Martin Reiss

Substrate for producing a soldering connection

Electronic devices and a sheet strip for packaging bonding wire connections of electronic devices and method for producing them

Electronic component with a semiconductor chip, method of producing an electronic component and a panel with a plurality of electronic components

Substrate for producing a soldering connection to a second substrate

Method of producing an electronic component and a panel with a plurality of electronic components

Electronic component with a semiconductor chip, and method of producing the electronic component

Elektronisches Bauteil mit einem Halbleiterchip, Verfahren zu seiner Herstellung und Verfahren zur Herstellung eines Nutzens

Electronic device and leadframe and methods for producing the electronic device and the leadframe

Method for manufacturing a flip-chip package, substrate for manufacturing and flip-chip assembly

Method for mounting a chip on a base and arrangement produced by this method