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Dirk Efferenn

Infineon Technologies

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Publication

Featured researches published by Dirk Efferenn.

Archive | 2004

Process for removing a residue from a metal structure on a semiconductor substrate

Ronald Gottzein; Jens Bachmann; Dirk Efferenn; Uwe Kahler; Chung-Hsin Lin; Wen-Bin Lin; Lee Donohue

Archive | 2003

Method for masking a recess in a structure having a high aspect ratio

Dirk Efferenn; Hans-Peter Moll

Archive | 2003

Method for producing a shallow trench isolation for n- and p- channel field-effect transistors in a semiconductor module

Dirk Efferenn; Hans-Peter Moll; Andreas Wich-Glasen

Archive | 2004

Production of a hard mask on a semiconductor substrate used in the production of integrated circuits comprises forming a hard mask layer on the substrate, forming a photolacquer structure on the hard mask layer, and further processing

Dirk Efferenn; Hans-Peter Moll

Archive | 2001

Production of isolation trenches between active regions during the manufacture of integrated circuits, especially DRAMs, comprises etching trenches filled with oxide in semiconductor substrate to isolate the active regions, and processing

Dirk Efferenn; Hans-Peter Moll; Ulrike Gruening

Archive | 2001

Verfahren zur Ausbildung von Isolationsgräben zwischen aktiven Gebieten bei der Herstellung integrierter Schaltungen

Dirk Efferenn; Hans-Peter Moll; Ulrike Gruening

Archive | 2006

Method for fastening substrate at substrate holder involves laying of first side of substrate on substrate holder, setting of first fluid pressure at first sub range of first side of substrate and setting of second fluid pressure

Jens Uwe Bruch; Jens Stäcker; Heiko Hommen; Karl Schumacher; Roberto Schiwon; Martin Schmidt-Lanz; Dirk Efferenn

Archive | 2004

METHOD FOR PROVIDING WHISKER-FREE ALUMINUM METAL LINES OR ALUMINUM ALLOY LINES IN INTEGRATED CIRCUITS

Dirk Efferenn; Jens Hahn; Uwe Kahler; Chung-Hsin Lin; Jens Bachmann; Wen-Bin Lin; Grit Bonsdorf

Archive | 2003

Method for filling depressions on a semiconductor wafer

Dirk Efferenn; Hans-Peter Moll

Archive | 2003

Method for masking a recess in a structure with a large aspect ratio

Dirk Efferenn; Hans-Peter Moll

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Collaboration

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Hans-Peter Moll

Infineon Technologies

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Andreas Wich-Glasen

Infineon Technologies

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Chung-Hsin Lin

Infineon Technologies

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Jens Bachmann

Infineon Technologies

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Ulrike Gruening

Infineon Technologies

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Uwe Kahler

Infineon Technologies

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Wen-Bin Lin

Infineon Technologies

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Grit Bonsdorf

Infineon Technologies

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Heiko Hommen

Infineon Technologies

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Jens Hahn

Infineon Technologies

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