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Dario S. Filoteo

STATS ChipPAC Ltd

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Publication

Featured researches published by Dario S. Filoteo.

Archive | 2007

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER

Philip Lyndon Cablao; Rachel Layda Abinan; Dario S. Filoteo; Allan Ilagan

Archive | 2008

Multichip module package and fabrication method

Il Kwon Shim; Dario S. Filoteo; Tsz Yin Ho; Sebastian T. M. Soon

Archive | 2010

CHIP SCALE MODULE PACKAGE IN BGA SEMICONDUCTOR PACKAGE

Leo A. Merilo; Emmanuel Espiritu; Dario S. Filoteo; Rachel Layda Abinan

Archive | 2004

Chip scale package with open substrate

Il Kwon Shim; Kwee Lan Tan; Jian Jun Li; Dario S. Filoteo

Archive | 2002

Heat spreader anchoring & grounding method & thermally enhanced PBGA package using the same

Il Kwon Shim; Hermes T. Apale; Weddle Aquien; Dario S. Filoteo; Virgil Cotoco Ararao; Leo A. Merilo

Archive | 2007

Integrated circuit package system including die stacking

Dario S. Filoteo; Tsz Yin Ho

Archive | 2010

Quad flat package

Emmanuel Espiritu; Leo A. Merilo; Rachel Layda Abinan; Dario S. Filoteo

Archive | 2006

STACKED INTEGRATED CIRCUITS PACKAGE SYSTEM WITH PASSIVE COMPONENTS

Philip Lyndon Cablao; Dario S. Filoteo; Leo A. Merilo; Emmanuel Espiritu; Rachel Layda Abinan; Allan Ilagan

Archive | 2006

Integrated circuit package system with heatspreader

Emmanuel Espiritu; Dario S. Filoteo; Leo A. Merilo; Philip Lyndon Cablao; Rachel Layda Abinan; Allan Ilagan

Archive | 2005

Integrated circuit package system including high-density small footprint system-in-package

Il Kwon Shim; Tsz Yin Ho; Dario S. Filoteo; Seng Guan Chow

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Collaboration

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Emmanuel Espiritu

STATS ChipPAC Ltd

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Leo A. Merilo

STATS ChipPAC Ltd

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Rachel Layda Abinan

STATS ChipPAC Ltd

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Philip Lyndon Cablao

STATS ChipPAC Ltd

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Il Kwon Shim

STATS ChipPAC Ltd

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Allan Ilagan

STATS ChipPAC Ltd

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Jian Jun Li

STATS ChipPAC Ltd

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Kwee Lan Tan

STATS ChipPAC Ltd

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Tsz Yin Ho

STATS ChipPAC Ltd

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Il Kwon Shim

STATS ChipPAC Ltd

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