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Mou-Shiung Lin

Qualcomm

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Publication

Featured researches published by Mou-Shiung Lin.

Archive | 2008

Semiconductor chip with post-passivation scheme formed over passivation layer

Mou-Shiung Lin; Hsin-Jung Lo; Chien-Kang Chou; Chiu-Ming Chou; Ching-San Lin

Archive | 2008

Post passivation structure for a semiconductor device and packaging process for same

Mou-Shiung Lin; Chien-Kang Chou; Ke-Hung Chen

Archive | 2004

Post Passivation Interconnection Process And Structures

Mou-Shiung Lin; Chiu-Ming Chou; Chien-Kang Chou

Archive | 2006

Circuitry component and method for forming the same

Mou-Shiung Lin; Chien-Kang Chou; Ke-Hung Chen

Archive | 2004

Top layers of metal for integrated circuits

Mou-Shiung Lin; Chiu-Ming Chou; Chien-Kang Chou

Archive | 2008

Chip structure and method for fabricating the same

Mou-Shiung Lin; Chiu-Ming Chou; Chien-Kang Chou; Hsin-Jung Lo

Archive | 2008

Semiconductor chip and process for forming the same

Mou-Shiung Lin; Chien-Kang Chou; Hsin-Jung Lo

Archive | 2006

Metal pad or metal bump over pad exposed by passivation layer

Mou-Shiung Lin; Hsin-Jung Lo; Chiu-Ming Chou; Chien-Kang Chou; Ke-Hung Chen

Archive | 2006

Method for forming a double embossing structure

Hsin-Jung Lo; Mou-Shiung Lin; Chiu-Ming Chou; Chien-Kang Chou

Archive | 2004

Post passivation interconnection structures

Mou-Shiung Lin; Chiu-Ming Chou; Chien-Kang Chou

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Collaboration

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Chiu-Ming Chou

Qualcomm

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