David S. Flynn
In the past year, Honeywell has developed a 512 X 512 snapshot scene projector containing pixels with very high radiance efficiency. The array can operate in both snapshot and raster mode. The array pixels have near black body characteristics, high radiance outputs, broad band performance, and high speed. IR measurements and performance of these pixels will be described. In addition, a vacuum probe station that makes it possible to select the best die for packaging and delivery based on wafer level radiance screening, has been developed and is in operation. This system, as well as other improvements, will be described. Finally, a review of the status of the present projectors and plans for future arrays is included.
Optical Engineering | 1991
Donald R. Stauffer; Barry E. Cole
A number of techniques are under development for creating dynamic IR scenes for testing IR imaging systems. Comparison of these techniques may be misleading if appropriate performance parameters are not used. One straightforward method is the thermal emission from microemitters fabricated in an array. The small mass leads to good response times if crosstalk between elements and to any substrate can be limited. Silicon micromachining can create good performance in arrays of this type because of the excellent thermal isolation of the elements
Proceedings of SPIE | 1996
Barry E. Cole; Robert E. Higashi; Jeff A. Ridley; James O. Holmen; James W. Arendt; Charles L. Malone; Robert G. Stockbridge; George C. Goldsmith; Lawrence E. Jones
An addressable mosaic array of resistively heated microbridges offers much flexibility for infrared scene simulations. In the Wide Band Infrared Scene Projector program, Honeywell has demonstrated high yield arrays up to size 512 X 512 capable of room temperature operation for a 2 band infrared projection system being designed and built by Contraves Inc. for the Wright Laboratory Kinetic Kill Vehicle Hardware In-the-Loop Simulator facility at Eglin Air Force Base, FL. The arrays contain two different pixel designs, one pixel designed for kHz frame rates and high radiance achieved at a power level of 2.5 mWatts/pixel and the other pixel designed for more moderate 100 Hz frame rates at lower radiance and at maximum power levels of 0.7 mWatts/pixels. Tests on arrays and pixels have demonstrated dynamic ranges up to 850:1, radiance rise times on the order of 2 mseconds, and broadband pixel emissivities in the range of 70%. Arrays have been fabricated with less than 0.1% pixel outages and no row or column defects. These arrays are mounted in a specialized vacuum assembly containing an IR window, vacuum package, cooling block, and pump out manifold.
Technologies for Synthetic Environments: Hardware-in-the-Loop Testing IV | 1999
Barry E. Cole; Steven R. Weeres; Robert E. Higashi; Jeff A. Ridley; James O. Holmen; Burgess R. Johnson
In 1991 the Honeywell Technology Center began the development of large area 2D microemitter arrays for IR scene projection. Since then, 5 different types of 512 X 512 or larger arrays have been fabricated, all in current use. This paper will review the status, properties, and applications of these arrays. Pixel and array improvements which will lead to ultralow power consumption, very high performance, very fast 1024 square arrays are under development. A number of these efforts are described.
SPIE's 1995 Symposium on OE/Aerospace Sensing and Dual Use Photonics | 1995
Chien-Jih Han; Barry E. Cole; Robert E. Higashi; Jeff A. Ridley; James O. Holmen; Blair Sawyer; Dennis Wagner; Robert G. Stockbridge
A mosaic array of resistively heated microbridges offers flexibility for infra red scene simulations. The array may operate without flicker and display high-intensity dynamic scenes over a wide bandwidth. Honeywell completed fabrication of a 512 X 512 resistor array with 3.5 mils pitch for AEDCs 7V and 10V test chambers. The emitter has a broad bandwidth covering from 2 micrometers to 26 micrometers . The array operates at 20 K to simulate low radiation backgrounds in space. Up to 16,000 pixels may be turned on to simulate targets and target clusters. Each emitter element may heat up to 550 K with 1 kelvin resolution. The maximum power dissipation per pixel is 830 (mu) W for a pixel heated up to 550 K. The maximum power required is 13.2 watts for 16,000 pixels. This low power capability is derived from Honeywells silicon nitride microbridge structure. Each emitter has approximately 85% fill factor and an average emissivity of 70% over the 2 - 26 micrometers bandwidth. Defect count in the array is less than 1% with one column out. The array may be addressed at 30 frames per second.
Progress In High-Temperature Superconducting Transistors and Other Devices | 1991
Barry E. Cole
Recent technological advances have made it possible to form arrays of small thin-film-based bolometric pixels integrated onto Si substrates containing both array addressing and readout electronics. These advances have made bolometer technology a potentially low-cost, high-sensitivity, high-yield staring detector technology for the near future. In this paper, the basic performance aspects of an IR microbolometer are described. The design of a high-performance pixel and the performance measurements on some initial devices are presented. The potential performance of two-dimensional arrays is discussed.
Infrared Systems and Components III | 1989
Don Stauffer; Bill Haas; Barry E. Cole
Testing of infrared systems such as FLIRs and missile seekers would be eased by the availability of an infrared scene generator with capability of displaying a complex, dynamic scene, the IR analogy of a motion picture projector. The two main categories of technologies being developed for this purpose are the spatial light modulator and the thermal emitter array. Honeywell is developing a thermal emitter array based on microstructure technology. This paper discusses performance parameters of scene generators such as resolution, radiometric accuracy, and time response. The number of pixels in an array may be an insufficient measure of resolution. Thermal emitters have advantages over light modulators when radiometric accuracy and high contrast are demanded. The unique physical and thermal parameters of the microstructure array technique help alleviate time response problems common to most thermal emitter arrays.