Bernard J. New
Xilinx
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Publication
Featured researches published by Bernard J. New.
custom integrated circuits conference | 2006
Arifur Rahman; John Trezza; Bernard J. New; Stephen M. Trimberger
In this paper a die stacking technology, leveraging on through die via (TDV) integration and wafer bonding, is presented. Using state-of-the-art volume manufacturing environment, 10:1 aspect ratio TDV and wafer-level bonding technology are developed and initial electrical and reliability characterization results of TDVs are provided. The opportunities for die-stacking technology to alleviate chip-to-chip communication bottleneck are discussed and visions for stacked-die applications, utilizing a programmable virtual backplane, are presented
Archive | 1993
Bernard J. New
Archive | 1997
Bernard J. New; Robert Anders Johnson; Ralph D. Wittig; Sundararajarao Mohan
Archive | 1997
Bernard J. New
Archive | 2001
Bernard J. New; Ralph D. Wittig; Sundararajarao Mohan
Archive | 2003
Bernard J. New
Archive | 2001
Bernard J. New; Steven P. Young
Archive | 1997
Bernard J. New
Archive | 2000
Bernard J. New
Archive | 2004
James M. Simkins; Steven P. Young; Jennifer Wong; Bernard J. New; Alvin Y. Ching
