Gu Wenping

60Co γ-rays irradiation effect in DC performance of AlGaN/GaN high electron mobility transistors

Unpassivated/passivated AlGaN/GaN high electron mobility transistors (HEMTs) were exposed to 1.25 MeV 60Co γ-rays at a dose of 1 Mrad(Si). The saturation drain current of the unpassivated devices decreased by 15% at 1 Mrad γ-dose, and the maximal transconductance decreased by 9.1% under the same condition; moreover, either forward or reverse gate bias current was significantly increased, while the threshold voltage is relatively unaffected. By sharp contrast, the passivated devices showed scarcely any change in saturation drain current and maximal transconductance at the same γ dose. Based on the differences between the passivated HEMTs and unpassivated HEMTs, adding the C–V measurement results, the obviously parameter degradation of the unpassivated AlGaN/GaN HEMTs is believed to be caused by the creation of electronegative surface state charges in source–gate spacer and gate–drain spacer at the low dose (1 Mrad). These results reveal that the passivation is effective in reducing the effects of surface state charges induced by the 60Co γ-rays irradiation, so the passivation is an effective reinforced approach.

The effects of proton irradiation on the electrical properties of NbAlO/AlGaN/GaN MIS-HEMT

AlGaN/GaN metal-insulator-semiconductor high electron-mobility transistors (MIS-HEMTs) with atomic layer deposited (ALD) NbAlO gate dielectric were investigated using 3 MeV proton irradiation at a fluence of 1015 p/cm2. It was found that the proton irradiation damage caused degradation in DC performance and a flatband voltage shift in the capacitance-voltage curve. Gate-drain conductance measurements indicated that new traps were introduced in GaN from the irradiation, and the trap densities increased from 1.18×1012 cm−2·eV−1 to 1.82×1012 cm−2·eV-1 in MIS-HEMTs after irradiation. However, these increases in trap densities caused by irradiation in MIS-HEMT are less than those in HEMT, which can be attributed to the protection of the AlGaN surface by the NbAlO dielectric layer.

Characterization of GaN grown on 4H-SiC and sapphire by Raman spectroscopy and high resolution XRD ∗

The crystal quality, stress and strain of GaN grown on 4H-SiC and sapphire are characterized by high resolution X-ray diffraction (HRXRD) and Raman spectroscopy. The large stress in GaN leads to the generation of a large number of dislocations. The Raman stress is determined by the results of HRXRD. The position and line shape of the A1 longitudinal optical (LO) phonon mode is used to determine the free carrier concentration and electron mobility in GaN. The differences between free carrier concentration and electron mobility in GaN grown on sapphire and 4H-SiC are analyzed.

An X-band four-way combined GaN solid-state power amplifier

An X-band four-way combined GaN solid-state power amplifier module is fabricated based on a self-developed AlGaN/GaN HEMT with 2.5-mm gate width technology on SiC substrate. The module consists of an AlGaN/GaN HEMT, Wilkinson power hybrids, a DC-bias circuit and microstrip matching circuits. For the stability of the amplifier module, special RC networks at the input and output, a resistor between the DC power supply and a transistor gate at the input and 3λ/4 Wilkinson power hybrids are used for the cancellation of low frequency self-oscillation and crosstalk of each amplifier. Under Vds = 27 V, Vgs = −4.0 V, CW operating conditions at 8 GHz, the amplifier module exhibits a line gain of 5 dB with a power added efficiency of 17.9%, and an output power of 42.93 dBm; the power gain compression is 2 dB. For a four-way combined solid-state amplifier, the power combining efficiency is 67.5%. It is concluded that the reduction in combining efficiency results from the non-identical GaN HMET, the loss of the hybrid coupler and the circuit fabricating errors of each one-way amplifier.

Structural and optical investigation of nonpolar a-plane GaN grown by metal?organic chemical vapour deposition on r-plane sapphire by neutron irradiation

Nonpolar (112?0) a-plane GaN films are grown by metal?organic chemical vapour deposition (MOCVD) on r-plane (11?02) sapphire. The samples are irradiated with neutrons under a dose of 1 ? 1015 cm?2. The surface morphology, the crystal defects and the optical properties of the samples before and after irradiation are analysed using atomic force microscopy (AFM), high resolution X-ray diffraction (HRXRD) and photoluminescence (PL). The AFM result shows deteriorated sample surface after the irradiation. Careful fitting of the XRD rocking curve is carried out to obtain the Lorentzian weight fraction. Broadening due to Lorentzian type is more obvious in the as-grown sample compared with that of the irradiated sample, indicating that more point defects appear in the irradiated sample. The variations of line width and intensity of the PL band edge emission peak are consistent with the XRD results. The activation energy decreases from 82.5 meV to 29.9 meV after irradiation by neutron.

Influence of dislocations in the GaN layer on the electrical properties of an AlGaN/GaN heterostructure

This paper reports on a comparative study of the spatial distributions of the electrical, optical, and structural properties in an AlGaN/GaN heterostructure. Edge dislocation density in the GaN template layer is shown to decrease in the regions of the wafer where the heterostructure sheet resistance increases and the GaN photoluminescence band-edge energy peak shifts to a high wavelength. This phenomenon is found to be attributed to the local compressive strain surrounding edge dislocation, which will generate a local piezoelectric polarization field in the GaN layer in the opposite direction to the piezoelectric polarization field in the AlGaN layer and thus help to increase the two-dimensional electron gas concentration.