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g-Ting Chen

TSMC

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Publication

Featured researches published by g-Ting Chen.

Archive | 2013

System and Method for an Improved Fine Pitch Joint

Cheng-Ting Chen; Wen-Hsiung Lu; Ming-Da Cheng; Chung-Shi Liu; Mirng-Ji Lii

Archive | 2013

Apparatus and Method for Wafer Separation

Yu-Peng Tsai; Wen-Hsiung Lu; Cheng-Ting Chen; Hsien-Wei Chen; Ming-Da Cheng; Chung-Shi Liu

Archive | 2014

Package on package structure and method of manufacturing the same

Chun-Cheng Lin; Hsiu-Jen Lin; Cheng-Ting Chen; Wei-Yu Chen; Ming-Da Cheng; Chung-Shi Liu

Archive | 2010

Plasma Treatment for Semiconductor Devices

Chen-Fa Lu; Chung-Shi Liu; Chen-Hua Yu; Wei-Yu Chen; Cheng-Ting Chen

Archive | 2013

Interconnect Joint Protective Layer Apparatus and Method

Cheng-Ting Chen; Hsuan-Ting Kuo; Hsien-Wei Chen; Wen-Hsiung Lu; Ming-Da Cheng; Chung-Shi Liu

Archive | 2012

Stud bump structure for semiconductor package assemblies

Meng-Tse Chen; Hsiu-Jen Lin; Chih-Wei Lin; Cheng-Ting Chen; Ming-Da Cheng; Chung-Shi Liu

Archive | 2014

System and Method for Fine Pitch PoP Structure

Cheng-Chung Lin; Hsiu-Jen Lin; Cheng-Ting Chen; Chun-Cheng Lin; Ming-Da Cheng; Chung-Shi Liu

Archive | 2013

Semiconductor packaging and manufacturing method thereof

Hsiu-Jen Lin; Wen-Hsiung Lu; Cheng-Ting Chen; Hsuan-Ting Kuo; Wei-Yu Chen; Ming-Da Cheng; Chung-Shi Liu

Archive | 2012

Warpage Control in the Packaging of Integrated Circuits

Ming-Da Cheng; Hsiu-Jen Lin; Cheng-Ting Chen; Wei-Yu Chen; Chien-Wei Lee; Chung-Shi Liu

Archive | 2010

System and method to reduce pre-back-grinding process defects

Chen-Fa Lu; Cheng-Ting Chen; James Hu; Chung-Shi Liu

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Collaboration

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Chung-Shi Liu

TSMC

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Ming-Da Cheng

TSMC

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Hsiu-Jen Lin

TSMC

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Wen-Hsiung Lu

TSMC

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Wei-Yu Chen

TSMC

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Chen-Fa Lu

TSMC

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Chun-Cheng Lin

TSMC

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Hsien-Wei Chen

TSMC

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Chih-Wei Lin

TSMC

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Hsuan-Ting Kuo

TSMC

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