C. Dua

Evidence of traps creation in GaN/AlGaN/GaN HEMTs after a 3000 hour on-state and off-state hot-electron stress

A long-term 3000-hour test under on-state conditions (VDS =25V, 6W/mm constant dissipated power) and off-state conditions (V DS=46V, VGS=-6V) on GaN/AlGaN/GaN HEMTs is presented. Trapping presence and hot-electrons effect are characterized by means of low-frequency techniques (low-frequency noise measurements, transconductance frequency dispersion, gate-lag). The on-state stress shows the most important degradation. Since our measurements point out to the creation of traps in the gate-to-drain surface region during the stress, this degradation is ascribed to the effect of hot-electrons

Testing the Temperature Limits of GaN-Based HEMT Devices

The high temperature stability of AlGaN/GaN and lattice-matched InAlN/GaN heterostructure FETs has been evaluated by a stepped temperature test routine under large-signal operation. While AlGaN/GaN high-electron mobility transistors (HEMTs) have failed in an operating temperature range of 500°C, InAlN/GaN HEMTs have been operated up to 900°C for 50 h (in vacuum). Failure is thought to be still contact metallization stability related, indicating an extremely robust InAlN/GaN heterostructure configuration.

Mechanisms of RF Current Collapse in AlGaN–GaN High Electron Mobility Transistors

The physical mechanisms underlying RF current- collapse effects in AlGaN-GaN high-electron-mobility transistors are investigated by means of measurements and numerical device simulations. This paper suggests the following conditions: 1) both surface and buffer traps can contribute to RF current collapse through a similar physical mechanism involving capture and emission of electrons tunneling from the gate; 2) surface passivation strongly mitigates RF current collapse by reducing the surface electric field and inhibiting electron injection into traps; 3) for surface-trap densities lower than 9 x 1012 cm-2, surface-potential barriers in the 1-2-eV range can coexist with surface traps having much a shallower energy and, therefore, inducing RF current-collapse effects characterized by relatively short time constants.

Current deep level transient spectroscopy analysis of AlInN/GaN high electron mobility transistors: Mechanism of gate leakage

In order to assess possible mechanisms of gate reverse-bias leakage current in AlInN/GaN high electron mobility transistors (HEMTs) grown by metalorganic chemical-vapor deposition on SiC substrates, temperature-dependent current-voltage measurements combined with Fourier transform current deep level transient spectroscopy (FT-CDLTS) are performed in the temperature range of 200–400 K. In this range of temperature reverse-bias leakage current flow is found to be dominated by Poole–Frenkel emission. Based on CDLTS measurements, a model of leakage current transport via a trap state located at the AlInN/metal interface with an activation energy of 0.37 eV is suggested. The trap nature is shown to be an extended trap, most probably associated with dislocations in the AlInN barrier layer.

A 3000 hours DC Life Test on AlGaN/GaN HEMT for RF and microwave applications

Impressive results have been published for GaN-based transistors for large frequency range. Therefore, both single chip and complete amplification system reliability demonstration is becoming an important subject of concern. In this paper a 3000 hour DC life test is described and the last results derived from the data treatment of this test are presented. The transistor parameters show an evolution strictly related to the biasing point. The High Forward Gate Current test does not present any particular degradation of the transistor characteristics. The most important degradation is observed on the drain saturation current during the High Temperature Operating test. The effect of hot-carriers seems to be the main cause for device degradation.

State of the Art 58W, 38% PAE X-Band AlGaN/GaN HEMTs Microstrip MMIC Amplifiers

This paper presents the results obtained on X-Band GaN MMICs developed in the frame of the Kerrigan project launched by the European Defense Agency. A new step was achieved, 58 W of output power with 38% PAE in X-Band were obtained using an 18 mm 2 2-stages amplifier. To our knowledge, these results present a new state-of-the-art of X-Band MMIC power amplifiers.

Characterization and analysis of trap-related effects in AlGaN-GaN HEMTs

Abstract Traps are characterized in AlGaN–GaN HEMTs by means of DLTS techniques and the associated charge/discharge behavior is interpreted with the aid of numerical device simulations. Under specific bias conditions, buffer traps can produce “false” surface-trap signals, i.e. the same type of current-mode DLTS (I-DLTS) or ICTS signals that are generally attributed to surface traps. Clarifying this aspect is important for both reliability testing and device optimization, as it can lead to erroneous identification of the degradation mechanism, thus resulting in wrong correction actions on the technological process.

Long-term reliability of Ti–Pt–Au metallization system for Schottky contact and first-level metallization on SiC MESFET

Abstract The stability of metal layers on semiconductors is a key issue for the device electrical performances. Therefore, the reliability of SiC/Ti/Pt/Au system was investigated using storage steady-stress testing, AES (Auger Electron Spectrometry), and SIMS (Secondary Ions Mass Spectrometry) analysis. The study was conducted on different patterns for gate and interconnection structure to underline the different reliability problems. Auger and SIMS analysis showed important modifications in the three-metal structure without reactions with the SiC substrate. The resistance degradation was assigned to interdiffusion phenomena. It was analyzed with a diffusion-controlled model. Activation energies and mean time to failure (MTF) were calculated for a failure criterion defined as a 10% increase of the resistance. Finally, the different rules of the metallization degradation in MESFET behaviours for interconnections and gate were discussed.

InAlN/GaN HEMTs for Operation in the 1000 Regime: A First Experiment

GaN-based heterostructures, and here, particularly, the lattice matched InAlN/GaN configuration, possess high chemical and thermal stability. Concentrating on refractory metal contact schemes, HEMT devices have been fabricated allowing high-temperature 1-MHz large-signal operation at 1000°C (in vacuum) for 25 h. Despite slow gate contact degradation, major degradation of the heterostructure could not be observed. Extrapolation of the RF characteristics suggests that operation up to gigahertz frequencies at this temperature may be feasible.

AlGaN/GaN HEMT Reliability Assessment by means of Low Frequency Noise Measurements

Although impressive results have been published for GaN-based transistors in a large frequency range reliability demonstration is becoming an important subject of concern. In this article the conditions of a long term DC life test is presented and a detailed description of pre- and post-test characterization by means of Low Frequency Noise measurements (LFN) is discussed. The transistor parameters (IDSS, Ron, Vp) and the drain noise spectra presented an evolution strictly related to the biasing point during the stress. This demonstrates that LFN measurement is a useful tool to investigate degradation in GaN HEMTs.