Bruce Allen Bosco

Characterization and Modeling of Metal/Double-Insulator/Metal Diodes for Millimeter Wave Wireless Receiver Applications

In this paper we present measurements, models, and circuit implementations for a new low cost, thin film, metal/double-insulator/metal (MIIM) based tunneling diode technology. The device technology uses two insulators to form a tunneling device with very high speed performance capability, and is potentially compatible with many substrate technologies. This technology can potentially reduce cost, size, and improve performance for applications associated with high-speed communications, automotive collision avoidance and navigation, and homeland security weapons detection. Measured results of DC, S-parameter, and responsivity measurements in the 60 GHz band will be presented, including unmatched responsivity at 60 GHz of over 1000 V/W at -20 dBm, which is competitive with detector diodes on GaAs or Sb-based materials. ADS-compatible non-linear models are developed and demonstrated, and an envelope detector design and results is presented.

New phase shifters and phased antenna array designs based on ferroelectric materials and CTS technologies

As the search continues for low-cost and high-performance components for the front-end devices for wireless communications systems, the focus has been on the use of MEMS technology; but some attention has recently been given to exploring new and innovative designs based on the Ferroelectric and the Continuous Transverse Stubs (CTS) technologies. In this paper we present new phase shifter designs and an integrated phased array antenna system based on the use of multilayer ferroelectric materials. Simulation results show that with the appropriate selection of the materials properties and the dimensions of the multilayer dielectric system, insertion losses may be reduced by as much as a factor of 100. These results also show that while only a slight reduction (15%) in the maximum achievable tunability was observed, it was possible to achieve significant improvement in the impedance matching characteristics. A procedure to enhance the radiation efficiency from an integrated ferroelectric/CTS phased antenna array design will be described and specific array designs discussed.

Emerging Commercial Applications Using the 60 GHz Unlicensed Band: Opportunities and Challenges

The 60 GHz band has emerged as an international spectrum opportunity for short-range wireless communication networks. In this paper, opportunities that may leverage 60 GHz and the technology trends that will impact the commercial deployment of systems utilizing the 60 GHz frequency band are discussed. Millimeter-wave frequency bands have historically been costly to utilize and traditionally used almost exclusively for government and non-consumer products. Recent and ongoing advances in semiconductor technology and low cost high frequency packaging can be leveraged for low cost solutions that enable widespread deployment. An example of such a system operating in the millimeter-wave spectrum where bandwidths of ~3 GHz have been achieved. Multi-gigabit data transmission and reception over significant distances has also been realized to demonstrate the potential throughput of such a broadband wireless system.

Technology for emerging commercial applications at millimeter-wave frequencies

The 60 GHz band has emerged as an international spectrum opportunity for short-range wireless communication networks. In this paper, technology trends that can impact the commercial deployment of systems utilizing millimeterwave frequency bands is discussed. Millimeter-wave frequency bands have historically been costly to utilize and traditionally used almost exclusively for government and non-consumer products. Recent and ongoing advances in semiconductor and low cost high frequency packaging can be leveraged for low cost solutions that enable widespread deployment. In order to demonstrate the potential throughput of a broadband wireless system utilizing millimeter-wave spectrum, Motorola Labs has demonstrated multi-gigabit data transmission and reception over significant distances.

Opportunities and Challenges in Utilizing Millimeter-Wave Spectrum for High Speed Wireless Communications

The 60 GHz band has emerged as an international spectrum opportunity for short-range wireless communication networks. In this paper, technology trends that can impact the commercial deployment of systems utilizing millimeter-wave frequency bands are discussed. Millimeter-wave frequency bands have historically been costly to utilize and traditionally used almost exclusively for government and non-consumer products. Recent and ongoing advances in semiconductor technology and low cost high frequency packaging can be leveraged for low cost solutions that enable widespread deployment. An example of such a system operating in the millimeter-wave spectrum where bandwidths of >3 GHz have been achieved. Multi-gigabit data transmission and reception over significant distances has also been realized to demonstrate the potential throughput of such a broadband wireless system.

Gigabit wireless personal area networks: Motivation, challenges and implementation

Demands in file size and transfer rates for consumer products are escalating, requiring gigabit rates for applications such as uncompressed streaming video. A number of wireless technologies are attempting to meet the gigabit-plus rates required for these applications. The most promising of these wireless solutions is found to be the use of the 60 GHz band. This technology can provide the needed bandwidth for the most demanding application - even with modest modulation and coding implementations. The objective of this work is to provide an up to date overview of gigabit wireless systems with a focus on wireless personal area networks.

On-wafer characterization de-embedding and transmission line optimization on silicon for millimeter-wave applications

The design and implementation of transmission line based calibration standards, suitable for de-embedding on-wafer active and passive elements for millimeter-wave applications on silicon BiCMOS backend process technology, is investigated. Loss mechanisms, accuracy requirements, layout considerations, and impedance dependent characteristics of transmission line structures are discussed. The application of popular on-wafer, in situ calibration de-embedding approaches is evaluated. Methods to improve backend process technology for millimeter-wave applications are suggested, based upon transmission modeling using EM simulation tools. Modeled versus measured results are presented in support of conclusions.

An 8-Watt 3.5 GHz power amplifier with tunable matching

A high power 3-stage, S-band power amplifier MMIC implemented with a partially matched output stage is presented. This MMIC PA achieves 39 dBm output power and greater than 25% power added efficiency using 0.6 /spl mu/m PHEMT technology. Small-signal performance matches very well with modeled predictions. The amplifier is exceptionally stable under varying loads, has a bandwidth of several 100 MHz and is easily matched and tuned about the 3.5 GHz band with a simple output matching technique using chip caps, bond wires and duroid transmission lines.

MMIC Power Amplifier Output Combiner Network Considerations for S-Band Applications

The output combiner network for any power amplifier application that utilizes 2 or more parallel combined active devices is well known to be a critical component for a successful design. At higher microwave and millimeter frequencies, distributed corporate combiners are generally employed for a low loss, integrated combiner solution. This combiner technique can also be employed for lower microwave frequency applications, for example, for S-Band MMIC power amplifiers. Though relatively easy to model and design, these lower frequency applications present unique challenges of their own. This paper compares several possible solutions to the combiner network problem for the S-Band MMIC applications. A comparative study of the various solutions is presented. This study was used as a selection process for the design of a S-Band power amplifier MMIC that was subsequently fabricated, packaged and tested. Modeled versus measured performance, with respect to the output combiner network, shows very good agreement.

Noise suppression through a reactive surface for 60GHz radios

In todays 60GHz radios large signal to noise ratios are needed due to the high atmospheric losses inherent to 60GHz communications. This paper tackles the isolation of leakage noise from the transmitter to the receiver by means of a reactive surface. We achieved the aforementioned by using a variation of the Artificial Magnetic Conductor (AMC) on a one layer Liquid Crystal Polymer (LCP) substrate. It is proven that in order to achieve noise suppression the artificial material does not require a high-impedance surface.