Charan Gurumurthy

Method of forming through-silicon vias with stress buffer collars and resulting devices

Method of forming a multilayer substrate core structure using sequential microvia laser drilling and substrate core structure formed according to the method

Integrated circuit package with low modulus layer and capacitor/interposer

Embedding device in substrate cavity

Method of using micro-contact imprinted features for formation of electrical interconnects for substrates

Inter-firms collaboration of joint venture in IC foundry business

System, apparatus, and method for advanced solder bumping

Doping of lead-free solder alloys and structures formed thereby

Method of Forming a Substrate Core Structure Using Microvia Laser Drilling and Conductive Layer Pre-Patterning And Substrate Core Structure Formed According to the Method

SUBSTRATE PACKAGE WITH THROUGH HOLES FOR HIGH SPEED I/O FLEX CABLE