Yu. V. Goryunov

Kinetics and mechanism of copper fracture due to deformation in surface-active baths

AbstractThe general kinetic characteristics of copper fracture in the presence of surface-active bismuth-lead baths during creep and elongation under tension are explained. It is shown that the subcritical stage of crack development controls the process, whereupon the effects of stresses σ, temperature, strain rate

Kinetics and mechanism of copper fracture due to deformation in surface-active baths: 2. Mechanism of subcritical crack development

\dot \varepsilon

Effect of strengthening the surface layer on the embrittlement of single crystals of zinc by mercury and gallium

, surface energy at the copper-bath interface γSL, and surface energy at the grain boundaries γb on the rate of crack development ∂l/∂τ are analyzed. The basic conclusions are that: a)∂l/∂τ=α(σ−Δ) (α andΔ being constants here); b) the crack development activating energy

Effect of metals dissolved in mercury upon the adsorption-induced reduction of strength of zinc

E = - \frac{{\partial 1n \alpha }}{{\partial (1/T)}} \simeq 0.4eF;c

Mechanism of embrittlement by liquid metals and other manifestations of the Rebinder effect in metal systems

) the reduction of energy γb, achieved by intergranular internal adsorption of 0.5% antimony, lowers the value ofα about 50 times; d) a 30% increase in surface energy γSL reduces the cracking rate 30 times, according to the relation