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Dive into the research topics where Cheng Ming-Da is active.

Publication


Featured researches published by Cheng Ming-Da.


Archive | 2011

Integrated circuit devices and method of forming a bump structure

Lu Wen-Hsiung; Cheng Ming-Da; Lin Chih-Wei; Chang Jacky; Liu Chung-Shi; Yu Chen-Hua


Archive | 2016

RDL-FIRST PACKAGING PROCESS

Lin Chih-Wei; Chen Shing-Chao; Chen Meng-Tse; Cheng Ming-Da; Liu Chung-Shi


Archive | 2014

Package on package structure, package structure and method of forming the same

Lin Chun-Cheng; Lin Hsiu-Jen; Chen Cheng-Ting; Chen Wei-Yu; Cheng Ming-Da; Liu Chung-Shi


Archive | 2016

Semiconductor packages having polymer-containing substrates and methods of forming same

Chen Meng-Tse; Lin Chih-Wei; Lin Chun-Cheng; Lu Wen-Hsiung; Cheng Ming-Da; Liu Chung-Shi


Archive | 2015

Packaged semiconductor devices, package-on-package device and methods of packaging semiconductor devices

Yu Chen-Hua; Liu Chung-Shi; Huang Chih-Fan; Lin Chih-Wei; Lin Wei-Hung; Cheng Ming-Da


Archive | 2013

Packaged semiconductor device and package for semiconductor device and method of packaging semiconductor device

Lin Chih-Wei; Cheng Ming-Da; Lu Wen-Hsiung; Lin Hsiu-Jen; Jang Bor-Ping; Liu Chung-Shi; Lii Mirng-Ji; Yu Chen-Hua; Chen Meng-Tse; Lin Chun-Cheng; Tsai Yu-Peng; Huang Kuei-Wei; Lin Wei-Hung


Archive | 2012

Bump structure on a substrate and method for manufacturing the same

Cheng Ming-Da; Lu Wen-Hsiung; Lin Chih-Wei; Chen Ching-Wen; Wu Yi-Wen; Chang Chia-Tung; Ho Ming-Che; Liu Chung-Shi


Archive | 2011

Wafer-level reflow apparatuses and fabrication methods for solder balls and flip chip assemblies

Liu Nai-Shuo; Ho Ming-Che; Cheng Ming-Da; Liu Chung-Shi


Archive | 2018

METHOD OF MANUFACTURING WAFER LEVEL CHIP SCALE PACKAGE

Hu Yu-Hsiang; Chen Wei-Yu; Kuo Hung-Jui; Lin Wei-Hung; Cheng Ming-Da; Liu Chung-Shi


Archive | 2018

Manufacturing method of interconnect structure

Chen Meng-Tse; Lin Hsiu-Jen; Lin Chih-Wei; Cheng Ming-Da; Tung Chih-Hang; Liu Chung-Shi

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