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Featured researches published by David S. Epp.


IEEE\/ASME Journal of Microelectromechanical Systems | 2009

A Simple Learning Control to Eliminate RF-MEMS Switch Bounce

Jill Blecke; David S. Epp; Hartono Sumali; Gordon G. Parker

A learning control algorithm is presented that reduces the closing time of a radio-frequency microelectromechanical systems switch by minimizing bounce while maintaining robustness to fabrication variability. The switch consists of a plate supported by folded-beam springs. Electrostatic actuation of the plate causes pull-in with high impact velocities, which are difficult to control due to parameter variations from part to part. A single degree-of-freedom model was utilized to design a simple learning control algorithm that shapes the actuation voltage based on the open/closed state of the switch. Experiments on three different test switches show that after 5-10 iterations, the learning algorithm lands the switch plate with an impact velocity not exceeding 0.20 m/s, eliminating bounce. Simulations show that robustness to parameter variation is directly related to the number of required iterations for the device to learn the input for a bounce-free closure.


international conference on mems, nano, and smart systems | 2005

Modeling, simulation, and testing of the mechanical dynamics of an RF MEMS switch

Jordan E. Massad; Hartono Sumali; David S. Epp; Christopher W. Dyck

Mechanical dynamics can be a determining factor for the switching speed of radio-frequency microelectromechanical systems (RF MEMS) switches. This paper presents the simulation of the mechanical motion of a microswitch under actuation. The switch has a plate suspended by springs. When an electrostatic actuation is applied, the plate moves toward the substrate and closes the switch. Simulations are calculated via a high-fidelity finite element model that couples solid dynamics with electrostatic actuation. It incorporates non-linear coupled dynamics and accommodates fabrication variations. Experimental modal analysis gives results in the frequency domain that verifies the natural frequencies and mode shapes predicted by the model. An effective 1D model is created and used to calculate an actuation voltage waveform that minimizes switch velocity at closure. In the experiment, the switch is actuated with this actuation voltage, and the displacements of the switch at various points are measured using a laser Doppler velocimeter through a microscope. The experiments are repeated on several switches from different batches. The experimental results verify the model.


Volume 4: 20th International Conference on Design Theory and Methodology; Second International Conference on Micro- and Nanosystems | 2008

MEMS Passive Latching Mechanical Shock Sensor

Jonathan W. Wittwer; Michael S. Baker; David S. Epp; John Anthony Mitchell

This paper presents a novel micro-scale passive-latching mechanical shock sensor with reset capability. The device integrates a compliant bistable mechanism, designed to have a high contact force and low actuation force, with metal-to-metal electrical contacts that provide a means for interrogating the switch state. No electrical power is required during storage or sensing. Electrical power is only required to initialize, reset, self-test, or interrogate the device, allowing the mechanism to be used in low-power and long shelf-life applications. The sensor has a footprint of about 1 mm2 , allowing multiple devices to be integrated on a single chip for arrays of acceleration thresholds, redundancy, and/or multiple sense directions. Modeling and experimental results for a few devices with different thresholds in the 100g to 400g range are given. Centrifuge test results show that the accelerations required to toggle the switches are higher than current model predictions. Resonant frequency measurements suggest that the springs may be stiffer than predicted. Hammer-strike tests demonstrate the feasibility of using the devices as sensors for actual mechanical shock events.Copyright


ASME 2006 International Mechanical Engineering Congress and Exposition | 2006

Squeeze Film Damping Models Compared With Tests on Microsystems

Hartono Sumali; David S. Epp

This paper compares three models for computing forces caused by gas film squeezed between parallel plates. The models are used to calculate damping forces on an oscillating plate at different oscillation frequencies. The damping forces are then used to calculate nondimensional damping ratios. The damping ratios are used in making comparisons among the models and with experimental data. The experiment used an oscillating MEMS plate suspended by folded springs. The substrate (base) was shaken with a piezoelectric transducer. The plate vibrated as a result, especially at the resonant frequency. The velocities of the suspended plate and of the substrate were measured with a laser Doppler vibrometer and a microscope. Experimental modal analysis gave the damping ratio. To achieve a wide range of squeeze numbers, the experiment was repeated under several different pressures. The measurement was also repeated on an array of plates. Experimental data indicate that, for atmospheric and higher pressures, squeeze-film damping forces can be modeled accurately with a very simple model. For lower pressures in the continuum regime, a more complete model by Veijola (2004) predicts the damping ratio very well.Copyright


Archive | 2008

The Sandia MEMS Passive Shock Sensor : FY08 testing for functionality, model validation, and technology readiness.

Jeremy A. Walraven; Jill Blecke; Michael S. Baker; Rebecca C. Clemens; John Anthony Mitchell; Matthew Robert Brake; David S. Epp; Jonathan W. Wittwer

This report summarizes the functional, model validation, and technology readiness testing of the Sandia MEMS Passive Shock Sensor in FY08. Functional testing of a large number of revision 4 parts showed robust and consistent performance. Model validation testing helped tune the models to match data well and identified several areas for future investigation related to high frequency sensitivity and thermal effects. Finally, technology readiness testing demonstrated the integrated elements of the sensor under realistic environments.


Archive | 2008

The Sandia MEMS Passive Shock Sensor : FY08 failure analysis activities.

Jeremy A. Walraven; Michael S. Baker; Rebecca C. Clemens; John Anthony Mitchell; Matthew Robert Brake; David S. Epp; Jonathan W. Wittwer

This report summarizes failure analysis activities performed on various designs of the MEMS based Passive Shock Sensor (PSS). The failure analysis activities in this report focus on identifying root cause of failures observed at both die and package levels. The findings from these failure analyses have and will lead to implementation of corrective actions focusing on maturing the MEMS-based PSS and meeting product deliverables and milestones.


Volume 3: 19th International Conference on Design Theory and Methodology; 1st International Conference on Micro- and Nanosystems; and 9th International Conference on Advanced Vehicle Tire Technologies, Parts A and B | 2007

Experimental Validation of A Squeeze-film Damping Model Based on the Direct Simulation Monte Carlo Method.

Hartono Sumali; David S. Epp; John R. Torczynski; Michail A. Gallis

A model for computing the force from a gas film squeezed between parallel plates was recently developed using Direct Simulation Monte Carlo simulations in conjunction with the classical Reynolds equation. This paper compares predictions from that model with experimental data. The experimental validation used an almost rectangular MEMS oscillating plate with piezoelectric base excitation. The velocities of the suspended plate and of the substrate were measured with a laser Doppler vibrometer and a microscope. Experimental modal analysis yielded the damping ratio of twelve test structures for several different gas pressures. Small perforation holes in the plates did not alter the squeeze-film damping substantially. These experimental data suggest that the model predicts squeeze-film damping forces accurately. From this comparison, it is seen that these structures have a tangential-velocity accommodation coefficient close to unity.Copyright


ASME 2006 International Mechanical Engineering Congress and Exposition | 2006

Restoring Force Surface Analysis of Nonlinear Vibration Data from Micro-Cantilever Beams.

Matthew S. Allen; Hartono Sumali; David S. Epp

The responses of micro-cantilever beams, with lengths ranging from 100-1500 microns, have been found to exhibit nonlinear dynamic characteristics at very low vibration amplitudes and in near vacuum. This work seeks to find a functional form for the nonlinear forces acting on the beams in order to aide in identifying their cause. In this paper, the restoring force surface method is used to non-parametrically identify the nonlinear forces acting on a 200 micron long beam. The beam response to sinusoidal excitation contains as many as 19 significant harmonics within the measurement bandwidth. The nonlinear forces on the beam are found to be oscillatory and to depend on the beam velocity. A piecewise linear curve is fit to the response in order to more easily compare the restoring forces obtained at various amplitudes. The analysis illustrates the utility of the restoring force surface method on a system with complex and highly nonlinear forces.


Archive | 2009

Thermomechanical Measurements on Thermal Microactuators

Michael S. Baker; David S. Epp; Justin Raymond Serrano; Allen D. Gorby; Leslie M. Phinney

Due to the coupling of thermal and mechanical behaviors at small scales, a Campaign 6 project was created to investigate thermomechanical phenomena in microsystems. This report documents experimental measurements conducted under the auspices of this project. Since thermal and mechanical measurements for thermal microactuators were not available for a single microactuator design, a comprehensive suite of thermal and mechanical experimental data was taken and compiled for model validation purposes. Three thermal microactuator designs were selected and fabricated using the SUMMiT V{sup TM} process at Sandia National Laboratories. Thermal and mechanical measurements for the bent-beam polycrystalline silicon thermal microactuators are reported, including displacement, overall actuator electrical resistance, force, temperature profiles along microactuator legs in standard laboratory air pressures and reduced pressures down to 50 mTorr, resonant frequency, out-of-plane displacement, and dynamic displacement response to applied voltages.


ASME 2009 International Mechanical Engineering Congress and Exposition | 2009

Wavelength and Coherence Independent Method of Optically Exciting Mechanical Resonance

Gregory N. Nielson; Leslie M. Phinney; David S. Epp; Jonathan W. Wittwer; Vipin P. Gupta; Paul J. Resnick; Uma Krishnamoorthy

We have developed and demonstrated a technique for optical excitation of mechanical resonance that does not require coherent, monochromatic, or time-varying light. Previous methods for optically exciting mechanical motion in microscale devices required monochromatic, coherent light or time varying light. This technology could allow sunlight (or other ambient light source) to drive a MEMS device. It could also be used to convert sunlight to mechanical energy and subsequently to electrical energy through piezoelectric or capacitive techniques, essentially a micromechanical analog to the photovoltaic cell. We have demonstrated this method of optical excitation of a MEMS cantilever using simple cantilever beam structures fabricated using Sandia National Laboratories’ SUMMiT V™ process. The bimorph structure was created with polysilicon and aluminum. The minimum power to induce resonance was 3.5–4 mW of optical power incident on the cantilever under a vacuum of less than 1 mTorr. Resonance was observed at 45.6 kHz (slightly less than the 48.5 kHz predicted by FEA).© 2009 ASME

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Hartono Sumali

Sandia National Laboratories

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Jonathan W. Wittwer

Sandia National Laboratories

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Michael S. Baker

Sandia National Laboratories

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Jeremy A. Walraven

Sandia National Laboratories

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Jill Blecke

Michigan Technological University

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Leslie M. Phinney

Sandia National Laboratories

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Christopher W. Dyck

Sandia National Laboratories

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