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Dive into the research topics where Douglas Brian Adolf is active.

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Featured researches published by Douglas Brian Adolf.


Journal of Rheology | 2007

A thermodynamically consistent, nonlinear viscoelastic approach for modeling thermosets during cure

Douglas Brian Adolf; Robert S. Chambers

Our previous, extensively validated, nonlinear viscoelastic formalism for glassy polymers is extended to include the effects of chemical reaction. Two modifications are necessary. First, the extent of reaction represents an additional degree of freedom that must be included in the free energy series expansion. Second, simultaneous reaction and deformation can lead to “compression set” that is represented by an evolving stress-free configuration in the cross-linked solid. The material clock, which is based on potential energy and must also incorporate these modifications, naturally predicts the increase in glass transition with cure.


Journal of Chemical Physics | 1983

Welding of polymers of nonuniform molecular weight

Stephen Prager; Douglas Brian Adolf; Matthew Tirrell

The chain dynamics for the welding which occurs when two pieces of the same polymer are brought together is discussed. The molecular weight dependence of healing rates is discussed in particular. (AIP)


Journal of Chemical Physics | 1986

Welding of polymer networks

Stephen Prager; Douglas Brian Adolf; Matthew Tirrell

Evolution of mechanical strength of interfaces between surfaces of tethered polymer chaims has been studied as a model for the autoadhesion of cross‐linked polymers. Chain motion is modeled as restricted diffusion in a tube. We use Helfand and Pearson’s results for the motion of the end of a tethered chain in a tube. The result is a theory that predicts how much more slowly a tethered arm will cross an interface than a free linear chain. The form of the evolution of crossings with time for a (initial growth ∼t1/2) tethered arm is nearly identical to that for linear chains but retarded due to restrictions on their motion.


Journal of Rheology | 2009

Practical application of thixotropic suspension models

Anne Grillet; Rekha Ranjana Rao; Douglas Brian Adolf; Stacie Kawaguchi; Lisa Ann Mondy

The practical implementation of several thixotropic rheological models has been evaluated for a prototypical industrial application. We have studied the ability of the models to predict both steady and transient rheology of a suspension of alumina particles and the suitability of those models for full transient finite element calculations. The constitutive models for thixotropic materials examined include the Carreau-Yasuda model and first and second-order indirect structure models. While all of these models were able to predict the shear-thinning behavior of the steady viscosity, the first and second-order structure models were also able to capture some aspects of the transient structure formation and fluid history. However, they were not able to predict some more complex transient behavior observed in step shear experiments. For most thixotropic suspensions, the time constant required to form structure is longer than the time constant to break it down. For this suspension, the time constant at a given shear rate was also dependent on the previous shear rate. If the previous shear rate was high, the time required to reach equilibrium was longer than if the previous shear rate was lower. This behavior was not captured by the simple initial structure dependence in the previous models. By adding an additional dependence on the initial suspension structure, the prediction of the transient rheology was substantially improved while maintaining an excellent agreement with the steady shear viscosity. Finite element results are presented for extrusion of a suspension to form a fiber. This model two-dimensional problem contains many of the same complexities as practical three-dimensional mold filling simulations (i.e., nonviscometric and mobile free surface). Our results show that these direct structure models exhibit oscillations near the stick-slip point in finite element calculations similar to many polymeric constitutive equations, but are otherwise suitable for implementation in complex industrial modeling applications.The practical implementation of several thixotropic rheological models has been evaluated for a prototypical industrial application. We have studied the ability of the models to predict both steady and transient rheology of a suspension of alumina particles and the suitability of those models for full transient finite element calculations. The constitutive models for thixotropic materials examined include the Carreau-Yasuda model and first and second-order indirect structure models. While all of these models were able to predict the shear-thinning behavior of the steady viscosity, the first and second-order structure models were also able to capture some aspects of the transient structure formation and fluid history. However, they were not able to predict some more complex transient behavior observed in step shear experiments. For most thixotropic suspensions, the time constant required to form structure is longer than the time constant to break it down. For this suspension, the time constant at a given s...


Other Information: PBD: 1 Oct 2001 | 2001

Verification and Validation of Encapsulation Flow Models in GOMA, Version 1.1

Lisa Ann Mondy; Rekha Ranjana Rao; P. Randall Schunk; Philip A. Sackinger; Douglas Brian Adolf

Encapsulation is a common process used in manufacturing most non-nuclear components including: firing sets, neutron generators, trajectory sensing signal generators (TSSGs), arming, fusing and firing devices (AF and Fs), radars, programmers, connectors, and batteries. Encapsulation is used to contain high voltage, to mitigate stress and vibration and to protect against moisture. The purpose of the ASCI Encapsulation project is to develop a simulation capability that will allow us to aid in the encapsulation design process, especially for neutron generators. The introduction of an encapsulant poses many problems because of the need to balance ease of processing and properties necessary to achieve the design benefits such as tailored encapsulant properties, optimized cure schedule and reduced failure rates. Encapsulants can fail through fracture or delamination as a result of cure shrinkage, thermally induced residual stresses, voids or incomplete component embedding and particle gradients. Manufacturing design requirements include (1) maintaining uniform composition of particles in order to maintain the desired thermal coefficient of expansion (CTE) and density, (2) mitigating void formation during mold fill, (3) mitigating cure and thermally induced stresses during cure and cool down, and (4) eliminating delamination and fracture due to cure shrinkage/thermal strains. The first two require modeling ofmorexa0» the fluid phase, and it is proposed to use the finite element code GOMA to accomplish this. The latter two require modeling of the solid state; however, ideally the effects of particle distribution would be included in the calculations, and thus initial conditions would be set from GOMA predictions. These models, once they are verified and validated, will be transitioned into the SIERRA framework and the ARIA code. This will facilitate exchange of data with the solid mechanics calculations in SIERRA/ADAGIO.«xa0less


Archive | 2008

Experiments for foam model development and validation.

Christopher Jay Bourdon; Raymond O. Cote; Harry K. Moffat; Anne Grillet; James Mahoney; Technologies, Kansas City Plant, Kansas City, Mo; Edward Mark Russick; Douglas Brian Adolf; Rekha Ranjana Rao; Kyle R. Thompson; Andrew Michael Kraynik; Jaime N. Castaneda; Christopher M. Brotherton; Lisa Ann Mondy; Allen D. Gorby

A series of experiments has been performed to allow observation of the foaming process and the collection of temperature, rise rate, and microstructural data. Microfocus video is used in conjunction with particle image velocimetry (PIV) to elucidate the boundary condition at the wall. Rheology, reaction kinetics and density measurements complement the flow visualization. X-ray computed tomography (CT) is used to examine the cured foams to determine density gradients. These data provide input to a continuum level finite element model of the blowing process.


Archive | 2008

Foam process models.

Harry K. Moffat; David R. Noble; Thomas A. Baer; Douglas Brian Adolf; Rekha Ranjana Rao; Lisa Ann Mondy

In this report, we summarize our work on developing a production level foam processing computational model suitable for predicting the self-expansion of foam in complex geometries. The model is based on a finite element representation of the equations of motion, with the movement of the free surface represented using the level set method, and has been implemented in SIERRA/ARIA. An empirically based time- and temperature-dependent density model is used to encapsulate the complex physics of foam nucleation and growth in a numerically tractable model. The change in density with time is at the heart of the foam self-expansion as it creates the motion of the foam. This continuum-level model uses an homogenized description of foam, which does not include the gas explicitly. Results from the model are compared to temperature-instrumented flow visualization experiments giving the location of the foam front as a function of time for our EFAR model system.


Journal of Rheology | 1986

Concentration Effects on Averaged Transport Coefficients for Polymer Solutions in Narrow Pores

Douglas Brian Adolf; Matthew Tirrell

A phenomenological model describing the effects of non‐infinitely dilute polymer concentrations on average transport coefficients for polymer solutions in narrow pores is developed using gradient theory applied to transport processes. Average viscosities and diffusion coefficients are calculated and fit to experimental rheological data using the one adjustable parameter of the model. The concentration dependence of this parameter is examined and found to be in agreement with intuition and existing theories.


Archive | 2011

Packaging Strategies for Printed Circuit Board Components Volume I: Materials & Thermal Stresses

Michael K. Neilsen; Kevin N. Austin; Douglas Brian Adolf; Scott Wilmer Spangler; Matthew Neidigk; Robert S. Chambers

Decisions on material selections for electronics packaging can be quite complicated by the need to balance the criteria to withstand severe impacts yet survive deep thermal cycles intact. Many times, material choices are based on historical precedence perhaps ignorant of whether those initial choices were carefully investigated or whether the requirements on the new component match those of previous units. The goal of this program focuses on developing both increased intuition for generic packaging guidelines and computational methodologies for optimizing packaging in specific components. Initial efforts centered on characterization of classes of materials common to packaging strategies and computational analyses of stresses generated during thermal cycling to identify strengths and weaknesses of various material choices. Future studies will analyze the same example problems incorporating the effects of curing stresses as needed and analyzing dynamic loadings to compare trends with the quasi-static conclusions.


Archive | 2007

Materials-Based Process Tolerances for Neutron Generator Encapsulation

Ryan S. Berry; Douglas Brian Adolf; Mark E. Stavig

Variations in the neutron generator encapsulation process can affect functionality. However, instead of following the historical path in which the effects of process variations are assessed directly through functional tests, this study examines how material properties key to generator functionality correlate with process variations. The results of this type of investigation will be applicable to all generators and can provide insight on the most profitable paths to process and material improvements. Surprisingly, the results at this point imply that the process is quite robust, and many of the current process tolerances are perhaps overly restrictive. The good news lies in the fact that our current process ensures reproducible material properties. The bad new lies in the fact that it would be difficult to solve functional problems by changes in the process.

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Lisa Ann Mondy

Sandia National Laboratories

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Rekha Ranjana Rao

Sandia National Laboratories

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Robert S. Chambers

Sandia National Laboratories

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Anne Grillet

Eindhoven University of Technology

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Raymond O. Cote

Sandia National Laboratories

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Edward Mark Russick

Sandia National Laboratories

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Thomas A. Baer

Sandia National Laboratories

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Harry K. Moffat

Sandia National Laboratories

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