Bian Tian

The design and analysis of beam-membrane structure sensors for micro-pressure measurement

This paper reports the design and analysis of a type of piezoresistive pressure sensor for micro-pressure measurement with a cross beam-membrane (CBM) structure. This new silicon substrate-based sensor has the advantages of a miniature structure and high sensitivity, linearity, and accuracy. By using the finite element method to analyze the stress distribution of the new structure and subsequently deducing the relationship between structural dimensions and mechanical performances, equations used to determine the CBM structure are established. Based on the CBM model and our stress and deflections equations, sensor fabrication is then performed on the silicon wafer via a process including anisotropy chemical etching and inductively coupled plasma. The structures merits, such as linearity, sensitivity, and repeatability, have been investigated under the pressure of 5 kPa. Our results show that the precision of these equations is ±0.19%FS, indicating that this new small-sized structure offers easy preparation, high sensitivity, and high accuracy for micro-pressure measurement.

Design optimization of high pressure and high temperature piezoresistive pressure sensor for high sensitivity

This paper describes a design method for optimizing sensitivity of piezoresistive pressure sensor in high-pressure and high-temperature environment. In order to prove the method, a piezoresistive pressure sensor (HPTSS) is designed. With the purpose of increasing sensitivity and to improve the measurement range, the piezoresistive sensor adopts rectangular membrane and thick film structure. The configuration of piezoresistors is arranged according to the characteristic of the rectangular membrane. The structure and configuration of the sensor chip are analyzed theoretically and simulated by the finite element method. This design enables the sensor chip to operate in high pressure condition (such as 150 MPa) with a high sensitivity and accuracy. The silicon on insulator wafer is selected to guarantee the thermo stability of the sensor chip. In order to optimize the fabrication and improve the yield of production, an electric conduction step is devised. Series of experiments demonstrates a favorable linearity of 0.13% and a high accuracy of 0.48%. And the sensitivity of HTPSS is about six times as high as a conventional square-membrane sensor chip in the experiment. Compared with the square-membrane pressure sensor and current production, the strength of HPTTS lies in sensitivity and measurement. The performance of the HPTSS indicates that it could be an ideal candidate for high-pressure and high-temperature sensing in real application.

Incorporation of beams into bossed diaphragm for a high sensitivity and overload micro pressure sensor

The paper presents a piezoresistive absolute micro pressure sensor, which is of great benefits for altitude location. In this investigation, the design, fabrication, and test of the sensor are involved. By analyzing the stress distribution of sensitive elements using finite element method, a novel structure through the introduction of sensitive beams into traditional bossed diaphragm is built up. The proposed configuration presents its advantages in terms of high sensitivity and high overload resistance compared with the conventional bossed diaphragm and flat diaphragm structures. Curve fittings of surface stress and deflection based on ANSYS simulation results are performed to establish the equations about the sensor. Nonlinear optimization by MATLAB is carried out to determine the structure dimensions. The output signals in both static and dynamic environments are evaluated. Silicon bulk micromachining technology is utilized to fabricate the sensor prototype, and the fabrication process is discussed. Experimental results demonstrate the sensor features a high sensitivity of 11.098 μV/V/Pa in the operating range of 500 Pa at room temperature, and a high overload resistance of 200 times overpressure to promise its survival under atmosphere. Due to the excellent performance above, the sensor can be applied in measuring the absolute micro pressure lower than 500 Pa.

The novel structural design for pressure sensors

Purpose – The purpose of this paper is to investigate the disadvantages of traditional sensors and establish a new structure for pressure measurement.Design/methodology/approach – A kind of novel piezoresistive micro‐pressure sensor with a cross‐beam membrane (CBM) structure is designed based on the silicon substrate. Through analyzing the stress distribution of the new structure by finite element method, the model of structure is established and compared with traditional structures. The fabrication is operated on silicon wafer, which applies the technology of anisotropy chemical etching and inductively coupled plasma.Findings – Compared to the traditional C‐ and E‐type structures, this new CBM structure has the advantages of low nonlinearity and high sensitivities by the cross‐beam on the membrane, which cause the stress is more concentrated in sensitive area and the deflections that relate to the linearity are decreased.Originality/value – The paper provides the first empirical reports on the new piezor...

Fabrication and Structural Design of Micro Pressure Sensors for Tire Pressure Measurement Systems (TPMS)

In this paper we describe the design and testing of a micro piezoresistive pressure sensor for a Tire Pressure Measurement System (TPMS) which has the advantages of a minimized structure, high sensitivity, linearity and accuracy. Through analysis of the stress distribution of the diaphragm using the ANSYS software, a model of the structure was established. The fabrication on a single silicon substrate utilizes the technologies of anisotropic chemical etching and packaging through glass anodic bonding. The performance of this type of piezoresistive sensor, including size, sensitivity, and long-term stability, were investigated. The results indicate that the accuracy is 0.5% FS, therefore this design meets the requirements for a TPMS, and not only has a smaller size and simplicity of preparation, but also has high sensitivity and accuracy.

Tungsten-rhenium thin film thermocouples for SiC-based ceramic matrix composites

A tungsten-rhenium thin film thermocouple is designed and fabricated, depending on the principle of thermal-electric effect caused by the high temperature. The characteristics of thin film thermocouples in different temperatures are investigated via numerical analysis and analog simulation. The working mechanism and thermo-electric features of the thermocouples are analyzed depending on the simulation results. Then the thin film thermocouples are fabricated and calibrated. The calibration results show that the thin film thermocouples based on the tungsten-rhenium material achieve ideal static characteristics and work well in the practical applications.

Incorporation of the stress concentration slots into the flexures for a high-performance microaccelerometer

Presented in this paper is a development of a high-performance piezoresistive microaccelerometer based on the slot etching in the quad flexures for the vibration detection of high speed spindle. The proposed structure consists of a proof mass supported by four thin flexures with slots etched in the middle. Boron diffused piezoresistors located near the stress concentration regions are used for sensing the localized stress resulting from the incorporation of the slots into the flexures. Theoretical analysis and finite element analysis show satisfactory results of an improved sensitivity and favorable natural frequency higher than 10 kHz, conforming to the initial design requirements. The microfabrication techniques are described to prototype the two accelerometer chips, one with slots and the other one without slots. The tested microaccelerometers with 3 V DC power supply show an average sensitivity of 0.424 mV/g normal to the proof mass plane, increased by 60.6% than the ones without slots. An average transverse sensitivity is found to be 9.2 μV/g along X axis and 14.2 μV/g along Y axis, either of which is less than 3.5% of prime-axis sensitivity. Concerning the resonant frequency, dynamic experiment shows about 12.46 kHz and is available for the proposed design with a tiny loss of 3.5% compared with the quad-beam design. When taking the product of sensitivity and natural frequency as judgment criteria, an inspiring increase by 28.6% of the figure of merit is accomplished for the proposed accelerometer. Overall, the findings of this study confirm the feasibility of incorporating slots into the conventional configurations to improve the sensor sensitivity while maintaining a comparatively high natural frequency.

The novel measurement method of liquid level and density in airtight container

This paper describes a novel method of liquid level and density measurement with application in airtight container such as oil storage tank. In order to prove the method, a multifunctional pressure-type liquidometer (MPTL) was designed. The MPTL comprises two pressure sensors for capturing the underwater pressure accurately, by which the MPTL could calculate the density of the liquid and back-calculate the level of the liquid. A digital temperature sensor was implanted in the MPTL to collect the temperature of the liquid. Series of experiments show a favorable linearity of 0.2% and a high accuracy of 0.27%. Besides, the simple fabrication, low cost and unconstrained conditions guarantee its popularity in the petrochemical industry fields. Overall, the findings of this study confirm the feasibility of the novel liquid level measure method and offer an economical scheme for mass producing.

Range Analysis of Thermal Stress and Optimal Design for Tungsten-Rhenium Thin Film Thermocouples Based on Ceramic Substrates

A thermal stress range analysis of tungsten-rhenium thin film thermocouples based on ceramic substrates is presented to analyze the falling off and breakage problems caused by the mismatch of the thermal stresses in thin film thermocouples (TFTCs) and substrate, and nano-indentation experiments are done to measure and calculate the film stress to compare with the simulation results. Optimal design and fabrication of tungsten-rhenium TFTCs based on ceramic substrates is reported. Static high temperature tests are carried out, which show the optimization design can effectively reduce the damage caused by the thermal stress mismatch.

Note: High temperature pressure sensor for petroleum well based on silicon over insulator

In order to meet the requirements in petroleum well, a novel structure of high temperature pressure sensor based on the silicon over insulator (SOI) technology is proposed in this paper. The SOI sensor chip is bonded with a glass ring by electrostatic bonding. By controlling the inner diameter of the glass ring, the size of the circle membrane is obtained precisely. And the detailed parameters of the structure are established through analysis. Then, the sensor is fabricated. The test results show that this type sensor has high sensitivity and accuracy. It is able to measure at the temperature up to 180 °C and the measuring range is 60 MPa. Moreover, the results we got are closer to the actual situation.