Bernd K. Appelt
IBM
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Featured researches published by Bernd K. Appelt.
Archive | 1984
Bernd K. Appelt; Pamela J. Cook
The curing reaction of a DICY-based epoxy resin was characterized by DSC. The epoxy resin was composed of a mixture of brominated bisphenol-A diglycidyl ether and of epoxidized cresol novolak with dicyandiamide (DICY) as hardener and tetramethyl butane diamine (TMBDA) as catalyst. The optimum ratio of epoxy/ DICY in terms of the glass transition temperature (Tg) was determined to be about 8:1. It could be shown that the heat of reaction (ΔH) at B-stage is strongly dependent on the amount of unreacted DICY. It was observed that for the optimum formulation, Tg increased linearly with conversion (orΔH) Up to 95% conversion. On the other hand, TMBDA did not affect Tg of the fully cured resin, although it accelerated the cure rate substantially.
Archive | 2001
Bernd K. Appelt; John M. Lauffer
Archive | 1990
Bernd K. Appelt; Perminder Singh Bindra; Robert D. Edwards; James R. Loomis; Jae M. Park; Jonathan D. Reid; Lisa J. Smith; James R. White
Archive | 1990
Lawrence C. Alexander; Bernd K. Appelt; David K. Balkin; James Jens Hansen; Joseph Hromek; Ronald Anthony Kaschak; John M. Lauffer; Irving Memis; Magan S. Patel; Andrew M. Seman; Robin A. Susko
Archive | 1998
Bernd K. Appelt; Lawrence Robert Blumberg; William Thomas Fotorny; Ross Downey Havens; Robert M. Japp; Kostas Papathomas; Jan Obrzut; Mark D. Poliks; Amarjit S. Rai
Polymer Composites | 1987
Jeffrey T. Gotro; Bernd K. Appelt; Konstantinos I. Papathomas
Archive | 1983
Bernd K. Appelt; George P. Schmitt; John F. Shipley
Archive | 2002
Bernd K. Appelt; Gary A. Johansson; Konstantinos I. Papathomas
Archive | 1993
Bernd K. Appelt; Irv Memis; Richard Anthony Schumacher; John M. Lauffer
Archive | 2000
Bernd K. Appelt; William Thomas Fotorny; Robert M. Japp; Kostantinos Papathomas; Mark D. Poliks
