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Dive into the research topics where Emmanuel Espiritu is active.

Publication


Featured researches published by Emmanuel Espiritu.


Archive | 2010

Semiconductor device and method of forming leadframe interposer over semiconductor die and TSV substrate for vertical electrical interconnect

Zigmund Ramirez Camacho; Dioscoro A. Merilo; Henry Descalzo Bathan; Emmanuel Espiritu


Archive | 2011

Semiconductor device and method of forming wafer-level multi-row etched leadframe with base leads and embedded semiconductor die

Zigmund Ramirez Camacho; Emmanuel Espiritu; Henry Descalzo Bathan; Dioscoro A. Merilo


Archive | 2010

Integrated circuit packaging system with pad connection and method of manufacture thereof

Zigmund Ramirez Camacho; Henry Descalzo Bathan; Emmanuel Espiritu; Dioscoro A. Merilo


Archive | 2010

CHIP SCALE MODULE PACKAGE IN BGA SEMICONDUCTOR PACKAGE

Leo A. Merilo; Emmanuel Espiritu; Dario S. Filoteo; Rachel Layda Abinan


Archive | 2012

Semiconductor device and method of forming wafer level multi-row etched lead package

Zigmund Ramirez Camacho; Dioscoro A. Merilo; Henry Descalzo Bathan; Emmanuel Espiritu


Archive | 2011

Semiconductor Device and Method of Forming EWLB Package With Standoff Conductive Layer Over Encapsulant Bumps

Zigmund Ramirez Camacho; Henry Descalzo Bathan; Emmanuel Espiritu


Archive | 2010

Quad flat package

Emmanuel Espiritu; Leo A. Merilo; Rachel Layda Abinan; Dario S. Filoteo


Archive | 2006

STACKED INTEGRATED CIRCUITS PACKAGE SYSTEM WITH PASSIVE COMPONENTS

Philip Lyndon Cablao; Dario S. Filoteo; Leo A. Merilo; Emmanuel Espiritu; Rachel Layda Abinan; Allan Ilagan


Archive | 2010

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PROTECTIVE COATING AND METHOD OF MANUFACTURE THEREOF

Henry Descalzo Bathan; Zigmund Ramirez Camacho; Emmanuel Espiritu; Jeffrey D. Punzalan


Archive | 2006

Integrated circuit package system with heatspreader

Emmanuel Espiritu; Dario S. Filoteo; Leo A. Merilo; Philip Lyndon Cablao; Rachel Layda Abinan; Allan Ilagan

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