Christian Silber

The effects of rate-dependent material properties and geometrical characteristics on thermo-mechanical behavior of TQFP package

In this paper we examine the influence of different characteristics of TQFP (thin quad flat package) components on package behavior by simulation and experiment. The varied parameters are the package dimensions, rate-dependent material properties such as viscoelasticity and cure shrinkage and external boundary conditions.

Finite strain thermomechanical material characterization of adhesives used in automotive electronics for quantitative finite element simulations

Thermoset-based adhesives are used as thermal and electrical interfaces. These adhesives are filled with different particles in order to meet the requirements of heat transfer and electrical properties. In automotive applications, they are required to have excellent adhesion since bulk cracking and/or delamination may precipitate other electrical, thermal or mechanical failure mechanisms. With the help of finite element analysis, it is possible to calculate the behavior of the joint and to locate regions of stress and strain concentration where failure is expected to initiate. However, the accuracy of numerical calculations is dependent on the validity of the material models used in the analysis to describe the deformation behavior of the adhesive and adherents. Linear elastic (LE), elastic-plastic (EP) and linear viscoelastic (LVE) material models are frequently used in microelectronics industry. However, up to now in microelectronics industry, there is no work where the limitations of these material models are discussed. The present paper addresses the above issue. We will show the limitations of LVE models and propose a nonlinear viscoelastic (NLVE) model which is capable to describe the large strain behavior of the observed material behavior. Although the NLVE model is illustrated for an adhesive, similar behavior is also observed at other organic materials such as molding compounds and lamination foils. Thus, the suggested NLVE material model has the potential to be applied to a very wide-range of materials. The authors present LVE (between -40°C and 200°C) and NLVE (at 25°C and 100°C) characterization and modelling of the adhesive. For LVE characterization, dynamic mechanical analysis (DMA) and pressure-volume-temperature (PVT) experiments are used. Results are combined to obtain a LVE model which is described by the Prony terms and shift function. Validation of the LVE model is performed at small and large strains with the help of a newly designed dogbone geometry, which is developed in the course of this work to eliminate the disadvantages of the existing DIN EN ISO 527-2 standard. For validation, static tensile tests (STT) and static tensile tests with stress relaxation segments (STSR) up to failure are used. It is found out that the LVE model is capable of predicting the mechanical behavior of the adhesive only at small strains and fails to represent the highly nonlinear mechanical behavior. As it is crucial to predict the adhesive strength at large strains, already obtained STT and STSR results are used to fit the Bergstrom-Boyce (BB) NLVE material model. It is shown that the BB model can accurately describe the material behavior which is observed from STT and STSR experiments. In order to validate the BB model, static tensile tests with creep segments (STCR), which are not previously used for the calibration of the model, are used. A comparison of LVE and NLVE material models is also presented for the STCR simulations. In order to check the behavior of the BB model at temperatures other than the material model input temperatures (25°C and 100°C), STCR experiments at 70°C are also performed and simulated. In all cases, when compared to the LVE material model, NLVE BB model is shown to improve the predictions of the experimental results. Thus, the BB model is shown to be useful for adhesives. This will allow designers to perform quantitative FE simulations of adhesive joints.

Accelerated determination of interfacial fracture toughness in microelectronic packages under cyclic loading

An accelerated and cost-effective characterization method for bi-material interfaces under cyclic loading using a Miniaturized Sub-Critical Bending (MSCB) test setup is presented. The Modified Single Leg Bending (MSLB) samples are acquired directly from production-line, Thin Quad Flat Package (TQFP). Under sub-critical cyclic loading, crack was found to occur at the polymer-metal interface. The crack length is measured using a numerical-experimental compliance-based method. In addition influence of temperature on interfacial adhesion properties namely, crack initiation and propagation is discussed. Sub-critical crack growth (SCCG) is captured along the surface between Molding Compound (MC) and copper Lead-Frame (LF). It is shown that crack propagation along MC/LF interface is highly fatigue sensitive. In addition the fatigue tests under different temperatures show that critical (Gc) and sub-critical strain energy release rate (Gth) are highly temperature-dependent. Finally the samples are fractographically examined using Scanning Acoustic Microscopy (SAM) and Energy-dispersive X-ray spectroscopy (EDX).

Heat Generation in Bond Wires

Equations for fast and exact calculation of a simple model for heat transfer from a bond wire to a cylindrical finite mold package including nonideal heat transfer from wire to mold are presented. These allow for a characterization of an arbitrary mold/bond wire combination. The real mold geometry is approximated using the mold model cylinder radius and the thermal contact conductance of the mold/bond wire interface. For changes in bond and mold material, wire length, diameter, and current transient profiles, the resulting temperature transients can then be predicted. As the method is based on numerical integration of differential equations, arbitrary pulse shapes, which are industrially relevant, can be calculated. Very high thermal contact conductance values (above 40000 W/m2K heat transfer) have been detected in real package/bond systems. The method was validated by successful comparison with finite-element method simulations and alternative calculation methods and measurements.

An in-situ numerical–experimental approach for fatigue delamination characterization in microelectronic packages

An in-situ and cost-effective numerical-experimental approach for fatigue characterization of bi-material interfaces in Microelectronic Packages is presented. In this method using a sample-centered approach a Miniaturized Sub-Critical Bending (MSCB) test setup is designed and fabricated based on the samples that are acquired directly from production-line. The accuracy of the results and stiffness of the test-set up is validated using digital image correlation method. The delamination growth is measured using a compliance-based numerical-experimental method under sub-critical cyclic loading. The critical and threshold toughness values being FC and Fth are measured. The sample are examined after tests using EDX and SEM measurements. The fractographical study of samples shows that, although some of the molding compound particles are left on the LF surface, the interfacial fracture is the dominant failure mode.