Brenda L. VanMil

Epitaxial-Graphene RF Field-Effect Transistors on Si-Face 6H-SiC Substrates

We report dc and the first-ever measured small-signal radio-frequency (RF) performance of epitaxial-graphene RF field-effect transistors (FETs), where the epitaxial-graphene layer is formed by graphitization of 2-in-diameter Si-face semi-insulating 6H-SiC (0001) substrates. The gate is processed with a metal gate on top of a high-k Al2 O3 gate dielectric deposited via an atomic-layer-deposition method. With a gate length (Lg) of 2 mum and an extrinsic transconductance of 148 mS/mm, the extrinsic current-gain cutoff frequency (fT) is measured as 4.4 GHz, yielding an extrinsic fT ldr Lg of 8.8 GHz middot mum. This is comparable to that of Si NMOS. With graphene FETs fabricated in a layout similar to those of Si n-MOSFETs, on-state current density increases dramatically to as high as 1.18 A/mm at Vds = 1 V and 3 A/mm at Vds = 5 V. The current drive level is the highest ever observed in any semiconductor FETs.

Hall effect mobility of epitaxial graphene grown on silicon carbide

Epitaxial graphene (EG) films were grown in vacuo by silicon sublimation from the (0001) and (0001¯) faces of 4H-SiC and 6H-SiC. Hall effect mobilities and sheet carrier densities of the films were measured at 300 and 77 K and the data depended on the growth face. About 40% of the samples exhibited holes as the dominant carrier, independent of face. Generally, mobilities increased with decreasing carrier density, independent of carrier type and substrate polytype. The contributions of scattering mechanisms to the conductivities of the films are discussed. The results suggest that for near-intrinsic carrier densities at 300 K epitaxial graphene mobilities will be ∼150 000 cm2 V−1 s−1 on the (0001¯) face and ∼5800 cm2 V−1 s−1 on the (0001) face.

Top-Gated Epitaxial Graphene FETs on Si-Face SiC Wafers With a Peak Transconductance of 600 mS/mm

In this letter, we present state-of-the-art performance of top-gated graphene n-FETs and p-FETs fabricated with epitaxial graphene layers grown on Si-face 6H-SiC substrates on 50-mm wafers. The current-voltage characteristics of these devices show excellent saturation with on-state current densities (I_on) of 0.59 A/mm at V_ds = 1 V and 1.65 A/mm at V_ds = 3 V. I_on/I_off ratios of 12 and 19 were measured at V_ds = 1 and 0.5 V, respectively. A peak extrinsic g_m as high as 600 mS/mm was measured at V_ds = 3.05 V, with a gate length of 2.94 ¿m. The field-effect mobility versus effective electric field (E_eff) was measured for the first time in epitaxial graphene FETs, where record field-effect mobilities of 6000 cm²/V·s for electrons and 3200 cm²/V·s for holes were obtained at E_eff ~ 0.27 MV/cm .

Correlating Raman Spectral Signatures with Carrier Mobility in Epitaxial Graphene: A Guide to Achieving High Mobility on the Wafer Scale

We report a direct correlation between carrier mobility and Raman topography of epitaxial graphene (EG) grown on silicon carbide (SiC). We show the Hall mobility of material on SiC(0001) is highly dependent on thickness and monolayer strain uniformity. Additionally, we achieve high mobility epitaxial graphene (18100 cm(2)/(V s) at room temperature) on SiC(0001) and show that carrier mobility depends strongly on the graphene layer stacking.

Comparison of Epitaxial Graphene on Si-face and C-face 4H SiC Formed by Ultrahigh Vacuum and RF Furnace Production

We present X-ray photoelectron spectroscopy, van der Pauw Hall mobilities, low-temperature far-infrared magneto transmission (FIR-MT), and atomic force microscopy (AFM) results from graphene films produced by radiative heating in an ultrahigh vacuum (UHV) chamber or produced by radio frequency (RF) furnace annealing in a high vacuum chemical vapor deposition system on Si- and C-face 4H SiC substrates at 1200-1600 degrees C. Although the vacuum level and heating methods are different, graphene films produced by the two methods are chemically similar with the RF furnace annealing typically producing thicker graphene films than UHV. We observe, however, that the formation of graphene on the two faces is different with the thicker graphene films on the C-face RF samples having higher mobility. The FIR-MT showed a 0(-1) --> 1(0) Landau level transition with a square root B dependence and a line width consistent with a Dirac fermion with a mobility >250,000 cm(2) x V(-1) x s(-1) at 4.2 K in a C-face RF sample having a Hall-effect carrier mobility of 425 cm(2) x V(-1) x s(-1) at 300 K. AFM shows that graphene grows continuously over the varying morphology of both Si and C-face substrates.

Basal plane dislocation reduction in 4H-SiC epitaxy by growth interruptions

The paths of basal plane dislocations (BPDs) through 4H-SiC epitaxial layers grown on wafers with an 8° offcut were tracked using ultraviolet photoluminescence imaging. The reduction of BPDs by conversion to threading edge dislocations was investigated at ex situ and in situ growth interrupts. For ex situ interrupts, BPDs are imaged after each of several growths. The wafer remains in the reactor for in situ interrupts and BPDs are imaged after the growth is finished. For in situ interrupts, a combination of temperature, propane flow, and duration has been determined, which achieve a BPD reduction of 98%.

Turning of Basal Plane Dislocations During Epitaxial Growth on 4° off-axis 4H-SiC

Epitaxial layers were grown on 4° off-axis 4H-SiC substrates by hot-wall chemical vapor deposition. The reduced off-cut angle resulted in lower basal plane dislocation (BPD) densities. The dependence of BPD reduction on growth conditions was investigated using ultraviolet photoluminescence (UVPL) imaging. With this method, it was found that the dislocations were converting to threading edge dislocations throughout the thickness of the film. A high (≥ 97%) conversion efficiency was found for all films grown with this orientation. A conversion of 100% was achieved for several films without pre-growth treatments or growth interrupts.

Recombination processes controlling the carrier lifetime in n−4H–SiC epilayers with low Z1/2 concentrations

The dominant recombination processes controlling the carrier lifetime in n-type 4H–SiC epitaxial layers grown with low concentrations of the Z1/2 defect (the dominant bulk lifetime killer), where Z1/2 no longer determines the lifetime, have been investigated by studying the variation in the carrier lifetime with temperature. The temperature dependent lifetimes were obtained primarily by low-injection photoluminescence decay for several low-Z1/2 epilayers over a wide temperature range. The results were fitted to simulations of the temperature dependent recombination rate, where bulk, surface and interface recombination was considered. No significant contribution from other bulk defects was observed, and upper limits to the bulk recombination rate were found to be consistent with the low Z1/2 concentrations measured in these materials. There was also no significant contribution from carrier capture at the epilayer/substrate interface, which is consistent with behavior expected at low injection for low-doped...

Epitaxial Graphene Growth on SiC Wafers

An in vacuo thermal desorption process has been accomplished to form epitaxial graphene (EG) on 4H- and 6H-SiC substrates using a commercial chemical vapor deposition reactor. Correlation of growth conditions and the morphology and electrical properties of EG are described. Raman spectra of EG on Si-face samples were dominated by monolayer thickness. This approach was used to grow EG on 50 mm SiC wafers that were subsequently fabricated into field effect transistors with fmax of 14 GHz.

Graphene Formation on SiC Substrates

Graphene layers were created on both C and Si faces of semi-insulating, on-axis, 4H- and 6H-SiC substrates. The process was performed under high vacuum (<10-4 mbar) in a commercial chemical vapor deposition SiC reactor. A method for H2 etching the on-axis substrates was developed to produce surface steps with heights of 0.5 nm on the Si-face and 1.0 to 1.5 nm on the C-face for each polytype. A process was developed to form graphene on the substrates immediately after H2 etching and Raman spectroscopy of these samples confirmed the formation of graphene. The morphology of the graphene is described. For both faces, the underlying substrate morphology was significantly modified during graphene formation; surface steps were up to 15 nm high and the uni-form step morphology was sometimes lost. Mobilities and sheet carrier concentrations derived from Hall Effect measurements on large area (16 mm square) and small area (2 and 10 m square) samples are presented and shown to compare favorably to recent reports.