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Dive into the research topics where Emmanuel Grard is active.

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Featured researches published by Emmanuel Grard.


electronic components and technology conference | 2001

SOA-based optical network components

M. Renaud; D. Keller; N. Sahri; S. Silvestre; D. Prieto; Francois Dorgeuille; F. Pommereau; Jean-Yves Emery; Emmanuel Grard; H.P. Mayer

SOA-based devices provide a family of key components for optical networks, including wavelength conversion, regeneration, space switching and wavelength selection. All these functions require integration of multiple SOAs that calls for efficient combination of monolithic and hybrid integration to reach performances and cost effective solutions. Several examples are presented and discussed.


electronic components and technology conference | 1998

High performance packaging technique used for clamped gain semiconductor optical amplifier array modules fabrication

Emmanuel Grard; J. Le Bris; M. Di Maggio; Francois Dorgeuille; J.-Y. Emery; P. Bonno; M. Renaud

In this paper, we present a high performance, versatile multifibre pigtailing technique adapted to tilted semiconductor optical amplifier arrays. Dynamic alignment of collectively processed tilted lensed ribbon fibre and YAG laser welding assembly are used for pigtailing of 4 clamped gain semiconductor optical amplifier array. The collective process makes this packaging technique attractive for array components. This paper describes the technology used and summarizes main results obtained on fabricated modules.


electronic components and technology conference | 2000

Low-cost laser modules for SMT

W. Rehm; K. Adam; A. Goth; W. Jorg; J. Lauckner; J. Scherb; P. Aribaud; C. Artigue; C. Duchemin; B. Fernier; Emmanuel Grard; D. Keller; S. Kerboeuf; S. Rabaron; J.M. Rainsant; D. Tregoat; J.L. Nicque; A. Tournereau; P.J. Laroulandie; P. Berthier

A passive assembly process for laser modules has been developed that is based on silicon submounts with 3-dimensional structures and corresponding laser chips. It makes use of surface tension effects to pull the chips into their final position defined by mechanical stops and stand-offs. Full singlemode compatible accuracy is achieved. A prefabricated plastic housing with an integrated optical connector completes the concept. Due to the eliminated fixed fiber pigtail and the materials that are used all elements are compatible with automated surface mounting (SMT) into the system electronics. All these details contribute to the low cost technology for high performance laser modules. Although active cooling is not provided laser modules are capable of 2.5 mW emission for environmental temperatures as high as 85/spl deg/C. The concept is open for other applications like receivers and more complex integrated devices.


optical fiber communication conference | 1998

Plastic encapsulated 1.3-/spl mu/m laser on Si substrate for long-haul transmission

C. Artigue; S. Rabaron; D. Toullier; A. Lestra; D. Tregoat; J.-L. Lafragette; Emmanuel Grard; B. Fernier; W. Jorg; J. Scherb; G. Seibold; A. Goth

Summary form only given. This paper reports 1.3-/spl mu/m laser passively aligned with a cleaved single-mode fiber and encapsulated with silicone rubber on a Si substrate. Under 70-mA DC operation at 85/spl deg/C, a fiber power >2 mW is obtained for several assemblies. This result is thought to be the highest value reported so far for such type of device. It shows that these advanced technologies are promising for long-haul transmission.


Optical Amplifiers and Their Applications (1997), paper SD2 | 1997

High Performance 1.55 µm 4 Clamped Gain Semiconductor Optical Amplifier Array Module For Photonic Switching Applications

J-Y. Emery; M. Di Maggio; M. Bachmann; J. Le Bris; F. Pommereau; R. Ngo; C. Fortin; Francois Dorgeuille; Emmanuel Grard; M. Renaud; G. Laube

We report on the first Clamped Gain semiconductor optical amplifier array module. The optical gain and the output saturation power are respectively 13.2 ± 1dB and 10 dBm.


Laser Diodes and LEDs in Industrial, Measurement, Imaging, and Sensors Applications II; Testing, Packaging, and Reliability of Semiconductor Lasers V | 2000

Tolerant low-loss three-lens coupling system for 1.48-μm unstable-cavity lasers

Francois Boubal; Sylvie Delepine; Paul Salet; F. Gerard; David Cornec; Michel Di Maggio; M. Goix; Jean-Pierre Chardon; Emmanuel Grard

A 1.48-micrometer unstable-cavity laser is coupled into a single-mode fiber using three microlenses. Reproducible coupling of very high power is demonstrated with different types of lenses (plano-convex or bi-convex, with different apertures). Over 550 mW in single-mode fiber were reproducibly reached; to our knowledge, it is the highest power coupled into a single-mode fiber from a single semiconductor laser at this wavelength. Tolerance measurements on all of the coupling elements of a three-lens system are reported for the first time; an unexpected very large tolerance on the axial displacement of the second lens was measured. Results and interpretation with the aid of Gaussian and aberration simulations are also presented. Finally, we report on the first realization of a module with 46% chip to fiber coupling efficiency.


Archive | 1992

Method of limiting coupling losses between monomode optical fibers using a piece of multimode optical fiber

Philippe Darbon; Emmanuel Grard


Archive | 1998

Hybrid optical module including an intermediate element

Claude Artigue; Denis Tregoat; Franck Mallecot; Emmanuel Grard


Archive | 1989

Optical head with an integrated isolator for coupling a semiconductor laser to a light guide

Emmanuel Grard; Daniel Mousseaux; Jean-Luc Beylat; Jacques Auge; Jean-Jacques Guerin; Eugene Duda


Archive | 1993

Method of coupling an optical fiber to an optical component on the same substrate

Daniel Mousseaux; Gerard Gelly; Emmanuel Grard

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