Beate Pawlowski

Silicon on Ceramics―A New Integration Concept for Silicon Devices to LTCC

A new integration concept for MEMS-devices to ceramic substrates based on a new bonding technique between nano-scaled black silicon (BSi) and an adapted LTCC substrate is presented. The novel technique allows combining advantages of silicon and ceramic technology whereby a new wafer compound material (silicon on ceramics) and innovative ceramic carrier as well as chip packages become available. The new compound is fabricated by the use of standard technologies (reactive ion etching, lamination, and pressure assisted sintering) without additional materials and devices. A bonding strength up to 1750 N/cm2 and gas tightness are remarkable features of the bond interface. Simultaneously, electrical interconnects between silicon and LTCC can be manufactured during lamination and sintering.

SiCer - A substrate to combine ceramic and silicon based micro systems

A silicon-on-ceramic (SiCer) wafer-shaped substrate, allowing a simultaneous fabrication of ceramic and silicon based microsystems is presented. The substrate, based on the recently introduced silicon-on-ceramic integration concept, can be processed by standard MEMS and LTCC technologies. The monolithic compound is fabricated by using lamination and pressure assisted firing of a nano patterned silicon wafer with a low temperature cofired ceramic tape (LTCC). The LTCC is adapted to silicon (TCE and morphology). LTCC functionalities such as electrical and thermal vias, passives, fluidic channels, etc.,. can be pre-processed in grid dimensions or individually. Through Silicon Vias (TSV) in the silicon layer can be combined with the vias in the LTCC. The silicon layer can be fabricated as thin as necessary for the desired functionality, whereas the insulating LTCC layer ensures the mechanical stability of the SiCer wafer. In addition, the LTCC layer includes electrical functionalities like signal routing an...

Properties of high-k materials embedded in low temperature cofired ceramics

Buried capacitors in low temperature cofired ceramics (LTCC) enable increased package density, shorter interconnects and reduced assembly time.