David Billon-Lanfrey

Infrared dual-band detectors for next generation

The development of DB (Dual-Band) infrared detectors has been the core of research and technological improvements for the last ten years at CEA-LETI and Sofradir: the semi planar structure uses a proven standard process with robust reproducibility, leading to low-risk and a facilitated ramp-up to production. This makes it the natural choice for the third generation detectors proposed by Sofradir. The fabrication of DB MCT detectors is reaching maturity: ALTAIR with 24μm-pixel pitch arrays in TV format are available, showing median NETD around 18mK with operability over 99.5%. A second structure, based on two back to back diodes, with a single contact per pixel translates the DB pixel into smaller cell therefore being more efficient in terms of pitch reduction. These new technologies widen perspectives and open new horizons of applications such as large DB FPA, dual mode capability providing both SAL (Semi Active Laser) and IR operations for more robust target engagement or compact dual color detection with wide-angle integrated optics for missile warning system.

Status of MCT focal plane arrays in France

This paper describes the recent developments of Mercury Cadmium Telluride (MCT) infrared technologies in France at Sofradir and CEA-LETI made in the frame of the common laboratory named DEFIR. Among these developments, one can find the crystal growth of high quality and large Cadmium Zinc Telluride (CZT) substrates which is one of the fundamental keys for high quality and affordable detectors. These last years, a great effort was done on this topic and also on MCT epitaxy layer process from Short Waves (SW) to Very Long Waves (VLW). These developments about the quality of the material are needed for the challenge of the High Operating Temperature (HOT). Over these lasts years, the operating temperature of n-on-p MCT detectors was increase of several tens of Kelvin. In addition the development of the p-on-n MCT technology that reduces dark current by a factor ~100 saves about twenty Kelvin more. The next step for the increase in operating temperature will be the complex photodiodes architectures using molecular beam epitaxy layer. The reduction of the pixel pitches is another challenge for infrared technologies for Small Weight and Power (SWAP) detectors. Moreover, this reduction allows the increase in the resolution and consequently in the detection range of the systems. In addition, last results on 3rd generation detectors such as multicolor focal plan arrays, 2D, 3D, low noise and high images rate focal plane array using Avalanche Photodiode (APD) are described.

Ultra-low power ADC on chip for high-performance IR detector

The InfraRed staring arrays developed by SOFRADIR are more and more compact and offer system solutions for wide range of IR wavebands. IR detectors have been taken to an even more advanced level of sophistication to achieve staring arrays high performances. Latest developments have also been focused on the silicon readout circuit. Digital conversion on chip is one of the recent progresses in this field of activity. In order to match each system requirements, on chip high performance ultra low power ADCs have been developed. Beyond the performance aspects, digital focal plane arrays can be considered as the first step towards low cost Dewar family, since they allow for a more simple electrical interface on Dewar designs and on chip image processing. Recent results concerning these new readout circuit architectures are presented in this paper.

New developments on InGaAs focal plane array

SWIR detection band benefits from natural (sun, night glow, thermal radiation) or artificial (eye safe lasers) photons sources combined to low atmospheric absorption and specific contrast compared to visible wavelengths. It gives the opportunity to address a large spectrum of applications such as defense and security (night vision, active imaging), space (earth observation), transport (automotive safety) or industry (non destructive process control). InGaAs material appears as a good candidate to satisfy SWIR detection needs. The lattice matching with InP constitutes a double advantage to this material: attractive production capacity and uncooled operation thanks to low dark current level induced by high quality material. The recent transfer of imagery activities from III-VLab to Sofradir provides a framework for the production activity with the manufacturing of high performances products: CACTUS320 SW and CACTUS640 SW. The developments, begun at III-Vlab towards VGA format with 15μm pixel pitch, lead today to the industrialization of a new product: SNAKE SW. On one side, the InGaAs detection array presents high performances in terms of dark current and quantum efficiency. On the other side, the low noise ROIC has different additional functionalities. Then this 640×512 @ 15μm module appears as well suited to answer the needs of a wide range of applications. In this paper, we will present the Sofradir InGaAs technology, some performances optimization and the last developments leading to SNAKE SW.

Latest developments in advanced MCT infrared cooled detectors

MCT technologies under development in France address strategic operational needs. This includes better identification range as well as lighter weight requirement, operation at higher detector temperature and cost reduction issues. This paper describes the status of MCT IR technology in France at Leti and Sofradir. A focus will be made on hot detector technology for SWAP applications. Solutions for high performance detectors such as dual bands or megapixels will be discussed. In the meantime, the development of avalanche photodiodes, integrated optics, or TV format with digital interface is key to bring customers cutting-edge functionalities.

Getting small: new 10μm pixel pitch cooled infrared products

Recent advances in miniaturization of IR imaging technology have led to a burgeoning market for mini thermalimaging sensors. Seen in this context our development on smaller pixel pitch has opened the door to very compact products. When this competitive advantage is mixed with smaller coolers, thanks to HOT technology, we achieve valuable reductions in size, weight and power of the overall package. In the same time, we are moving towards a global offer based on digital interfaces that provides our customers lower power consumption and simplification on the IR system design process while freeing up more space. Additionally, we are also investigating new wafer level camera solution taking advantage of the progress in micro-optics. This paper discusses recent developments on hot and small pixel pitch technologies as well as efforts made on compact packaging solution developed by SOFRADIR in collaboration with CEA-LETI and ONERA.

Non-uniformity correction results for Sofradir infrared 2D staring arrays

The post correction uniformity performance of infrared 2D starring arrays is a key factor to ensure the best IR image quality at the camera level. SOFRADIR has conducted several studies to improve both the post correction uniformity performance and the correction tables stability over the time periods, the readout integrated circuit configuration and the environmental conditions. Indeed, works have been performed on the homogeneity technology deposits, on the improvement of the readout circuit linearity and on the optimization of the dewar design to reduce the parasitical fluxes. Thanks to these improvements, Sofradir offers to its customers high level post correction uniformity performances as well as excellent correction tables stability for the mid wave and long wave infrared band. Thus, the calibrations constraints are reduced at the camera level and the image quality is optimized over a large camera utilization conditions.

High-performance and long-range cooled IR technologies in France

Cooled IR technologies that offer high performances are at the top of DEFIR’s priority list. We have been pursuing further infrared developments on future MWIR detectors, such as the VGA format HOT detector that operates at 150K and the 10μm pitch IR detector which gives us a leading position in innovation In the same time Scorpio LW expands Sofradirs line of small pixel pitch TV format IR detectors from the mid-wavelength to the long-wavelength, broadening the performance attributes of its long wave IR product line. Finally, our dual band MW-LW QWIP detectors (25μm, 384×288 pixels) benefit to tactical platforms giving an all-weather performance and increasing flexibility in the presence of battlefield obscurants. These detectors are designed for long-range surveillance equipment, commander or gunner sights, ground-toground missile launchers and other applications that require higher resolution and sensitivity to improve reconnaissance and target identification. This paper discusses the system level performance in each detector type.

High-performance MCT and QWIP IR detectors at Sofradir

Cooled IR technologies are challenged for answering new system needs like compactness and reduction of cryo-power which is key feature for the SWaP (Size, Weight and Power) requirements. This paper describes the status of MCT IR technology in France at Leti and Sofradir. A focus will be made on hot detector technology for SWAP applications. Sofradir has improved its HgCdTe technology to open the way for High Operating Temperature systems that release the Stirling cooler engine power consumption. Solutions for high performance detectors such as dual bands, much smaller pixel pitch or megapixels will also be discussed. In the meantime, the development of avalanche photodiodes or TV format with digital interface is key to bringing customers cutting-edge functionalities. Since 1997, Sofradir has been working with Thales and Research Technologies (TRT) to develop and produce Quantum Well Infrared Photodetectors (QWIP) as a complementary offer with MCT, to provide large LW staring arrays. A dualband MW-LW QWIP detector (25μm pitch 384×288 IDDCA) is currently under development. We will present in this paper its latest results.

New SOFRADIR 10μm pixel pitch infrared products

Recent advances in miniaturization of IR imaging technology have led to a growing market for mini thermal-imaging sensors. In that respect, Sofradir development on smaller pixel pitch has made much more compact products available to the users. When this competitive advantage is mixed with smaller coolers, made possible by HOT technology, we achieved valuable reductions in the size, weight and power of the overall package. At the same time, we are moving towards a global offer based on digital interfaces that provides our customers simplifications at the IR system design process while freeing up more space. This paper discusses recent developments on hot and small pixel pitch technologies as well as efforts made on compact packaging solution developed by SOFRADIR in collaboration with CEA-LETI.