Duan Huantao

60Co γ-rays irradiation effect in DC performance of AlGaN/GaN high electron mobility transistors

Unpassivated/passivated AlGaN/GaN high electron mobility transistors (HEMTs) were exposed to 1.25 MeV 60Co γ-rays at a dose of 1 Mrad(Si). The saturation drain current of the unpassivated devices decreased by 15% at 1 Mrad γ-dose, and the maximal transconductance decreased by 9.1% under the same condition; moreover, either forward or reverse gate bias current was significantly increased, while the threshold voltage is relatively unaffected. By sharp contrast, the passivated devices showed scarcely any change in saturation drain current and maximal transconductance at the same γ dose. Based on the differences between the passivated HEMTs and unpassivated HEMTs, adding the C–V measurement results, the obviously parameter degradation of the unpassivated AlGaN/GaN HEMTs is believed to be caused by the creation of electronegative surface state charges in source–gate spacer and gate–drain spacer at the low dose (1 Mrad). These results reveal that the passivation is effective in reducing the effects of surface state charges induced by the 60Co γ-rays irradiation, so the passivation is an effective reinforced approach.

Stress, structural and electrical properties of Si-doped GaN film grown by MOCVD ∗

The stresses, structural and electrical properties of n-type Si-doped GaN films grown by metalorganic chemical vapor deposition (MOCVD) are systemically studied. It is suggested that the main stress relaxation is induced by bending dislocations in low doping samples. But for higher doping samples, as the Si doping concentration increases, the in-plane stresses in the grown films are quickly relaxed due to the rapid increase of the edge dislocation densities. Hall effect measurements reveal that the carrier mobility first increases rapidly and then decreases with increasing Si doping concentration. This phenomenon is attributed to the interaction between various scattering process. It is suggested that the dominant scattering process is defect scattering for low doping samples and ionized impurity scattering for high doping samples.

Effect of nucleation layer morphology on crystal quality, surface morphology and electrical properties of AlGaN/GaN heterostructures

Nucleation layer formation is a key factor for high quality gallium nitride (GaN) growth on a sapphire substrate. We found that the growth rate substantially affected the nucleation layer morphology, thereby having a great impact on the crystal quality, surface morphology and electrical properties of AlGaN/GaN heterostructures on sapphire substrates. A nucleation layer with a low growth rate of 2.5 nm/min is larger and has better coalescence than one grown at a high growth rate of 5 nm/min. AlGaN/GaN heterostructures on a nucleation layer with low growth rate have better crystal quality, surface morphology and electrical properties.

Effect of a high temperature AlN buffer layer grown by initially alternating supply of ammonia on AlGaN/GaN heterostuctures ∗

The effect of a high temperature AlN buffer layer grown by the initially alternating supply of ammonia (IASA) method on AlGaN/GaN heterostructures was studied. The use of AlN by the IASA method can effectively increase the crystalline quality and surface morphology of GaN. The mobility and concentration of 2DEG of AlGaN/GaN heterostuctures was also ameliorated.

Characterization of GaN grown on 4H-SiC and sapphire by Raman spectroscopy and high resolution XRD ∗

The crystal quality, stress and strain of GaN grown on 4H-SiC and sapphire are characterized by high resolution X-ray diffraction (HRXRD) and Raman spectroscopy. The large stress in GaN leads to the generation of a large number of dislocations. The Raman stress is determined by the results of HRXRD. The position and line shape of the A1 longitudinal optical (LO) phonon mode is used to determine the free carrier concentration and electron mobility in GaN. The differences between free carrier concentration and electron mobility in GaN grown on sapphire and 4H-SiC are analyzed.

An X-band GaN combined solid-state power amplifier

Based on a self-developed AlGaN/GaN HEMT with 2.5 mm gate width technology on a SiC substrate, an X-band GaN combined solid-state power amplifier module is fabricated. The module consists of an AlGaN/GaN HEMT, Wilkinson power couplers, DC-bias circuit and microstrip line. For each amplifier, we use a bipolar DC power source. Special RC networks at the input and output and a resistor between the DC power source and the gate of the transistor at the input are used for cancellation of self-oscillation and crosstalk of low-frequency of each amplifier. At the same time, branches of length 3λ/4 for Wilkinson power couplers are designed for the elimination of self-oscillation of the two amplifiers. Microstrip stub lines are used for input matching and output matching. Under Vds = 27 V, Vgs = –4.0 V, CW operating conditions at 8 GHz, the amplifier module exhibits a line gain of 5.6 dB with power added efficiency of 23.4%, and output power of 41.46 dBm (14 W), and the power gain compression is 3 dB. Between 8 and 8.5 GHz, the variation of output power is less than 1.5 dB.

The effects of vicinal sapphire substrates on the properties of AlGaN/GaN heterostructures

AlGaN/GaN heterostructures on vicinal sapphire substrates and just-oriented sapphire substrates (0001) are grown by the metalorganic chemical vapor deposition method. Samples are studied by high-resolution x-ray diffraction, atomic force microscopy, capacitance–voltage measurement and the Van der Pauw Hall-effect technique. The investigation reveals that better crystal quality and surface morphology of the sample are obtained on the vicinal substrate. Furthermore, the electrical properties are also improved when the sample is grown on the vicinal substrate. This is due to the fact that the use of vicinal substrate can promote the step-flow mode of crystal growth, so many macro-steps are formed during crystal growth, which causes a reduction of threading dislocations in the crystal and an improvement in the electrical properties of the AlGaN/GaN heterostructure.

Surface morphology of [112̄0] a-plane GaN growth by MOCVD on [11̄02] r-plane sapphire

Nonpolar a-plane [110] GaN has been grown on r-plane [102] sapphire by MOCVD, and investigated by high resolution X-ray diffraction and atomic force microscopy. As opposed to the c-direction, this particular orientation is non-polar, and it avoids polarization charge, the associated screening charge and the consequent band bending. Both low-temperature GaN buffer and high-temperature AlN buffer are used for a-plane GaN growth on r-plane sapphire, and the triangular pits and pleat morphology come forth with different buffers, the possible reasons for which are discussed. The triangular and pleat direction are also investigated. A novel modulate buffer is used for a-plane GaN growth on r-plane sapphire, and with this technique, the crystal quality has been greatly improved.