Cheng-Hung Tsai

Implementation of advanced 10Gb/s optical transceiver module

This paper deals with the implementation of advanced 10 Gb/s optical transceiver module. Highly integrated functions such as multi-rate, system managed and optical diagnostic mode in the XFP optical module design is presented. The attractive features of XFP such smaller package size, lower power consumption and simplified serial to serial architecture makes it possible for designers to shrink and be more flexible with the printed circuit board area of the transceiver module. A transmission distance of 100 m was achieved (as defined in 10Gbase-SR in 10Gb/s ethernet standard) as well as the system monitor control ability.

High manufacturability and thermal stability mini-flat transmitter for 10Gb/s Ethernet applications

In this paper, the authors have demonstrated a low cost, highly manufacturable and thermally stable mini-transmitter for 10 Gb/s Ethernet applications. A novel two lens semi-passive alignment structure of 10 Gb/s 1310 nm SC receptacle or pigtail type optical mini-flat transmitter are designed and demonstrated to exhibit about 35% coupling efficiency with a /spl plusmn/5 /spl mu/m accuracy flip chip bonder general silicon optical bench process (SiOB) and packaging flow. Moreover, a high resistivity SiOB (1k/spl Omega//cm) and pressure-free bonding technique, using electroplated gold-tin solder, are also adopted to guarantee the transmitted performance in high speed operation. The eye diagram of the transmitter shows an excellent quality, passing the 10 Gb/s Ethernet mask test with 30% margin. The extinction ratio of the transmitter is also proved to above 6 dB at room temperature. The optical eye diagram shows excellent eye quality, passing the 10 Gb/s Ethernet mask test from 0/spl deg/C to 80/spl deg/C. Finally, the reliability of the transmitter is also evaluated in this paper.

Low-cost and highly manufacturable 10Gb/s mini-flat transmitter for ethernet applications

The key issues of local-area-network (LAN) and storage-area-network (SAN) applications are to improve cost, manufacturability and reliability of optoelectronic devices in high speed transmission. The authors have demonstrated highly manufacturability, reliability and thermal stability mini-transmitter for 10Gb/s Ethernet applications in this paper. Passive alignment technology is a way to improve manufacturability of optoelectronic devices in the future. However, the assembly yield rate of conventional LD chip on silicon optical bench to fiber is quite limited due to restricted optical alignment tolerance (< 1μm). In this study, a novel two lens structure of 10Gb/s LC receptacle type optical mini-flat transmitter is designed and demonstrated to exhibit above 20% coupling efficiency with less than ±6um aligned deviation. Moreover, a high resistivity silicon optical bench (1kΩ/cm) and pressure-free bonding technique using the electroplated AuSn solder are also adopted to guarantee the transmitted performance in high frequency operation. The eye diagram of 10Gb/s mini-flat transmitter developed in this study showing the excellent quality obtained passing 10Gb/s Ethernet mask test with 20% margin. And the extinction ratio of transmitter is also proved to above 6dB at room temperature. The response of monitor PD is also examined up to 80% by mirror coating on silicon V-groove. Thermal stability of 10Gb/s mini-flat transmitter is another critical issue in high speed transmission. The performance of temperature stabilized transmitter over wide case temperature range is also evaluated in this study. The optical eye diagram of 10Gb/s transmitter developed in this paper showing excellent eye quality passing 10Gb/s Ethernet mask test between 0°C to 80°C. Finally, the reliability of transmitter is also performed. The reliability data indicate that the optical alignment of these modules are stable and observed essentially low variations in optical coupling as results of 1000 hours damp heat and 1000 temperature cycling durations.

Manufacturability and reliability on 10-Gb/s transponder for ethernet-based applications

In this paper, manufacturing issues include Optical Sub-Assembly (OSA), Electrical Sub-Assembly (ESA) and reliability considerations of 10 Gb/s Ethernet transponder were studied by using experiments and implementation. In the growing optical communication industry, one of the star products is the Z-axis pluggable optical transceiver module. Under the broad usage of Ethernet means high port density, low cost, high utilities, compact size and still require excellent performance. After standardizing of 10 Gb/s ethernet (IEEE 802.3ae), many transceiver companies, silicon vendors and system vendors reached the agreement and signed up diversity of MSA (Multi-Source Agreement). These MSAs still keep modifying with system demands, customer requirements, cost and performance issue. This paper presents how to achieve these functions description in the MSA and own a highly manufacturability and reliability module design. According to composed block of transponder, we split it into OSA, ESA, mechanical design and related reliability experimental result. In the OSA, traditional TO-CAN package and optical components be introduced. Because the mature manufacture experience, vendor can easy to meet low cost and manufacturability requirements and only need to slightly modifications. A simply solution be implemented to solve this problem and discuss the critical point of the design. Thermal issue on OSA will also be mentioned because of the sensitive of light source and how to calculate the effect to find effective solutions. By the way, some manufacturability criteria will be discussed for OSA characteristics in 10 Gb/s applications. In the ESA, PMD (Physical media dependant) driving methods, Multi-Source Agreement related digital optical monitor function implement and performance comparison will be presented. On the other hand, we will examine the crosstalk effect between transmitter and receiver circuit and impact to the module Optical to Electrical convert interface design. We still need to take well-assembly between OSA and ESA into consideration. Perfect assembly will lead us to earn wonderful reliability and manufacturability. In the mechanical design, many reliability and maufacturability issue need to consider such as thermal, EMI, temperature, humidity effect etc. So, module mechanical design must be highly collocation with ESA, OSA, heat spreader and special EMI shielding design. Experimental data and thermal simulation result are also prepared to guide us forward to a successful product.

Low-cost and highly reliable optoelectronic devices for 10-Gb/s ethernet applications

With the drastic expansion of internet usage, the demand of 10Gbps transmission optoelectronic devices for local-area-network (LAN) and storage-area-network (SAN) are increasing. The key issues of these applications are to improve cost, manufacturability and reliability of optoelectronic devices in high speed transmission. The authors have demonstrated highly manufacturable and reliable optical front end and trasneiver module for 10Gbps Ethernet applications in this paper. TO-Can package is a way to reduce cost of 10Gbps optical assembly. However, the signal integrity of high speed transmitter optical sub-assembly (TOSA) and receiver optical sub-assembly (ROSA) are limited due to the mismatched characteristic impedance, parasitic inductance and spread capacitance of conventional TO-Can package. In this paper, high performance and high sensitivity of 10Gbps TOSA and ROSA with TO-Can package are discussed and demonstrated to overcome the critical issues mentioned, respectively. In order to improve the signal integrity and manufacturability of 10Gbps OSA in 10Gigabit Ethernet small form factor transceiver module assembly. The authors also integrate high speed flex board and OSA package to extend the signal path, and to minimize the effect of crosstalk in module. The high speed transceiver modules with TO-Can package embedded compliant with XFP multi-source agreement (MSA) are also demonstrated in this paper. The performance of temperature-stabilized transceiver module over awide case temperature range is tested. The optical eye diagram of 10Gbps transmitter developed in this study shows an excellent quality passing the 10Gbps Ethernet mask test between 0 degrees Centigrade and to 70 degrees Centigrade. Finally, the reliability tests regulated by Telcordia GR-468-CORE and MIL-STD-883 are also performed and certified to pave the ways of highly manufacturable and reliable XFP transceiver modules for 10Gbps Ethernet applications.

Implementation of system-accommodated 10 Gb/s optical transponder

In this paper feasibility of XENPAK optical transponder and its outstanding characteristics are discussed and tested. For10 Gb/s network system, XENPAK appears superior data processing ability such as the combination of serializer and deserializer, channel codec and XGMII extender sub-layer (XGXS).