Douglas C. Trotter

Ultra compact 45 GHz CMOS compatible Germanium waveguide photodiode with low dark current

We present a compact 1.3 × 4 μm2 Germanium waveguide photodiode, integrated in a CMOS compatible silicon photonics process flow. This photodiode has a best-in-class 3 dB cutoff frequency of 45 GHz, responsivity of 0.8 A/W and dark current of 3 nA. The low intrinsic capacitance of this device may enable the elimination of transimpedance amplifiers in future optical data communication receivers, creating ultra low power consumption optical communications.

Ultralow power silicon microdisk modulators and switches

We demonstrate a 4 mum silicon microdisk modulator with a power consumption of 85 fJ/bit. The modulator utilizes a reverse-biased, vertical p-n junction to achieve 10 Gb/s data transmission with 3.5 V drive voltage, BER<10-12, and without signal pre-emphasis. High-speed silicon bandpass switches are constructed from pairs of modulators.

Vertical junction silicon microdisk modulators and switches

Vertical junction resonant microdisk modulators and switches have been demonstrated with exceptionally low power consumption, low-voltage operation, high-speed, and compact size. This paper reviews the progress of vertical junction microdisk modulators, provides detailed design data, and compares vertical junction performance to lateral junction performance. The use of a vertical junction maximizes the overlap of the depletion region with the optical mode thereby minimizing both the drive voltage and power consumption of a depletion-mode modulator. Further, the vertical junction enables contact to be made from the interior of the resonator and therein a hard outer wall to be formed that minimizes radiation in small diameter resonators, further reducing the capacitance and drive power of the modulator. Initial simple vertical junction modulators using depletion-mode operation demonstrated the first sub-100 fJ/bit silicon modulators. With more intricate doping schemes and through the use of AC-coupled drive signals, 3.5 μm diameter vertical junction microdisk modulators have recently achieved a communications efficiency of 3 fJ/bit, making these modulators the smallest and lowest power modulators demonstrated to date, in any material system. Additionally, the demonstration was performed at 12.5 Gb/s, required a peak-to-peak signal level of only 1 V, and achieved bit-error-rates below 10(-12) without requiring signal pre-emphasis. As an additional benefit to the use of interior contacts, higher-order active filters can be constructed from multiple vertical-junction modulators without interference of the electrodes. Doing so, we demonstrated second-order active high-speed bandpass switches with ~2.5 ns switching speeds, and power penalties of only 0.4 dB. Through the use of vertical junctions in resonant modulators, we have achieved the lowest power consumption, lowest voltage, and smallest silicon modulators demonstrated to date.

Low-Voltage, Compact, Depletion-Mode, Silicon Mach–Zehnder Modulator

Through rigorous process, electrical, and optical simulations, we develop a new silicon depletion-mode vertical p-n junction phase-modulator implemented in Mach-Zehnder modulator configuration, enabling an ultralow measured V ¿ L of only ~ 1 V·cm. Further, in a 500-¿m-long lumped element device, we demonstrate a 10-Gb/s nonreturn-to-zero data transmission with wide-open complementary output eye diagrams without the use of signal preemphasis.

Silicon photonics manufacturing.

Most demonstrations in silicon photonics are done with single devices that are targeted for use in future systems. One of the costs of operating multiple devices concurrently on a chip in a system application is the power needed to properly space resonant device frequencies on a systems frequency grid. We asses this power requirement by quantifying the source and impact of process induced resonant frequency variation for microdisk resonators across individual die, entire wafers and wafer lots for separate process runs. Additionally we introduce a new technique, utilizing the Transverse Electric (TE) and Transverse Magnetic (TM) modes in microdisks, to extract thickness and width variations across wafers and dice. Through our analysis we find that a standard six inch Silicon on Insulator (SOI) 0.35 μm process controls microdisk resonant frequencies for the TE fundamental resonances to within 1 THz across a wafer and 105 GHz within a single die. Based on demonstrated thermal tuner technology, a stable manufacturing process exhibiting this level of variation can limit the resonance trimming power per resonant device to 231 μW. Taken in conjunction with the power to compensate for thermal environmental variations, the expected power requirement to compensate for fabrication-induced non-uniformities is 17% of that total. This leads to the prediction that thermal tuning efficiency is likely to have the most dominant impact on the overall power budget of silicon photonics resonator technology.

Adiabatic Resonant Microrings (ARMs) with directly integrated thermal microphotonics

A new class of microphotonic-resonators, Adiabatic Resonant Microrings (ARMs), is introduced. The ARM resonator geometry enables heater elements to be formed within the resonator, simultaneously enabling record low-power (4.4 W/GHz) and record high-speed (1µs) thermal tuning.

Adiabatic thermo-optic Mach–Zehnder switch

In this Letter, we propose and demonstrate a high-speed and power-efficient thermo-optic switch using an adiabatic bend with a directly integrated silicon heater to minimize the heat capacity and therein maximize the performance of the thermo-optic switch. A rapid, τ=2.4 μs thermal time constant and a low electrical power consumption of P(π)=12.7 mW/π-phase shift were demonstrated representing a P(π)τ product of only 30.5 mW·μs in a compact device with a phase shifter of only ~10 μm long.

Control of integrated micro-resonator wavelength via balanced homodyne locking

We describe and experimentally demonstrate a method for active control of resonant modulators and filters in an integrated photonics platform. Variations in resonance frequency due to manufacturing processes and thermal fluctuations are corrected by way of balanced homodyne locking. The method is compact, insensitive to intensity fluctuations, minimally disturbs the micro-resonator, and does not require an arbitrary reference to lock. We demonstrate long-term stable locking of an integrated filter to a laser swept over 1.25 THz. In addition, we show locking of a modulator with low bit error rate while the chip temperature is varied from 5 to 60° C.

Ultra-low crosstalk, CMOS compatible waveguide crossings for densely integrated photonic interconnection networks.

We explore the design space for optimizing CMOS compatible waveguide crossings on a silicon photonics platform. This paper presents simulated and experimental excess loss and crosstalk suppression data for vertically integrated silicon nitride over silicon-on-insulator waveguide crossings. Experimental results show crosstalk suppression exceeding -49/-44 dB with simulation results as low as -65/-60 dB for the TE/TM mode in a waveguide crossing with a 410 nm vertical gap.

Electronically controlled optical beam-steering by an active phased array of metallic nanoantennas

An optical phased array of nanoantenna fabricated in a CMOS compatible silicon photonics process is presented. The optical phased array is fed by low loss silicon waveguides with integrated ohmic thermo-optic phase shifters capable of 2π phase shift with ∼ 15 mW of applied electrical power. By controlling the electrical power to the individual integrated phase shifters fixed wavelength steering of the beam emitted normal to the surface of the wafer of 8° is demonstrated for 1 × 8 phased arrays with periods of both 6 and 9 μm.