Ei Uchida
MITSUBISHI MATERIALS CORPORATION
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Publication
Featured researches published by Ei Uchida.
International Journal of Adhesion and Adhesives | 2003
Yoshiyuki Ikeda; Hidemi Nawafune; Shozo Mizumoto; Muneo Sasaki; Asahiro Nagatani; Akihito Nishimori; Koichi Yamaguchi; Ei Uchida; Takashi Okada
Abstract Some spectroscopic analyses were carried out on the adhesive interface layers formed by cure-adhesion of natural rubber to electroless Pd and/or Pd–P alloys. The transmission electron microscopy revealed some clear images of the adhesion layer just at the interface between rubber and electroless-plating films of Pd and/or Pd–P alloys. The content ratio of Pd/S analyzed by energy dispersive X-ray spectroscopy changed gradually along the depth at the rubber–metal interface layer for Pd alloy, but was kept almost constant irrespective of depth for Pd–P alloy.
Archive | 1987
Masaki Haga; Kiyotaka Tsuji; Hidemi Nawafune; Shozo Mizumoto; Ei Uchida
Archive | 2004
Akihiro Masuda; Masayoshi Kohinata; Keigo Obata; Masakazu Yoshimoto; Kiyotaka Tsuji; Ei Uchida; Keiji Ori; Masahiro Eikawa
Archive | 2002
Keigo Obata; Masakazu Yoshimoto; Kiyotaka Tsuji; Ei Uchida
Archive | 2001
Ei Uchida; Takashi Okada
Archive | 1992
Masaki Haga; Ei Uchida; Hidemi Nawafune; Shozo Mizumoto
Journal of The Surface Finishing Society of Japan | 2003
Hidemi Nawafune; Shingo Higuchi; Kensuke Akamatsu; Ei Uchida
Archive | 2016
内田 衛; Ei Uchida; 田中 薫; Kaoru Tanaka; 雄也 田中; Yuya Tanaka
Journal of The Surface Finishing Society of Japan | 2014
Ei Uchida; Kaoru Tanaka; Ai Kawabata; Shota Nabeshima; Takaaki Tsuruoka; Kennsuke Akamatsu; Hidemi Nawafune
Journal of Japan Institute of Electronics Packaging | 2003
Hidemi Nawafune; Toshio Nakatani; Kensuke Akamatsu; Ei Uchida; Keigo Obata
