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Wha-Su Sin

Samsung

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Publication

Featured researches published by Wha-Su Sin.

Archive | 2008

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING REDISTRIBUTION SUBSTRATE

Jun-young Ko; Dae-sang Chan; Heui-Seog Kim; Wha-Su Sin; Jae-Yong Park

Archive | 2005

Package stack and manufacturing method thereof

Jae-Hong Kim; Heui-Seog Kim; Wha-Su Sin; Jong-Keun Jeon

Archive | 2011

PACKAGE-ON-PACKAGE SEMICONDUCTOR PACKAGE HAVING SPACERS DISPOSED BETWEEN TWO PACKAGE SUBSTRATES

Hyun-Ik Hwang; Heui-Seog Kim; Wha-Su Sin; Jun-Soo Han

Archive | 2007

SEMICONDUCTOR CHIP AND METHOD OF FORMING THE SAME

Wha-Su Sin; Heui-Seog Kim; Sang-Jun Kim

Archive | 2004

Semiconductor package with improved chip attachment and manufacturing method thereof

Jong-Ung Lee; Wha-Su Sin; Jong-Keun Jeon

Archive | 2005

Method of forming solder ball, and fabricating method and structure of semiconductor package using the same

Jae-Hong Kim; Heui-Seog Kim; Wha-Su Sin; Jong-Keun Jeon

Archive | 2009

Printed circuit board and method thereof and a solder ball land and method thereof

Ky-Hyun Jung; Heui-Seog Kim; Sang-Jun Kim; Wha-Su Sin; Ho-geon Song; Jun-young Ko

Archive | 2008

Molding apparatus, molded semiconductor package using multi-layered film, fabricating and molding method for fabricating the same

Wha-Su Sin; Heui-Seog Kim; Jong-Keun Jeon

Archive | 2007

Wiring film having wire, semiconductor package including the wiring film, and method of fabricating the semiconductor package

Goon-Woo Kim; Heui-Seog Kim; Sang-Jun Kim; Wha-Su Sin

Archive | 2005

Apparatus for ejecting relatively thin IC chip from semiconductor wafer

Goon-Woo Kim; Heui-Seog Kim; Jong-Keun Jeon; Wha-Su Sin; Jong-Ung Lee

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Collaboration

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Heui-Seog Kim

Samsung

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Jun-young Ko

Samsung

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Jae-Yong Park

Samsung

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Sang-Jun Kim

Samsung

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Jong-Keun Jeon

Samsung

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Dae-sang Chan

Samsung

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Ky-Hyun Jung

Samsung

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Jae-Hong Kim

Samsung

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Jun-Soo Han

Samsung

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Goon-Woo Kim

Samsung

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