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Christian Hauser

Infineon Technologies

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Publication

Featured researches published by Christian Hauser.

Archive | 2000

Multi-chip housing device has carrier supporting stacked chip components with lowermost chip component having contact coupled to terminal surface of carrier

Martin Neumayer; Christian Hauser; Ingo Wennemuth

Archive | 2002

Electronic component with a semiconductor chip, and method of producing the electronic component

Christian Hauser; Martin Reiss

Archive | 1998

Lead frame for the installation of an integrated circuit in an injection-molded package

Christian Hauser; Helge Schmidt; Johann Winderl

Archive | 2002

Electronic component with a semiconductor chip and fabrication method

Christian Hauser

Archive | 2001

Apparatus for applying a semiconductor chip to a carrier element with a compensating layer

Johann Winderl; Christian Hauser; Martin Reiss

Archive | 1999

Use of the constructional characteristics of an electronic component as a reference for positioning the component

Christian Hauser; Ulrich Vidal; Harald Widner

Archive | 2001

Apparatus for packaging electronic components

Christian Hauser; Jens Pohl; Johann Winderl

Archive | 2001

Integrated circuit, casting mold for producing an integrated module, method of producing an integrated circuit, and method of testing an integrated circuit

Christian Hauser; Ulrich Vidal

Archive | 2001

Elektronisches Bauteil mit einem Halbleiterchip und Verfahren zu seiner Herstellung

Christian Hauser; Martin Reis

Archive | 2003

Method for applying a semiconductor chip to a carrier element

Johann Winderl; Christian Hauser; Martin Reiss

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Collaboration

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Johann Winderl

Infineon Technologies

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Ulrich Vidal

Infineon Technologies

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Martin Reiss

Infineon Technologies

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Martin Neumayer

Infineon Technologies

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Achim Neu

Infineon Technologies

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Harald Widner

Infineon Technologies

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Helge Schmidt

Infineon Technologies

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Martin Reis

Infineon Technologies

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Ingo Wennemuth

Infineon Technologies

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Jens Pohl

Infineon Technologies

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