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Eduard Knauer

Infineon Technologies

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Publication

Featured researches published by Eduard Knauer.

Archive | 2007

Semiconductor device with a semiconductor chip stack and plastic housing, and methods for producing the same

Joachim Mahler; Stefan Landau; Eduard Knauer; Khalil Hosseini; Manfred Mengel

Archive | 2005

Semiconductor unit comprises a circuit carrier with interior contact areas, a semiconductor chip with an active surface and flipside and bonding wire connections between chip contact areas and interior contact areas of the circuit carrier

Khalil Hosseini; Eduard Knauer; Joachim Mahler; Peter Mederer; Konrad Rösl

Archive | 2016

Encapsulated electronic chip device with mounting provision and externally accessible electric connection structure

Angela Kessler; Eduard Knauer; Rudolf Lehner; Wolfgang Schober; Sigrid Schultes

Archive | 2007

SEMICONDUCTOR DEVICE WITH CONDUCTIVE DIE ATTACH MATERIAL

Joachim Mahler; Thomas Behrens; Stefan Landau; Eduard Knauer; Rupert Fischer

Archive | 2016

Verkapselte elektronische Chipvorrichtung mit Befestigungseinrichtung und von außen zugänglicher elektrischer Verbindungsstruktur

Eduard Knauer; Sigrid Schultes; Angela Kessler; Wolfgang Schober; Rudolf Lehner

Archive | 2014

Encapsulated electronic chip device mounting means, and externally accessible electrical connection structure

Eduard Knauer; Sigrid Schultes; Angela Kessler; Wolfgang Schober; Rudolf Lehner

Archive | 2009

Halbleiterbauelement mit leitendem Die-Attach-Material

Joachim Mahler; Thomas Behrens; Stefan Landau; Eduard Knauer; Rupert Fischer

Archive | 2008

Halbleiterbauelement mit leitendem Die-Attach-Material Semiconductor device with conductive die attach material

Thomas Behrens; Rupert Fischer; Eduard Knauer; Stefan Landau; Joachim Mahler

Archive | 2008

A semiconductor device comprising a conductive die attach material

Thomas Behrens; Rupert Fischer; Eduard Knauer; Stefan Landau; Joachim Mahler

Archive | 2006

Semiconductor component, has plastic compound arranged between another plastic compound and edge sides of adhesive layer and chip and upper side of chip such that latter plastic compound does not have physical contact to chip and layer

Khalil Hosseini; Eduard Knauer; Stefan Landau; Joachim Mahler; Manfred Mengel

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Collaboration

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Joachim Mahler

Infineon Technologies

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Khalil Hosseini

Infineon Technologies

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Stefan Landau

Infineon Technologies

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Konrad Rösl

Infineon Technologies

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Peter Mederer

Infineon Technologies

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Rupert Fischer

Infineon Technologies

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Thomas Behrens

Infineon Technologies

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Angela Kessler

Infineon Technologies

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Manfred Mengel

Infineon Technologies

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Rudolf Lehner

Infineon Technologies

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