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Chuang Yao-Chun

TSMC

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Publication

Featured researches published by Chuang Yao-Chun.

Archive | 2014

Pad structure, method of forming the same and semiconductor device having the same

Liu Hao-Juin; Chuang Chita; Chuang Yao-Chun; Tseng Ming-Hung; Chen Chen-Shien

Archive | 2013

Semiconductor structure and method of forming devices

Shen Cheng Hung; Kuo Tin-Hao; Kuo Chen-Cheng; Chen Chen-Shien; Chuang Yao-Chun

Archive | 2013

Electronic component and manufacturing method of same

Shen Wen-Wei; Chuang Yao-Chun; Chen Chen-Shien; Chen Ming-Fa

Archive | 2011

Integrated circuit packages and fabrication method thereof

Chuang Yao-Chun; Hsiao Ching-Wen; Kuo Chen-Cheng; Chen Chen-Shien

Archive | 2011

Semicondcutor structure and method of fabricating semiconductor device

Chuang Yao-Chun; Kuo Chen-Cheng; Hsiao Ching-Wen; Chen Chen-Shien

Archive | 2017

BUMP ON PAD (BOP) BONDING STRUCTURE IN SEMICONDUCTOR PACKAGED DEVICE

Chuang Yao-Chun; Chuang Chita; Kuo Chen-Cheng; Chen Chen-Shien

Archive | 2016

Stress Reduction Apparatus and Method

Chuang Yao-Chun; Hsu Yu-Chen; Liu Hao-Juin; Chuang Chita; Kuo Chen-Cheng; Chen Chen-Shien

Archive | 2015

Method of forming a bump on pad (BOP) bonding structure in a semiconductor packaged device

Kuo Chen-Cheng; Chuang Chita; Chen Chen-Shien; Chuang Yao-Chun

Archive | 2014

Semiconductor structure and method for forming the same and semiconductor device

Liu Hao-Juin; Chuang Yao-Chun; Chuang Chita; Tseng Yu-Jen; Chen Chen-Shien

Archive | 2013

Semiconductor device i.e. semiconductor chip, has under bump metallization layer in electrical contact with contact pad, and passivation film arranged between contact pad and under bump metallization layer

Liu Hao-Juin; Kuo Chen-Cheng; Chuang Yao-Chun; Chuang Chita

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Collaboration

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Chen Chen-Shien

TSMC

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Kuo Chen-Cheng

TSMC

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Chuang Chita

TSMC

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Liu Hao-Juin

TSMC

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Hsiao Ching-Wen

TSMC

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Kuo Tin-Hao

TSMC

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Hsu Yu-Chen

TSMC

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Tseng Yu-Jen

TSMC

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