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Chender Huang

TSMC

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Publication

Featured researches published by Chender Huang.

Archive | 2002

Electrical performance enhanced wafer level chip scale package with ground

Pei-Haw Tsao; Chender Huang; Jones Wang; Ken Chen; Hank Huang

Archive | 2002

Method of wafer level chip scale packaging

Chender Huang; Pei-Haw Tsao; Jones Wang; Ken Chen

Archive | 2003

Under bump metallization structure

Chung Yu Wang; Chender Huang; Pei-Haw Tsao; Ken Chen; Hank Huang

Archive | 2002

Method of protecting a passivation layer during solder bump formation

Chung-Yu Wang; Chender Huang; Pei-Haw Tsao; Ken Chen; Hank Huang

Archive | 2003

METHOD FOR FABRICATING AN UNDER BUMP METALLIZATION STRUCTURE

Chung Yu Wang; Chender Huang; Pei-Haw Tsao; Ken Chen; Hank Huang

Archive | 2004

Structure and method for low-stress concentration solder bumps

Chung Yu Wang; Chender Huang; Pei Haw Tsao; Ken Chen; Hank Huang

Archive | 2001

Metal patterned structure for SiN surface adhesion enhancement

Chung-Yu Wang; Chender Huang; Pei-Haw Tsao; Ken Chen

Archive | 2001

Matrix form semiconductor package substrate having an electrode of serpentine shape and method for forming

Pei-Haw Tsao; Chender Huang; Chung-Yu Wang

Archive | 2001

Method for stress reduction in flip chip bump during flip chip mounting and underfill process steps of making a microelectronic assembly

Pei-Haw Tsao; Chender Huang; Jones Wang; Ken Chen

Archive | 2002

Method for protecting the front side of semiconductor wafers

Pei-Haw Tsao; Chender Huang; Jones Wang; Ken Chen; Hank Huang

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Collaboration

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Pei-Haw Tsao

TSMC

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Ken Chen

TSMC

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Hank Huang

TSMC

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Jones Wang

TSMC

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Chung Yu Wang

TSMC

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Chung-Yu Wang

TSMC

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Chih-chiang Chen

TSMC

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Wen Sze Huang

TSMC

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