Chih-Hung Pan

A low-temperature wafer bonding technique using patternable materials

In this paper we present a silicon wafer bonding technique for 3D microstructures using MEMS process technology. Photo-definable material with patternable characteristics served as the bonding layer between the silicon wafers. A bonding process was developed and several types of photo-definable material were tested for bonding strength and pattern spatial resolution. The results indicated that SU-8 is the best material with a bonding strength of up to 213 kg cm−2 (20.6 MPa), and a spatial resolution of 10 μm, at a layer thickness of up to 100 μm. The low-temperature bonding technique that is presented is particularly suitable for microstructure and microelectronics integration involved in MEMS packaging.

Physical and chemical mechanisms in oxide-based resistance random access memory

In this review, we provide an overview of our work in resistive switching mechanisms on oxide-based resistance random access memory (RRAM) devices. Based on the investigation of physical and chemical mechanisms, we focus on its materials, device structures, and treatment methods so as to provide an in-depth perspective of state-of-the-art oxide-based RRAM. The critical voltage and constant reaction energy properties were found, which can be used to prospectively modulate voltage and operation time to control RRAM device working performance and forecast material composition. The quantized switching phenomena in RRAM devices were demonstrated at ultra-cryogenic temperature (4K), which is attributed to the atomic-level reaction in metallic filament. In the aspect of chemical mechanisms, we use the Coulomb Faraday theorem to investigate the chemical reaction equations of RRAM for the first time. We can clearly observe that the first-order reaction series is the basis for chemical reaction during reset process in the study. Furthermore, the activation energy of chemical reactions can be extracted by changing temperature during the reset process, from which the oxygen ion reaction process can be found in the RRAM device. As for its materials, silicon oxide is compatible to semiconductor fabrication lines. It is especially promising for the silicon oxide-doped metal technology to be introduced into the industry. Based on that, double-ended graphene oxide-doped silicon oxide based via-structure RRAM with filament self-aligning formation, and self-current limiting operation ability is demonstrated. The outstanding device characteristics are attributed to the oxidation and reduction of graphene oxide flakes formed during the sputter process. Besides, we have also adopted a new concept of supercritical CO2 fluid treatment to efficiently reduce the operation current of RRAM devices for portable electronic applications.

Direct-write PVDF nonwoven fiber fabric energy harvesters via the hollow cylindrical near-field electrospinning process

One-dimensional piezoelectric nanomaterials have attracted great attention in recent years for their possible applications in mechanical energy scavenging devices. However, it is difficult to control the structural diameter, length, and density of these fibers fabricated by micro/nano-technologies. This work presents a hollow cylindrical near-field electrospinning (HCNFES) process to address production and performance issues encountered previously in either far-field electrospinning (FFES) or near-field electrospinning (NFES) processes. Oriented polyvinylidene fluoride (PVDF) fibers in the form of nonwoven fabric have been directly written on a glass tube for aligned piezoelectricity. Under a high in situ electrical poling field and strong mechanical stretching (the tangential speed on the glass tube collector is about 1989.3 mm s−1), the HCNFES process is able to uniformly deposit large arrays of PVDF fibers with good concentrations of piezoelectric β-phase. The nonwoven fiber fabric (NFF) is transferred onto a polyethylene terephthalate (PET) substrate and fixed at both ends using copper foil electrodes as a flexible textile-fiber-based PVDF energy harvester. Repeated stretching and releasing of PVDF NFF with a strain of 0.05% at 7 Hz produces a maximum peak voltage and current at 76 mV and 39 nA, respectively.

Characteristics of hafnium oxide resistance random access memory with different setting compliance current

In this Letter, the characteristics of set process of hafnium oxide based resistance random access memory are investigated by different set processes with increasing compliance current. Through current fitting, carrier conduction mechanism of low resistance state changes from hopping to surface scattering and finally to ohmic conduction with the increase of setting compliance current. Experimental data of current-voltage measurement under successive increasing temperature confirms the conduction mechanism transition. A model of filament growth is eventually proposed in a way by merging discrete metal precipitates and electrical field simulation by comsol Multiphysics further clarifies the properties of filament growth process.

Hopping effect of hydrogen-doped silicon oxide insert RRAM by supercritical CO 2 fluid treatment

In this letter, we introduced hydrogen ions into titanium metal doped into SiO2 thin film as the insulator of resistive random access memory (RRAM) by supercritical carbon dioxide (SCCO)2 fluid treatment. After treatment, low resistance state split in to two states, we find the insert RRAM, which means it has an operating polarity opposite from normal RRAM. The difference of the insert RRAM is owing to the resistive switching dominated by hydrogen ions, dissociated from OH bond, which was not by oxygen ions as usual. The current conduction mechanism of insert RRAM was hopping conduction due to the metal titanium reduction reaction through SCCO2.

Low Temperature Improvement Method on

To improve the resistive switching properties of the resistive random access memory (RRAM), the supercritical carbon dioxide (SCCO₂) fluid is used as a low temperature treatment. In this letter, the Zn:SiO<i>x</i> thin films are treated by SCCO₂ fluid mixed with pure water. After SCCO₂ fluid treatment, the resistive switching qualities of the Zn:SiO_x thin films are carried out by XPS, fourier transform infrared spectroscopy, and IV measurement. We believe that the SCCO₂-treated Zn:SiO_x thin film is a proresistive switching properties mising material for RRAM applications due to its compatibility with portable flat panel display.

{\rm Zn{:}SiO}_{x}

Incorporation of nitrogen as an oxygen-confining layer in the resistance switching reaction region is investigated to improve the reliability of resistance random access memory (RRAM). The switching mechanism can be attributed to the formation and rupture of conduction filaments. A compatible WSiON (around 5 nm) layer is introduced at the interface of tungsten silicon oxide (WSiOx) and TiN electrode to prevent the randomly diffusing oxygen ions surpassing the storage region of the WSiON layer. The double-layer WSiOx/WSiON memory structure would enhance the endurance over 100 times so as to better confirm the WSiOx RRAM application of nonvolatile memory.

Resistive Random Access Memory Devices

The paper presents a new silicon wafer bonding technique. The high-resolution bonding pad is defined through photolithography process. Photosensitive materials with patternable characteristics are served as the adhesive intermediate bonding layer between the silicon wafers. Several types of photosensitive materials such as SU-8 (negative photoresist), AZ-4620 (positive photoresist), SP341 (polyimide), JSR (negative photoresist) and BCB (benzocylbutene) are tested and characterized for their bonding strength. An infrared (IR) imaging system is established to examine the bonding results. The results indicate that SU-8 is the best bonding material with a bonding strength up to 213 kg/cm 2 (20.6 MPa) at bonding temperature less than 90 C. The resolution of bonding pad of 10 lm can be achieved. The developed low temperature bonding technique is particularly suitable for the integration of microstructures and microelectronics involved in MEMS and VLSI packaging processes. 2004 Published by Elsevier Ltd.

Endurance Improvement Technology With Nitrogen Implanted in the Interface of

Indium-tin-oxide (ITO) is investigated as the top electrode material in HfO2-based resistive random access memory cells. Experimental results show that in contrast to a metal (Pt) electrode, an ITO electrode provides for self-limiting current flow during the forming and SET processes, so that no compliance limit is necessary. This provides for low-power consumption, high endurance (>107 cycles), and short SET/RESET transition times (~50 ns). We propose that this is because ITO is an oxygen-vacancy-rich material, providing bulk storage for oxygen ions rather than surface storage as a metal electrode.

{\rm WSiO}_{\bf x}

We have previously investigated the automatic current compliance property for indium tin oxide (ITO) resistance random access memory (RRAM). Traditionally, for the purpose of protecting RRAM, it is necessary to set equipment current compliance during the set and forming processes of RRAM devices. ITO RRAM devices, however, have an intrinsic capability to limit their current. This letter examines this ITO RRAM current compliance in depth by applying a varied stop-voltage measurement method, where different negative stop voltages were adopted to manipulate oxygen ions. Combined with material analysis and conduction current fitting, a model was established.