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Dae-sang Chan

Samsung

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Publication

Featured researches published by Dae-sang Chan.

Archive | 2008

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING REDISTRIBUTION SUBSTRATE

Jun-young Ko; Dae-sang Chan; Heui-Seog Kim; Wha-Su Sin; Jae-Yong Park

Archive | 2010

Stack-type semiconductor device having chips having different backside structure and electronic apparatus including the same

Jae-Yong Park; Heui-Seog Kim; Jun-young Ko; Dae-sang Chan

Archive | 2008

Semiconductor package, semiconductor package module including the semiconductor package, and methods of fabricating the same

Jun-young Ko; Dae-sang Chan; Jae-Yong Park; Heui-Seog Kim; Wha-Su Sin

Archive | 2006

Wafer grinding and tape attaching apparatus and method

Jun-young Ko; Dae-sang Chan; Sang-Jun Kim

Archive | 2008

Method of cutting a wafer

Dae-sang Chan; Jun-young Ko; Wha-Su Sin; Jae-Yong Park

Archive | 2007

FIXING APPARATUS FOR SEMICONDUCTOR WAFER

Dae-sang Chan; Jun-young Ko; Wha-Su Sin

Archive | 2013

SEMICONDUCTOR MEMORY MODULES AND METHODS OF FABRICATING THE SAME

Young-ja Kim; Jun-young Ko; Dae-sang Chan

Archive | 2013

METHODS OF FABRICATING SEMICONDUCTOR DEVICES AND UNDERFILL EQUIPMENT FOR THE SAME

Young-ja Kim; Jun-young Ko; Dae-young Jeong; Dae-sang Chan

Archive | 2007

Method of fabricating wafer chips

Dae-sang Chan; Jun-young Ko; Sang-Jun Kim; Wha-Su Sin

Archive | 2007

Apparatus and method for separating a semiconductor chip

Jun-young Ko; Dae-sang Chan; Sang-Jun Kim

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Collaboration

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Jun-young Ko

Samsung

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Wha-Su Sin

Samsung

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Jae-Yong Park

Samsung

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Heui-Seog Kim

Samsung

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Sang-Jun Kim

Samsung

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Young-ja Kim

Samsung

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Dae-young Jeong

Samsung

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