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Featured researches published by Chiho Kim.


Microelectronics Reliability | 2018

Effect of solder resist dissolution on the joint reliability of ENIG surface and Sn–Ag–Cu solder

Hyunju Lee; Cheolmin Kim; Cheolho Heo; Chiho Kim; Jae-Ho Lee; Yangdo Kim

Abstract The electroless nickel immersion gold (ENIG) process results in surface defects, such as pinholes and black pads, which weaken the solder joint and eventually degrade the reliability of the PCB. Contamination of the plating solutions, including dissolution of the solder resist (SR), can be a cause of the pinholes and black pads. This study examined the effects of SR dissolution on the solder joint reliability and electroless Ni plating properties. Electroless Ni plating was performed by adding 1 to 10 ppm hardener (melamine) to the fresh Ni solution. Many black pads were observed in the 7 and 10 ppm hardener-added surfaces. In addition, the content of P was highest when 7 and 10 ppm hardener was added. The ball shear tests were carried out to confirm the joint reliability between the ENIG surface with hardener-added and the Sn-3.0Ag-0.5Cu solder (SAC 305). The ball shear strength decreased with increasing dissolution of the hardener. In particular, the shear strength was the lowest at 7 and 10 ppm hardener addition. In addition, the failure mode of the solder joint was changed from ductile to brittle mode with increasing hardener addition. That is, as the hardener additive increases, intermetallic compound (IMC) phases were changed from (Cu,Ni)6Sn5 to (Cu,Ni)3Sn4 and Cu6Sn5 (brittle structure).


Journal of Welding and Joining | 2015

A comparative study of constant current control and adaptive control on electrode life time for resistance spot welding of galvanized steels

Jeong-Chul Seo; Ildong Choi; Hong-Rea Son; Chang-Wook Ji; Chiho Kim; Sung-Bu Suh; Jinseok Seo; Yeong-Do Park

With using adaptive control of the resistance spot welding machine, the advantage on electrode life time for galvanized steels has been addressed. This study was aimed to evaluate the electrode life time of galvanized steels with applying the constant current control and the adaptive control resistance spot welding process for a comparison purpose. The growth in diameter of electrode face was similar for both the constant current and the adaptive control up to 2000 welds. The button diameter was decreased with weld numbers, however, sudden increase in button diameter with use of the adaptive control after 1500 welds was observed. The peak load was continuously decreased with increasing number of welds for both the constant current and the adaptive control. The current compensation during a weld was observed with using the adaptive control after 1800 welds since the -peak on dynamic resistance curve was detected at later weld time. The current compensation with adaptive control during resistance spot welding enhanced the nugget diameter at the faying interface of steel sheets and improved the penetration to thinner steel sheet.


Physical Review B | 2012

Effect of Mn doping on the temperature-dependent anomalous giant dielectric behavior of CaCu 3 Ti 4 O 12

Chiho Kim; Y. H. Jang; S. J. Seo; C. H. Song; Jong Yeog Son; Y. S. Yang; J. H. Cho


Current Applied Physics | 2016

Cyclic voltammetry studies of copper, tin and zinc electrodeposition in a citrate complex system for CZTS solar cell application

Sangmin Shin; Chansu Park; Chiho Kim; Yangdo Kim; Sungkyun Park; Jae-Ho Lee


Journal of the Korean Physical Society | 2009

Effect of Mn Doping on the Electronic Structures of CaCu3Ti4O12 Ceramics

Z.H. Sun; Chiho Kim; Hak Beom Moon; Y. H. Jang; J. H. Cho; C.H. Song; Y. S. Yang


Thin Solid Films | 2013

Relaxation of ferroelectric domains in epitaxial BiFeO3 thin films on vicinal SrTiO3 substrate

Y. H. Jang; Chiho Kim; S. J. Seo; J. H. Cho


Journal of the Korean Physical Society | 2012

Size control of nanocrystals in InGaZnO4 thin films fabricated by using the sol-gel method

S. J. Seo; J. H. Cho; Y. H. Jang; Chiho Kim


Journal of the Korean Physical Society | 2007

Investigation of Ferroelectric Domain Switching of Pb(Zr0.35Ti0.65)O3 Thin Films by Electric Force Microscopy

K. S. Song; Chiho Kim; Hak Beom Moon; S. S. Min; J. H. Cho


Journal of the Korean Physical Society | 2007

Crystal structures on growth of Pr0.7Ca0.3MnO3 thin films analyzed by transmission electron microscope

Hak Beom Moon; Chiho Kim; S. S. Min; Jin-Hong Ahn; J. H. Cho; Young-Myeong Kim; R. Hyun


Journal of Electronic Materials | 2018

Characterization of the Contamination Factor of Electroless Ni Plating Solutions on the ENIG Process

Hyunju Lee; Jaewook Jung; Cheolho Heo; Chiho Kim; Jae-Ho Lee; Yangdo Kim

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J. H. Cho

Pusan National University

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Y. H. Jang

Pusan National University

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Yangdo Kim

Pusan National University

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Hak Beom Moon

Pusan National University

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S. J. Seo

Pusan National University

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Chansu Park

Pusan National University

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Cheolho Heo

Samsung Electro-Mechanics

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Y. S. Yang

Pusan National University

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