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Dive into the research topics where Pei-Haw Tsao is active.

Publication


Featured researches published by Pei-Haw Tsao.


Archive | 2002

Electrical performance enhanced wafer level chip scale package with ground

Pei-Haw Tsao; Chender Huang; Jones Wang; Ken Chen; Hank Huang


Archive | 2002

Method of wafer level chip scale packaging

Chender Huang; Pei-Haw Tsao; Jones Wang; Ken Chen


Archive | 2003

Under bump metallization structure

Chung Yu Wang; Chender Huang; Pei-Haw Tsao; Ken Chen; Hank Huang


Archive | 2001

Method of fabricating as grooved heat spreader for stress reduction in an IC package

Pei-Haw Tsao; Jones Wang; Ken Chen


Archive | 2002

Method of protecting a passivation layer during solder bump formation

Chung-Yu Wang; Chender Huang; Pei-Haw Tsao; Ken Chen; Hank Huang


Archive | 2003

METHOD FOR FABRICATING AN UNDER BUMP METALLIZATION STRUCTURE

Chung Yu Wang; Chender Huang; Pei-Haw Tsao; Ken Chen; Hank Huang


Archive | 2001

Metal patterned structure for SiN surface adhesion enhancement

Chung-Yu Wang; Chender Huang; Pei-Haw Tsao; Ken Chen


Archive | 2001

Matrix form semiconductor package substrate having an electrode of serpentine shape and method for forming

Pei-Haw Tsao; Chender Huang; Chung-Yu Wang


Archive | 2001

Method for stress reduction in flip chip bump during flip chip mounting and underfill process steps of making a microelectronic assembly

Pei-Haw Tsao; Chender Huang; Jones Wang; Ken Chen


Archive | 2002

Method for protecting the front side of semiconductor wafers

Pei-Haw Tsao; Chender Huang; Jones Wang; Ken Chen; Hank Huang

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