E. T. Croke

Thermal conductivity of Si/SiGe and SiGe/SiGe superlattices

The cross-plane thermal conductivity of four Si/Si0.7Ge0.3 superlattices and three Si0.84Ge0.16/Si0.76Ge0.24 superlattices, with periods ranging from 45 to 300 and from 100 to 200 A, respectively, were measured over a temperature range of 50 to 320 K. For the Si/Si0.7Ge0.3 superlattices, the thermal conductivity was found to decrease with a decrease in period thickness and, at a period thickness of 45 A, it approached the alloy limit. For the Si0.84Ge0.16/Si0.76Ge0.24 samples, no dependence on period thickness was found and all the data collapsed to the alloy value, indicating the dominance of alloy scattering. This difference in thermal conductivity behavior between the two superlattices was attributed to interfacial acoustic impedance mismatch, which is much larger for Si/Si0.7Ge0.3 than for Si0.84Ge0.16/Si0.76Ge0.24. The thermal conductivity increased slightly up to about 200 K, but was relatively independent of temperature from 200 to 320 K.

SiGeC/Si superlattice microcoolers

Monolithically integrated active cooling is an attractive way for thermal management and temperature stabilization of microelectronic and optoelectronic devices. SiGeC can be lattice matched to Si and is a promising material for integrated coolers. SiGeC/Si superlattice structures were grown on Si substrates by molecular beam epitaxy. Thermal conductivity was measured by the 3omega method. SiGeC/Si superlattice microcoolers with dimensions as small as 40×40 µm^2 were fabricated and characterized. Cooling by as much as 2.8 and 6.9 K was measured at 25 °C and 100 °C, respectively, corresponding to maximum spot cooling power densities on the order of 1000 W/cm^2.

Epitaxial silicon grown on CeO2/Si(111) structure by molecular beam epitaxy

Using electron beam evaporation, a Si/CeO2/Si(111) structure has been grown in a molecular beam epitaxy machine. In situ low energy electron diffraction, cross sectional transmission electron microscopy, selected area diffraction, and atomic force microscopy have been used to structurally characterize the overlying silicon layer and show it to be single crystalline and epitaxially oriented. Rutherford backscattering and energy dispersive x-ray analysis have been used to confirm the presence of a continuous 23 A CeO2 layer at the interface. Rutherford backscattering and x-ray photoemission spectroscopy show an additional presence of cerium both at the exposed silicon surface and incorporated in low levels (~ 1%) within the silicon film, suggesting a growth mechanism with cerium riding atop the silicon growth front leaving behind small amounts of cerium incorporated in the growing silicon crystal.

On-chip high speed localized cooling using superlattice microrefrigerators

In this paper, we addressed heating problems in integrated circuits (ICs) and proposed a thin-film thermionic cooling solution using Si/SiGe superlattice microrefrigerators. We compared our technology with the current most common solution, thermoelectric coolers, by strengthening the advantages of its compatible fabrication process as ICs for easy integration, small footprint in the order of ~ 100times100 mum2, high cooling power density, 600W/cm2 and fast transient response less than 40 mus. The thermoreflectance imaging also demonstrated its localized cooling. All these features combined together to make these microrefrigerators a very promising application for on-chip temperature control, removing hot spots inside IC

Pauli spin blockade in undoped Si/SiGe two-electron double quantum dots

We demonstrate double quantum dots fabricated in undoped Si/SiGe heterostructures relying on a double top-gated design. Charge sensing shows that we can reliably deplete these devices to zero charge occupancy. Measurements and simulations confirm that the energetics are determined by the gate-induced electrostatic potentials. Pauli spin blockade has been observed via transport through the double dot in the two electron configuration, a critical step in performing coherent spin manipulations in Si.

Measurement of the valence‐band offset in strained Si/Ge (100) heterojunctions by x‐ray photoelectron spectroscopy

We have used x‐ray photoelectron spectroscopy to measure the valence‐band offset in situ for strained Si/Ge (100) heterojunctions grown by molecular beam epitaxy. Si 2p and Ge 3d core level to valence‐band‐edge binding energies and Si 2p to Ge 3d core level energy separations were measured as functions of strain, and strain configurations in all samples were determined using x‐ray diffraction. Our measurements yield valence‐band offset values of 0.83±0.11 eV and 0.22±0.13 eV for Ge on Si (100) and Si on Ge (100), respectively. If we assume that the offset between the weighted averages of the light hole, heavy hole, and spin‐orbit valence bands in Si and Ge is independent of strain, we obtain a discontinuity in the average valence‐band edge of 0.49±0.13 eV.

Fabrication and characterization of electrostatic Si∕SiGe quantum dots with an integrated read-out channel

A nontraditional fabrication technique is used to produce quantum dots with read-out channels in silicon/silicon–germanium two-dimensional electron gases. The technique utilizes Schottky gates, placed on the sides of a shallow etched quantum dot, to control the electronic transport process. An adjacent quantum point contact gate is integrated to the side gates to define a read-out channel, and thus allow for noninvasive detection of the electronic occupation of the quantum dot. Reproducible and stable Coulomb oscillations and the corresponding jumps in the read-out channel resistance are observed at low temperatures. The fabricated dot combined with the read-out channel represents a step toward the spin-based quantum bit in Si∕SiGe heterostructures.

Measurement of valley splitting in high-symmetry Si/SiGe quantum dots

We have demonstrated few-electron quantum dots in Si/SiGe and InGaAs, with occupation number controllable from N = 0. These display a high degree of spatial symmetry and identifiable shell structure. Magnetospectroscopy measurements show that two Si-based devices possess a singlet N =2 ground state at low magnetic field and therefore the two-fold valley degeneracy is lifted. The valley splittings in these two devices were 120 and 270 {\mu}eV, suggesting the presence of atomically sharp interfaces in our heterostructures.

Measurement of the valence band offset in novel heterojunction systems: Si/Ge (100) and AlSb/ZnTe (100)

We have used x-ray photoelectron spectroscopy to measure the valence band offset in situ for strained Si/Ge (100) heterojunctions and for AlSb/ZnTe (100) heterojunctions grown by molecular-beam epitaxy. For the Si/Ge system, Si 2p and Ge 3d core level to valence band edge binding energies and Si 2p to Ge 3d core level energy separations were measured as functions of strain, and strain configurations in all samples were determined using x-ray diffraction. Our measurements yield valence band offset values of 0.83±0.11 eV and 0.22±0.13 eV for Ge on Si (100) and Si on Ge (100), respectively. If we assume that the offset between the weighted averages of the light-hole, heavy-hole, and spin-orbit valence bands in Si and Ge is independent of strain, we obtain a discontinuity in the average valence band edge of 0.49±0.13 eV. For the AlSb/ZnTe (100) heterojunction system, we obtain a value of –0.42±0.07 eV for the valence band offset. Our data also suggest that an intermediate compound, containing Al and Te, is formed at the AlSb/ZnTe (100) interface.

Strain relaxation kinetics in Si1–xGex/Si heterostructures

Strain relaxation in Si1–xGex/Si superlattices and alloy films is studied as a function of ex situ anneal treatment with the use of x-ray diffraction and Raman spectroscopy. Samples are grown by molecular-beam epitaxy at an unusually low temperature (≈365 °C). This results in metastably strained alloy and superlattice films significantly in excess of critical thicknesses previously reported for such structures. Significant strain relaxation is observed upon anneal at temperatures as low as 390 °C. After a 700 °C, 2 h anneal, superlattices are observed to relax less fully (~43% of coherent strain) than corresponding alloys (~84% of coherent strain). Also, the strain relaxation kinetics of a Si1–xGex alloy layer is studied quantitatively. Alloy strain relaxation is approximately described by a single, thermally activated, first order kinetic process having activation energy Ea=2.0 eV. The relevance of our results to the microscopic mechanisms responsible for strain relaxation in lattice-mismatched semiconductor heterostructures is discussed.