C. P. Kuo

Activation energies of Si donors in GaN

The electronic properties of Si donors in heteroepitaxial layers of GaN were investigated. The n‐type GaN layers were grown by metalorganic chemical vapor deposition and either intentionally doped with Si or unintentionally doped. The samples were evaluated by variable temperature Hall effect measurements and photoluminescence (PL) spectroscopy. For both types of samples the n‐type conductivity was found to be dominated by a donor with an activation energy between 12 and 17 meV. This donor is attributed to Si atoms substituting for Ga in the GaN lattice (SiGa). The range of activation energies is due to different levels of donor concentrations and acceptor compensation in our samples. The assignment of a PL signature to a donor–acceptor pair recombination involving the Si donor level as the initial state of the radiative transition yields the position of the optical Si donor level in the GaN bandgap at ∼Ec–(22±4) meV. A deeper donor level is also present in our GaN material with an activation energy of ∼3...

Very high‐efficiency semiconductor wafer‐bonded transparent‐substrate (AlxGa1−x)0.5In0.5P/GaP light‐emitting diodes

Data are presented demonstrating the operation of transparent‐substrate (TS) (AlxGa1−x)0.5In0.5P/GaP light‐emitting diodes (LEDs) whose efficiency exceeds that afforded by all other current LED technologies in the green to red (560–630 nm) spectral regime. A maximum luminous efficiency of 41.5 lm/W (93.2 lm/A) is realized at λ∼604 nm (20 mA, direct current). The TS (AlxGa1−x)0.5In0.5P/GaP LEDs are fabricated by selectively removing the absorbing n‐type GaAs substrate of a p‐n (AlxGa1−x)0.5In0.5P double heterostructure LED and wafer bonding a ‘‘transparent’’ n‐GaP substrate in its place. The resulting TS (AlxGa1−x)0.5In0.5P/GaP LED lamps exhibit a twofold improvement in light output compared to absorbing‐substrate (AS) (AlxGa1−x)0.5In0.5P/GaAs lamps.

HIGH PERFORMANCE ALGAINP VISIBLE LIGHT-EMITTING DIODES

The performance of surface‐emitting visible AlGaInP light‐emitting diodes (LEDs) is described. The devices have external quantum efficiencies greater than 2% and luminous efficiencies of 20 lm/A in the yellow (590 nm) spectral region. This performance is roughly ten times better than existing yellow LEDs and is comparable to the highest performance red AlGaAs LEDs currently available. The devices also perform favorably compared to existing devices in the orange and green spectral regions. Low‐pressure organometallic vapor phase epitaxy (OMVPE) is used to grow the epitaxial layers. The devices consist of a double heterostructure with an AlGaInP active region grown on a GaAs substrate.

Twofold efficiency improvement in high performance AlGaInP light-emitting diodes in the 555-620 nm spectral region using a thick GaP window layer

AlGaInP light‐emitting diodes (LEDs) with external quantum efficiencies ≥6% and luminous performance of 20 lm/W have been fabricated. These LEDs are twice as efficient as previously reported AlGaInP devices throughout the spectral region from green (555 nm) to red‐orange (620 nm) owing to a thicker GaP window layer (45 vs 15 μm). Using hydride vapor phase epitaxy, thick GaP window layers were grown on top of AlGaInP double heterostructures grown by organometallic vapor phase epitaxy. The efficiency of the LEDs was found to improve as the thickness of the window layer was increased from 9 to 63 μm. This improvement is predicted by a simple model that considers the benefit of enhanced emission through the sides of the thick window. The effect of emission wavelength on quantum efficiency and luminous performance for AlGaInP LEDs with a 45 μm thick window has been studied.

A study of parasitic reactions between NH 3 and TMGa or TMAl

The growth of AlGaN using organometallic vapor phase epitaxy has been studied as a function of reactor pressure in a horizontal reactor. At atmospheric pressure, GaN with growth efficiency comparable to that of GaAs in the same reactor is obtained. In addition, the GaN growth efficiency changes little at different reactor pressures. These results indicate that the parasitic reaction between TMGa and NH3 is not substantial in the reactor used in this study. On the other hand, A1N growth at atmospheric pressure has not been possible. By lowering the reactor pressure below 250 Torr, A1N deposition is achieved. However, the growth efficiency decreases at higher reactor pressures and higher growth temperatures, indicating that a strong parasitic reaction occurs between TMAI and NH3. For the ternary AlGaN, lower pressure also leads to more Al incorporation. The results indicate that parasitic reactions are much more severe for TMAI+NH3 than for TMGa+NH3.

Recombination dynamics in InGaN quantum wells

Transient photoluminescence measurements are reported on a thin InGaN single quantum well, encompassing the high injection regime. The radiative processes that dominate the recombination dynamics, especially at low temperatures, show the impact of localized electronic states that are distributed over a large energy range (∼100 meV). We suggest that these states originate from microstructural disorder in the InGaN/GaN system.

Dislocation reduction in GaN thin films via lateral overgrowth from trenches

A technology to reduce the dislocation density in GaN thin films by lateral overgrowth from trenches (LOFT) is reported. In LOFT, a GaN thin film was grown on sapphire substrate first, then trenches were formed into the thin film by etching. GaN material was regrown laterally from the trench sidewalls to form a continuous thin film. The average surface density of threading dislocations is reduced from 8×109/cm2 in the first GaN thin film to 6×107/cm2 in the regrown GaN thin film.

Properties and use on In 0.5 (Al x Ga 1-x ) 0.5 P and Al x Ga 1-x As native oxides in heterostructure lasers

Data are presented demonstrating the formation of native oxides from high Al composition In0.5(AlxGa1-x)0.5P (x≳ 0.9) by simple annealing in a “wet” ambient. The oxidation occurs by reaction of the high Al composition crystal with H2O vapor (in a N2 carrier gas) at elevated temperatures (≥500° C) and results in stable transparent oxides. Secondary ion mass spectrometry (SIMS) as well as scanning and transmission electron microscopy (SEM and TEM) are employed to evaluate the oxide properties, composition, and oxide-semiconductor interface. The properties of native oxides of the In0.5(AlxGa1-x)0.5P system are compared to those of the AlxGa1-xAs system. Possible reaction mechanisms and oxidation kinetics are considered. The In0.5(AlxGa1-x)0.5P native oxide is shown to be of sufficient quality to be employed in the fabrication of stripe-geometry In0.5(AlxGa1-x)0.5P visible-spectrum laser diodes.

Impurity‐induced layer disordering of high gap Iny(AlxGa1−x)1−yP heterostructures

Data are presented showing the impurity‐induced layer disordering (IILD), via low‐temperature (600–675 °C) Zn diffusion, of In0.5(AlxGa1−x)0.5P quantum well heterostructures and an In0.5Al0.2Ga0.3P‐GaAs heterojunction grown using metalorganic chemical vapor deposition. Secondary ion mass spectroscopy, transmission electron microscopy, and photoluminescence are used to confirm IILD, which occurs via atom intermixing on the column III site aided by column‐III‐atom interstitials. In addition, high‐temperature anneals (800–850 °C) are performed on the same crystals to confirm the thermal stability of the heterointerfaces.

Native‐oxide stripe‐geometry In0.5(AlxGa1−x)0.5P‐In0.5Ga0.5P heterostructure laser diodes

Data are presented demonstrating the formation of stable, device‐quality native oxides from high Al composition In0.5(AlxGa1−x)0.5P (x ∼0.9) via reaction with H2O vapor (in N2 carrier gas) at elevated temperatures (≥500 °C). The oxide exhibits excellent current‐blocking characteristics and is employed to fabricate continuous room‐temperature stripe‐geometry In0.5(AlxGa1−x)0.5P‐In0.5Ga0.5P double‐heterostructure laser diodes.