Dengke Yang

Effects of Deformation-Induced Heating on Bond Strength of Rolled Metal Multilayer

The bond strength of various metal multilayers produced by cold rolling of metal foils with different thermal conductivity was investigated. Results indicated that under the same conditions of deformation and surface preparation, the metallic multilayer system with low thermal conductivity exhibited relative high bond strength while high thermal conductivity metal system may fail to be roll-bonded together. The relationship between the deformation-induced localized heating and the bond strength were discussed. The deformation-induced localized heating in the low thermal conductivity metal multilayer systems may provide opportunities for achieving a successful accumulative roll bonding or a “cold roll/heat treatment/cold roll” process to synthesize metallic multilayer materials.

Nucleation and growth during reactions in accumulative roll bonding of Ti/Al multilayers

A two-stage process in the formation of TiAl3 was found in the accumulative roll bonding (ARB) Ti/Al multilayers. The distribution of layer spacing did not become broad enough to lose the main features of the double exothermal behaviour. A modified model based on thin films was set up to describe the kinetic characteristics of the formation of TiAl3 in ARB samples