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Chiu-Ming Chou

Qualcomm

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Publication

Featured researches published by Chiu-Ming Chou.

Archive | 2008

Semiconductor chip with post-passivation scheme formed over passivation layer

Mou-Shiung Lin; Hsin-Jung Lo; Chien-Kang Chou; Chiu-Ming Chou; Ching-San Lin

Archive | 2004

Post Passivation Interconnection Process And Structures

Mou-Shiung Lin; Chiu-Ming Chou; Chien-Kang Chou

Archive | 2004

Top layers of metal for integrated circuits

Mou-Shiung Lin; Chiu-Ming Chou; Chien-Kang Chou

Archive | 2008

Chip structure and method for fabricating the same

Mou-Shiung Lin; Chiu-Ming Chou; Chien-Kang Chou; Hsin-Jung Lo

Archive | 2008

Semiconductor chip with coil element over passivation layer

Wen-Chieh Lee; Mou-Shiung Lin; Chien-Kang Chou; Yi-Cheng Liu; Chiu-Ming Chou; Jin-Yuan Lee

Archive | 2006

Metal pad or metal bump over pad exposed by passivation layer

Mou-Shiung Lin; Hsin-Jung Lo; Chiu-Ming Chou; Chien-Kang Chou; Ke-Hung Chen

Archive | 2006

Method for forming a double embossing structure

Hsin-Jung Lo; Mou-Shiung Lin; Chiu-Ming Chou; Chien-Kang Chou

Archive | 2004

Post passivation interconnection structures

Mou-Shiung Lin; Chiu-Ming Chou; Chien-Kang Chou

Archive | 2006

Bonding pad on IC substrate and method for making the same

Mou-Shiung Lin; Hsin-Jung Lo; Chiu-Ming Chou; Chien-Kang Chou; Ke-Hung Chen

Archive | 2006

High performance integrated circuit device and method of making the same

Mou-Shiung Lin; Chiu-Ming Chou; Chien-Kang Chou

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Mou-Shiung Lin

Qualcomm

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