E. É. Glikman

Kinetics and mechanism of copper fracture due to deformation in surface-active baths

AbstractThe general kinetic characteristics of copper fracture in the presence of surface-active bismuth-lead baths during creep and elongation under tension are explained. It is shown that the subcritical stage of crack development controls the process, whereupon the effects of stresses σ, temperature, strain rate

Kinetics and mechanism of copper fracture due to deformation in surface-active baths: 2. Mechanism of subcritical crack development

\dot \varepsilon

Intergrain impurity adsorption and cold brittleness of fcc Cu-Sb and Cu-Sb-B solid solutions

, surface energy at the copper-bath interface γSL, and surface energy at the grain boundaries γb on the rate of crack development ∂l/∂τ are analyzed. The basic conclusions are that: a)∂l/∂τ=α(σ−Δ) (α andΔ being constants here); b) the crack development activating energy

Effects of intercrystallite impurity adsorption on the brittleness of a metal in a liquid

E = - \frac{{\partial 1n \alpha }}{{\partial (1/T)}} \simeq 0.4eF;c

The kinetics of failure of copper in the presence of liquid bismuth with a chemically active addition of Sb

) the reduction of energy γb, achieved by intergranular internal adsorption of 0.5% antimony, lowers the value ofα about 50 times; d) a 30% increase in surface energy γSL reduces the cracking rate 30 times, according to the relation