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Liu Chung-Shi

TSMC

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Publication

Featured researches published by Liu Chung-Shi.

Archive | 2011

Integrated circuit device and packaging assembly

Hwang Chien-Ling; Wu Yi-Wen; Wang Chun-Chieh; Liu Chung-Shi

Archive | 2006

Robust copper interconnection structure and fabrication method thereof

Liu Chung-Shi

Archive | 2013

Semiconductor chip and manufacturing method thereof

Hwang Chien-Ling; Huang Ying-Jui; Lim Zheng-Yi; Lei Yi-Yang; Lin Cheng-Chung; Liu Chung-Shi

Archive | 2011

Integrated circuit devices and method of forming a bump structure

Lu Wen-Hsiung; Cheng Ming-Da; Lin Chih-Wei; Chang Jacky; Liu Chung-Shi; Yu Chen-Hua

Archive | 2016

RDL-FIRST PACKAGING PROCESS

Lin Chih-Wei; Chen Shing-Chao; Chen Meng-Tse; Cheng Ming-Da; Liu Chung-Shi

Archive | 2014

Package on package structure, package structure and method of forming the same

Lin Chun-Cheng; Lin Hsiu-Jen; Chen Cheng-Ting; Chen Wei-Yu; Cheng Ming-Da; Liu Chung-Shi

Archive | 2013

Method of bonding chips

Hwang Chien Ling; Huang Ying-Jui; Lin Cheng-Chung; Liu Chung-Shi

Archive | 2013

Method for fabricating an integrated circuit device

Liu Chung-Shi; Yu Chen-Hua

Archive | 2016

Semiconductor packages having polymer-containing substrates and methods of forming same

Chen Meng-Tse; Lin Chih-Wei; Lin Chun-Cheng; Lu Wen-Hsiung; Cheng Ming-Da; Liu Chung-Shi

Archive | 2015

Packaged semiconductor devices, package-on-package device and methods of packaging semiconductor devices

Yu Chen-Hua; Liu Chung-Shi; Huang Chih-Fan; Lin Chih-Wei; Lin Wei-Hung; Cheng Ming-Da

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Collaboration

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Yu Chen-Hua

TSMC

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Cheng Ming-Da

TSMC

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Chen Meng-Tse

TSMC

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Tsai Hao-Yi

TSMC

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Kuo Hung-Jui

TSMC

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Lin Chih-Wei

TSMC

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Lin Wei-Hung

TSMC

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Lin Hsiu-Jen

TSMC

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Chen Wei-Yu

TSMC

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Huang Hui-Min

TSMC

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